公开(公告)号：US06364752B1

公开(公告)日：2002-04-02

申请号：US08881616

申请日：1997-06-25

申请人： Norio Kimura ,  You Ishii ,  Toyomi Nishi ,  Takayoshi Kawamoto ,  Takeshi Sakurai

发明人： Norio Kimura ,  You Ishii ,  Toyomi Nishi ,  Takayoshi Kawamoto ,  Takeshi Sakurai

IPC分类号： B24B722

CPC分类号： B24B53/017 ,  B24B37/005 ,  B24B49/00

摘要： A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof, determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser against the polishing cloth while the turntable and the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.

摘要翻译： 通过使修整器与抛光布接触来修整安装在转台上的抛光布，以恢复抛光布的抛光能力。 通过在抛光布的径向方向的径向位置处测量抛光布的表面的高度来进行修整，根据测量的高度确定修整器相对于转盘的旋转速度的转速 并且在转台和修整器旋转的同时通过将修整器压靠抛光布来修整抛光布。 修整器具有环形金刚石颗粒层或环形SiC层。

公开(公告)号：US06905400B2

公开(公告)日：2005-06-14

申请号：US10060366

申请日：2002-02-01

申请人： Norio Kimura ,  You Ishii ,  Toyomi Nishi ,  Takayoshi Kawamoto ,  Takeshi Sakurai

发明人： Norio Kimura ,  You Ishii ,  Toyomi Nishi ,  Takayoshi Kawamoto ,  Takeshi Sakurai

IPC分类号： B24B49/00 ,  B24B53/00 ,  B24B1/00

CPC分类号： B24B53/017 ,  B24B37/005 ,  B24B49/00

摘要： A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.

摘要翻译： 通过使修整器与抛光布接触来修整安装在转台上的抛光布，以恢复抛光布的抛光能力。 通过在抛光布的径向位置处测量抛光布的表面的高度来确定修整器相对于转盘的转速基于测量的高度的转速来进行修整， 并且通过按下梳妆台来修整抛光布正在旋转。 修整器具有环形金刚石颗粒层或环形SiC层。

公开(公告)号：US5651724A

公开(公告)日：1997-07-29

申请号：US524824

申请日：1995-09-07

申请人： Norio Kimura ,  Takayoshi Kawamoto ,  You Ishii ,  Katsuyuki Aoki ,  Kunio Tateishi ,  Hozumi Yasuda ,  Keisuke Namiki

发明人： Norio Kimura ,  Takayoshi Kawamoto ,  You Ishii ,  Katsuyuki Aoki ,  Kunio Tateishi ,  Hozumi Yasuda ,  Keisuke Namiki

IPC分类号： B24B37/30 ,  B24B7/00

CPC分类号： B24B37/30

摘要： A predetermined amount of liquid such as water is supplied to a backside surface of a workpiece such as a semiconductor wafer. Such liquid is a workpiece retaining liquid and is attached to a concave workpiece holding surface of a top ring. The workpiece is positioned between a turntable and the top ring and is polished by an abrasive cloth on the turntable while the workpiece is being pressed against the turntable by the top ring. While polishing, the workpiece is deformed toward the concave workpiece holding surface of the top ring, and a curvature of the deformed workpiece is controlled by the amount of liquid between the workpiece holding surface and the backside surface of the workpiece.

摘要翻译： 将诸如水的预定量的液体供应到诸如半导体晶片的工件的背面。 这种液体是工件保持液体，并且附接到顶环的凹入的工件保持表面。 工件位于转盘和顶环之间，并通过研磨布在转台上抛光，同时工件被顶环压在转台上。 在抛光时，工件朝着顶环的凹入工件保持面变形，并且变形的工件的曲率由工件保持面与工件的背面之间的液体量控制。

公开(公告)号：US06139677A

公开(公告)日：2000-10-31

申请号：US787916

申请日：1997-01-23

申请人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B55/04 ,  C23F1/02

CPC分类号： B24B53/017 ,  B24B55/045

摘要： A polishing apparatus 70 is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable 73 with a polishing 74 cloth mounted on an upper surface thereof, a top ring 75 for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool 79 for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover 10 which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes 17 and 21 formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.

摘要翻译： 抛光装置70用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括：转台73，其上表面安装有抛光74布;顶环75，用于支撑待抛光的工件并将工件压靠在抛光布上;以及修整工具79，用于将抛光布修整在 转盘。 抛光装置还包括覆盖转台上表面以防止转台上的液体散落的盖10，以及形成在盖的上壁中的插入孔17和21，用于将顶环和修整工具穿过其中 。

公开(公告)号：US5839947A

公开(公告)日：1998-11-24

申请号：US795511

申请日：1997-02-05

申请人： Norio Kimura ,  Kunihiko Sakurai ,  Tetsuji Togawa ,  Seiji Katsuoka ,  Toyomi Nishi

发明人： Norio Kimura ,  Kunihiko Sakurai ,  Tetsuji Togawa ,  Seiji Katsuoka ,  Toyomi Nishi

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B53/017

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the polishing surface, which is movable between a polishing position inside of the turntable and a standby position outside of the turntable, and a first device for keeping at least a lower surface of the top ring wet while the top ring is in the standby position. The polishing apparatus further includes a dressing tool for dressing the polishing surface on the turntable, and a second device for keeping at least a lower surface of the dressing tool wet while the dressing tool is in a standby position.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台，用于保持要抛光的工件的顶环，并将工件压靠在抛光表面上，该抛光表面可在转盘内部的抛光位置和位于转盘外部的待机位置之间移动 转盘和用于在顶环处于待机位置时保持顶环的至少下表面湿润的第一装置。 抛光装置还包括用于修整转台上的抛光表面的修整工具，以及用于在修整工具处于待机位置时保持敷料工具的至少下表面湿润的第二装置。

公开(公告)号：US06413357B1

公开(公告)日：2002-07-02

申请号：US09666855

申请日：2000-09-21

申请人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

IPC分类号： C23F102

CPC分类号： B24B53/017 ,  B24B55/045

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.

摘要翻译： 抛光装置用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平整镜面。 抛光装置包括：具有安装在其上表面上的抛光布的转台，用于支撑待抛光工件的顶环，并将工件压靠在抛光布上;以及修整工具，用于将抛光布修整在转台上。 抛光装置还包括覆盖转盘上表面以防止转台上的液体散落的盖，以及形成在盖的上壁中的插孔，用于插入顶环和修整工具。

公开(公告)号：US06406364B1

公开(公告)日：2002-06-18

申请号：US09355895

申请日：1999-10-25

申请人： Norio Kimura ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kiyotaka Kawashima ,  Manabu Tsujimura ,  Takayoshi Kawamoto

发明人： Norio Kimura ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kiyotaka Kawashima ,  Manabu Tsujimura ,  Takayoshi Kawamoto

IPC分类号： B24B5700

CPC分类号： B24B37/04 ,  B24B57/02 ,  Y10S451/91

摘要： The object of the present invention is to provide a polishing apparatus that can supply a polishing solution having a non-varying distribution of abrading particles sizes at a steady rate. An apparatus (20) for delivering a polishing solution to a polishing apparatus (22) is disclosed. The apparatus (20) comprises: a solution passage for transporting the polishing solution; and an ultrasonic vibrator (72) being provided in at least one location of the solution passage.

摘要翻译： 本发明的目的是提供一种抛光装置，其能够以稳定的速度供给研磨粒子尺寸不变的抛光液。 公开了一种用于将抛光溶液输送到抛光装置（22）的装置（20）。 装置（20）包括：用于输送抛光溶液的溶液通道; 和超声波振动器（72）设置在溶液通道的至少一个位置。

公开(公告)号：US06416384B1

公开(公告)日：2002-07-09

申请号：US09126088

申请日：1998-07-30

申请人： Takayoshi Kawamoto ,  Norio Kimura ,  Hozumi Yasuda ,  Hiroshi Yoshida

发明人： Takayoshi Kawamoto ,  Norio Kimura ,  Hozumi Yasuda ,  Hiroshi Yoshida

IPC分类号： B24B4900

CPC分类号： H01L21/02024 ,  B24B37/015

摘要： A polishing apparatus can improve the uniformity of thickness within a workpiece or reduce thickness variation between serially polished workpieces. The polishing apparatus comprises a polishing unit having a polishing tool for providing a polishing surface and a workpiece holding device for holding the workpiece. A polishing solution or liquid supplying device is provided for supplying a polishing solution or liquid into a polishing interface between the surface of the workpiece and the polishing surface. A temperature of the polishing interface is controlled according to at least an ambient temperature of a polishing space surrounding the polishing unit, as a variable parameter.

摘要翻译： 抛光装置可以改善工件内的厚度均匀性或减少连续抛光的工件之间的厚度变化。 抛光装置包括具有用于提供抛光表面的抛光工具和用于保持工件的工件保持装置的抛光单元。 提供抛光溶液或液体供应装置，用于将抛光溶液或液体供应到工件表面和抛光表面之间的抛光界面。 作为可变参数，抛光界面的温度根据抛光单元周围的抛光空间的至少环境温度进行控制。

公开(公告)号：US07108589B2

公开(公告)日：2006-09-19

申请号：US11187944

申请日：2005-07-25

申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

IPC分类号： B24B7/00

CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。

公开(公告)号：USRE38228E1

公开(公告)日：2003-08-19

申请号：US08789304

申请日：1997-01-30

申请人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Kiyotaka Kawashima ,  You Ishii

发明人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Kiyotaka Kawashima ,  You Ishii

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B37/26

摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereto for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.