公开(公告)号：US20190097107A1

公开(公告)日：2019-03-28

申请号：US16140111

申请日：2018-09-24

Applicant: NICHIA CORPORATION

Inventor： Yasuo KATO ,  Yuichi HAMADA ,  Kensaku HAMADA ,  Takanori AKAISHI

IPC: H01L33/62 ,  H01L33/36

Abstract: A light-emitting device includes a light emitting element having a pad electrode, and a metal member connected to the pad electrode via a wire. The wire has a layered structure including at least a core material containing copper as a main component, an intermediate layer containing palladium as a main component, and a surface layer containing silver as a main component. The intermediate layer is art raged between the core material and the surface layer.

公开(公告)号：US20160126435A1

公开(公告)日：2016-05-05

申请号：US14927471

申请日：2015-10-30

Applicant: NICHIA CORPORATION

Inventor： Takanori AKAISHI ,  Kensaku HAMADA ,  Saiki YAMAMOTO

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A light emitting device includes an electrically conductive member, a light emitting element, a wire, and a sealing member. The wire contains gold and silver and connects the electrically conductive member and the light emitting element. The wire includes a ball portion and a recrystallized region. The ball portion is provided on an electrode of the light emitting element. The recrystallized region is provided on the ball portion and has a length in a range of 50 μm to 90 μm. The sealing member has a lower surface and an upper surface opposite to the lower surface and covers the light emitting element and the wire so that the lower surface faces the electrically conductive member and the light emitting element and so that a distance from a top of the ball portion to the upper surface of the sealing member is 90 μm to 230 μm.

Abstract translation: 发光装置包括导电构件，发光元件，线和密封构件。 导线包含金和银并且连接导电构件和发光元件。 线包括球部分和再结晶区域。 球部设置在发光元件的电极上。 再结晶区域设置在球部上，长度为50μm〜90μm。 密封构件具有下表面和与下表面相对的上表面，并且覆盖发光元件和电线，使得下表面面向导电构件和发光元件，并且使得与顶部的距离 密封部件的上表面的球部为90μm〜230μm。

公开(公告)号：US20180240935A1

公开(公告)日：2018-08-23

申请号：US15891571

申请日：2018-02-08

Applicant: NICHIA CORPORATION

Inventor： Kensaku HAMADA

IPC: H01L33/00 ,  H01L33/62

CPC classification number: H01L33/0095 ,  B23K20/007 ,  H01L23/4855 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for manufacturing a light emitting device includes: providing a light emitting element having a pad on a top surface thereof; forming an initial ball by melting a tip of a wire inserted through a capillary; pressing the initial ball against the pad with the capillary to deform the initial ball to form a ball part, and maintaining the capillary to stay still for a prescribed time; and applying ultrasonic waves to the capillary.

公开(公告)号：US20130193460A1

公开(公告)日：2013-08-01

申请号：US13751790

申请日：2013-01-28

Applicant: NICHIA CORPORATION

Inventor： Morito KANADA ,  Kensaku HAMADA

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a plurality of light emitting elements, a plurality of lead frames, and a package. The light emitting elements are mounted on the lead frames. The package is made of resin. The package has an opening. A part of the lead frames is embedded in an inner portion of the package and another part of the lead frames is exposed on a bottom surface of the opening. A resin bottom surface on which the resin is exposed is provided on the bottom surface of the opening of the package. The package includes a wall portion projecting from the bottom surface of the opening between the light emitting elements in the opening. The light emitting elements are connected by wire that straddles the wall portion.

Abstract translation: 发光器件包括多个发光元件，多个引线框架和封装。 发光元件安装在引线框架上。 包装由树脂制成。 包装有一个开口。 引线框架的一部分嵌入在封装的内部，并且引线框架的另一部分暴露在开口的底表面上。 在封装的开口的底面上设置有露出树脂的树脂底面。 该包装包括从开口中的发光元件之间的开口的底表面突出的壁部分。 发光元件通过跨越壁部的导线连接。