公开(公告)号：US20190267529A1

公开(公告)日：2019-08-29

申请号：US16275014

申请日：2019-02-13

Applicant: NICHIA CORPORATION

Inventor： Hiroki NAKAI ,  Kensuke YAMAOKA

IPC: H01L33/64 ,  H01L33/44 ,  H01L33/38 ,  H01L33/62 ,  H01L33/60 ,  H01L33/56 ,  H01L33/50 ,  H01L27/15

Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view. A group comprising at least one of the first external connecting parts and other group comprising at least one of the first external connecting parts respectively surround adjacent ones of the exposed parts while being spaced apart from each other in the plan view.

公开(公告)号：US20220299699A1

公开(公告)日：2022-09-22

申请号：US17837823

申请日：2022-06-10

Applicant: NICHIA CORPORATION

Inventor： Kensuke YAMAOKA ,  Hiroki NAKAI

IPC: F21V8/00 ,  B29C45/14 ,  B29C45/00

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a plate-shaped light transmissive member having a first face, a second face opposite to the first face and a lateral face between the first face and the second face, the plate-shaped light transmissive member disposed so that the second face faces a light emission face of the light emitting element; a light shielding frame having an inner perimeter face surrounding the lateral face; a first light reflecting member disposed between the lateral face and the inner perimeter face so as to expose the first face of the light transmissive member; and a second light reflecting member disposed between the first light reflecting member and the substrate to cover a side face of the light emitting element.

公开(公告)号：US20220107061A1

公开(公告)日：2022-04-07

申请号：US17540571

申请日：2021-12-02

Applicant: NICHIA CORPORATION

Inventor： Kensuke YAMAOKA

IPC: F21K9/90 ,  F21S41/43 ,  F21S41/32 ,  F21S41/141

Abstract: A light-emitting device includes: a mounting board; a light-emitting element disposed on or above the mounting board; a plate-shaped light-transmissive member having: a first surface; and a second surface facing a light-emitting surface of the light-emitting element; a light-reflective member covering a lateral surface of the light-transmissive member; and a light-shielding frame on an upper surface of the light-reflective member around the light-transmissive member. The light-shielding frame has an opening. An inner perimeter of the opening is located apart from outer perimeters of the first surface and the second surface of the light-transmissive member in a top plan view. The light-reflective member is disposed between the inner perimeter of the opening and the outer perimeters of the light-transmissive member.

公开(公告)号：US20200243740A1

公开(公告)日：2020-07-30

申请号：US16848534

申请日：2020-04-14

Applicant: NICHIA CORPORATION

Inventor： Hiroki NAKAI ,  Kensuke YAMAOKA

IPC: H01L33/64 ,  H01L33/38 ,  H01L33/62 ,  H01L33/56 ,  H01L33/60 ,  H01L33/44 ,  H01L33/50 ,  H01L27/15 ,  H01L33/40 ,  H01L33/32

Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view, and at least two of the first external connecting parts being arranged between at least one set of adjacent ones of the exposed parts in the plan view. The second external connecting part is connected to the second electrode.

公开(公告)号：US20200096163A1

公开(公告)日：2020-03-26

申请号：US16582645

申请日：2019-09-25

Applicant: NICHIA CORPORATION

Inventor： Kensuke YAMAOKA

IPC: F21K9/90 ,  F21S41/43 ,  F21S41/141 ,  F21S41/32

Abstract: A method for manufacturing a light-emitting device includes: a mounting step; a light-shielding frame placement step; a light-transmissive member placement step; a light-guiding supporting member formation step; a light-guiding supporting member bonding step; and a second light-reflective member formation step.

公开(公告)号：US20190067074A1

公开(公告)日：2019-02-28

申请号：US16117214

申请日：2018-08-30

Applicant: NICHIA CORPORATION

Inventor： Kensuke YAMAOKA

IPC: H01L21/683 ,  H01L21/52 ,  H01L21/68 ,  H01L21/67 ,  H01L21/677 ,  H01L33/00

Abstract: A semiconductor device manufacturing method includes: (A) orienting an upper surface of a semiconductor element which has the upper surface and a suction surface of a collet which has a suction hole so that the upper surface of the semiconductor device and the suction surface of the collet face each other, the upper surface including a first region and a second region, the second region lying higher than the first region; (B) bringing the suction surface of the collet into contact with a part of the second region of the semiconductor element; and (C) picking up the semiconductor element using the collet while the collet sucks in air between the first region and the suction surface via the suction hole, wherein in (B), an entirety of an uppermost surface of the second region is in contact with a region of the suction surface exclusive of the suction hole.

公开(公告)号：US20230422395A1

公开(公告)日：2023-12-28

申请号：US18339983

申请日：2023-06-22

Applicant: NICHIA CORPORATION

Inventor： Kensuke YAMAOKA

IPC: H05K1/02 ,  H05K1/14 ,  H01L25/075 ,  H01L25/16

CPC classification number: H05K1/0274 ,  H05K1/144 ,  H01L25/0753 ,  H01L25/167 ,  H05K2201/10121 ,  H05K2201/2036 ,  H05K2201/2054

Abstract: A light-emitting module includes a first wiring board, a plurality of light-emitting elements disposed on or above the first wiring board, a first light-transmissive layer covering the plurality of light-emitting elements, a spacer disposed on or above the first light-transmissive layer, and a second light-transmissive layer disposed on or above the spacer. An air layer is present between the first light-transmissive layer and the second light-transmissive layer. The spacer does not overlap with at least one of the plurality of light-emitting elements in a plan view.

公开(公告)号：US20210305473A1

公开(公告)日：2021-09-30

申请号：US17211473

申请日：2021-03-24

Applicant: NICHIA CORPORATION

Inventor： Dai WAKAMATSU ,  Kimihiro MIYAMOTO ,  Kensuke YAMAOKA ,  Yoshiyuki IDE

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/64

Abstract: A light emitting device includes: a first substrate including: a first lead, and a second lead positioned apart from the first lead; a second substrate disposed on an upper face of the second lead, the second substrate including: a base, and a first conducting part disposed on an upper face of the base; a light emitting element disposed on the second substrate and electrically connected to the first conducting part; a first wire electrically connecting the first lead and the first conducting part; and a wall part straddling and covering an upper face of the first lead and an upper face of the second lead. A height of the wall part is less than a height of the second substrate.

公开(公告)号：US20210098668A1

公开(公告)日：2021-04-01

申请号：US17028614

申请日：2020-09-22

Applicant: NICHIA CORPORATION

Inventor： Kensuke YAMAOKA ,  Masaki NAGAO

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/52

Abstract: A method of manufacturing a light-emitting device includes: mounting a light-emitting element on a mounting board; placing a light-shielding frame on a sheet, the light-shielding frame defining an opening and comprising at least one narrow portion having a width that is smaller than that of another portion of the light-shielding frame in a top view; applying a light-reflective resin on at least the narrow portion of the light-shielding frame; forming a light-guiding supporting member; and bonding the second surface of a light-transmissive member of the light-guiding supporting member to an upper surface of the light-emitting element so as to fix the light-guiding supporting member on or above the light-emitting element.

公开(公告)号：US20200328328A1

公开(公告)日：2020-10-15

申请号：US16915579

申请日：2020-06-29

Applicant: NICHIA CORPORATION

Inventor： Hiroki NAKAI ,  Kensuke YAMAOKA

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/50 ,  H01L25/075 ,  H01L33/52

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face that is larger than the upper face, disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light transmissive member; and a light shielding frame covering lateral faces of the light transmissive member via the light reflecting member. The light shielding frame has an opening. An outer perimeter of the lower face of the light transmissive member is positioned outward of an inner perimeter of the opening in a plan view as seen from above.