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公开(公告)号：US5651724A
公开(公告)日：1997-07-29
申请号：US524824
申请日：1995-09-07
申请人： Norio Kimura , Takayoshi Kawamoto , You Ishii , Katsuyuki Aoki , Kunio Tateishi , Hozumi Yasuda , Keisuke Namiki
发明人： Norio Kimura , Takayoshi Kawamoto , You Ishii , Katsuyuki Aoki , Kunio Tateishi , Hozumi Yasuda , Keisuke Namiki
CPC分类号： B24B37/30
摘要： A predetermined amount of liquid such as water is supplied to a backside surface of a workpiece such as a semiconductor wafer. Such liquid is a workpiece retaining liquid and is attached to a concave workpiece holding surface of a top ring. The workpiece is positioned between a turntable and the top ring and is polished by an abrasive cloth on the turntable while the workpiece is being pressed against the turntable by the top ring. While polishing, the workpiece is deformed toward the concave workpiece holding surface of the top ring, and a curvature of the deformed workpiece is controlled by the amount of liquid between the workpiece holding surface and the backside surface of the workpiece.
摘要翻译： 将诸如水的预定量的液体供应到诸如半导体晶片的工件的背面。 这种液体是工件保持液体，并且附接到顶环的凹入的工件保持表面。 工件位于转盘和顶环之间，并通过研磨布在转台上抛光，同时工件被顶环压在转台上。 在抛光时，工件朝着顶环的凹入工件保持面变形，并且变形的工件的曲率由工件保持面与工件的背面之间的液体量控制。
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公开(公告)号：US5679063A
公开(公告)日：1997-10-21
申请号：US590477
申请日：1996-01-24
申请人： Norio Kimura , You Ishii , Hozumi Yasuda , Koji Saito , Masako Watase , Shiro Mishima
发明人： Norio Kimura , You Ishii , Hozumi Yasuda , Koji Saito , Masako Watase , Shiro Mishima
摘要： A polishing apparatus for polishing a surface of an object such as a semiconductor wafer includes a turntable having a polishing cloth mounted on an upper surface thereof, a top ring for holding and pressing the object against the polishing cloth, and a plurality of radially arranged nozzles for supplying a polishing solution, containing abrasive material, of different concentrations that differ along a radial direction of the polishing cloth.
摘要翻译： 用于研磨诸如半导体晶片的物体的表面的抛光装置包括具有安装在其上表面上的抛光布的转盘，用于将物体保持并按压在抛光布上的顶环，以及多个径向布置的喷嘴 用于供应不同浓度的研磨材料的抛光溶液，该研磨材料沿抛光布的径向方向不同。
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公开(公告)号：US06905400B2
公开(公告)日：2005-06-14
申请号：US10060366
申请日：2002-02-01
申请人： Norio Kimura , You Ishii , Toyomi Nishi , Takayoshi Kawamoto , Takeshi Sakurai
发明人： Norio Kimura , You Ishii , Toyomi Nishi , Takayoshi Kawamoto , Takeshi Sakurai
CPC分类号： B24B53/017 , B24B37/005 , B24B49/00
摘要： A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.
摘要翻译： 通过使修整器与抛光布接触来修整安装在转台上的抛光布，以恢复抛光布的抛光能力。 通过在抛光布的径向位置处测量抛光布的表面的高度来确定修整器相对于转盘的转速基于测量的高度的转速来进行修整， 并且通过按下梳妆台来修整抛光布正在旋转。 修整器具有环形金刚石颗粒层或环形SiC层。
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公开(公告)号：US06364752B1
公开(公告)日：2002-04-02
申请号：US08881616
申请日：1997-06-25
申请人： Norio Kimura , You Ishii , Toyomi Nishi , Takayoshi Kawamoto , Takeshi Sakurai
发明人： Norio Kimura , You Ishii , Toyomi Nishi , Takayoshi Kawamoto , Takeshi Sakurai
IPC分类号： B24B722
CPC分类号： B24B53/017 , B24B37/005 , B24B49/00
摘要： A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof, determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser against the polishing cloth while the turntable and the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.
摘要翻译： 通过使修整器与抛光布接触来修整安装在转台上的抛光布，以恢复抛光布的抛光能力。 通过在抛光布的径向方向的径向位置处测量抛光布的表面的高度来进行修整，根据测量的高度确定修整器相对于转盘的旋转速度的转速 并且在转台和修整器旋转的同时通过将修整器压靠抛光布来修整抛光布。 修整器具有环形金刚石颗粒层或环形SiC层。
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公开(公告)号：USRE38878E1
公开(公告)日：2005-11-15
申请号：US08993893
申请日：1997-12-18
申请人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
发明人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
CPC分类号： B24B37/107 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.
摘要翻译： 诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。 顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。 在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。 扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。
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公开(公告)号：US5398459A
公开(公告)日：1995-03-21
申请号：US156641
申请日：1993-11-24
申请人： Katsuya Okumura , Tohru Watanabe , Riichirou Aoki , Hiroyuki Yano , Masako Kodera , Atsushi Shigeta , You Ishii , Norio Kimura , Masayoshi Hirose , Yukio Ikeda
发明人： Katsuya Okumura , Tohru Watanabe , Riichirou Aoki , Hiroyuki Yano , Masako Kodera , Atsushi Shigeta , You Ishii , Norio Kimura , Masayoshi Hirose , Yukio Ikeda
CPC分类号： B24B37/102 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is positioned between a turntable and a top ring and polished by an abrasive cloth on the turntable while the top ring is being pressed against the turntable. The top ring has a retaining ring for preventing the workpiece from deviating from the lower surface of the top ring, and the retaining ring has an inside diameter larger than an outside diameter of the workpiece. The rotation of the turntable imparts a pressing force in a direction parallel to the upper surface of the turntable to the workpiece so that an outer periphery of the workpiece contacts an inner periphery of the retaining ring, and the rotation of the retaining ring imparts a rotational force to the workpiece so that the workpiece performs a planetary motion relative to the top ring in the retaining ring.
摘要翻译： 诸如半导体晶片的工件位于转盘和顶环之间，并且当顶环被压靠在转盘上时，其通过研磨布在转盘上抛光。 顶环具有用于防止工件偏离顶环的下表面的保持环，并且保持环的内径大于工件的外径。 转台的转动使平台于转台上表面的方向向工件施加压力，使得工件的外周与保持环的内周接触，并且保持环的旋转赋予转动 使工件相对于保持环中的顶环执行行星运动。
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公开(公告)号：US5384986A
公开(公告)日：1995-01-31
申请号：US124648
申请日：1993-09-22
IPC分类号： B24B37/26 , B24B53/007 , B24B53/017 , B41J11/62
CPC分类号： B24B53/017 , B24B37/26
摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereof for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.
摘要翻译： 安装有研磨布的转盘和位于转盘上方的顶环可独立地可旋转地设置。 顶环保持要抛光的工件，并将工件压在研磨布上。 转盘和顶环旋转以将工件的表面抛光到研磨布上的平整镜面上。 压在研磨布上的可旋转刷子围绕基本上垂直于研磨布平面的轴线旋转，并且在磨料布的径向内部和外部位置之间基本径向摆动。 将清洁溶液从喷嘴喷射到研磨布上。 转台沿其外圆周边缘具有一个堤，用于防止当转台静止时供给磨料以保持磨料湿润并防止磨损的保护溶液流出转台。
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公开(公告)号：US06935932B2
公开(公告)日：2005-08-30
申请号：US10784945
申请日：2004-02-25
申请人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
发明人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
CPC分类号： B24B37/345 , B24B9/065 , B24B37/12 , H01L21/67046
摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.
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公开(公告)号：US07108589B2
公开(公告)日：2006-09-19
申请号：US11187944
申请日：2005-07-25
申请人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
发明人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
IPC分类号： B24B7/00
CPC分类号： B24B37/345 , B24B9/065 , B24B37/12 , H01L21/67046
摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.
摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。
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公开(公告)号：USRE38228E1
公开(公告)日：2003-08-19
申请号：US08789304
申请日：1997-01-30
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B37/26
摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereto for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.
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