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    CABLE CONNECTION STRUCTURE
    2.
    发明申请
    CABLE CONNECTION STRUCTURE 有权
    电缆连接结构

    公开(公告)号：US20160093991A1

    公开(公告)日：2016-03-31

    申请号：US14963403

    申请日：2015-12-09

    Applicant: OLYMPUS CORPORATION

    Inventor： Keiichi KOBAYASHI ,  Junya YAMADA

    IPC: H01R24/50

    CPC classification number: H01R24/50 ,  H01R9/0515 ,  H01R12/53 ,  H01R12/57 ,  H01R24/38 ,  H01R2107/00

    Abstract: A cable connection structure includes cables and a substrate having an electrode thereon. The cables are configured to be connected to the electrode. Each cable includes: a core wire formed of conductive material; a tubular inner insulator for covering an outer circumference of the core wire; a shield which extends along a longitudinal direction of the inner insulator and includes conductors for covering an outer circumference of the inner insulator, and has an exposed portion for exposing the inner insulator; and an outer insulator for covering an outer circumference of the shield. The shield including a region where the exposed portion is formed, the inner insulator, and the core wire are exposed in a stepped manner toward a distal end of each cable. The substrate includes a first electrode configured to be electrically connected to the core wire, and a second electrode configured to be electrically connected to the shield.

    Abstract translation: 电缆连接结构包括电缆和其上具有电极的基板。 电缆被配置为连接到电极。 每个电缆包括：由导电材料形成的芯线; 用于覆盖芯线的外周的管状内绝缘体; 屏蔽件，其沿着所述内绝缘体的纵向方向延伸并且包括用于覆盖所述内绝缘体的外周的导体，并且具有用于暴露所述内绝缘体的暴露部分; 以及用于覆盖屏蔽件的外周的外绝缘体。 包括形成露出部分的区域，内绝缘体和芯线的屏蔽件以阶梯状的方式朝向每根电缆的远端露出。 基板包括被配置为电连接到芯线的第一电极和被配置为电连接到屏蔽的第二电极。

    ENDOSCOPE AND OPTICAL TRANSMISSION MODULE
    3.
    发明申请
    ENDOSCOPE AND OPTICAL TRANSMISSION MODULE 审中-公开

    公开(公告)号：US20180078114A1

    公开(公告)日：2018-03-22

    申请号：US15811952

    申请日：2017-11-14

    Applicant: OLYMPUS CORPORATION

    Inventor： Keiichi KOBAYASHI

    IPC: A61B1/00 ,  A61B1/05 ,  H04N5/225

    CPC classification number: A61B1/00013 ,  A61B1/00004 ,  A61B1/0017 ,  A61B1/04 ,  A61B1/05 ,  A61B1/051 ,  G02B23/26 ,  H04N5/2256 ,  H04N2005/2255

    Abstract: An optical transmission module includes: an optical fiber; a light emitting element; a holding member having a through-hole into which the optical fiber is inserted; a wiring board having a first principal surface onto which the holding member is joined, and a second principal surface on which a bond electrode and an external electrode of the light emitting element are disposed and bonded together; and a sealing resin for sealing a bond portion between the external electrode and the bond electrode. The optical transmission module further includes an intermediate member having an upper surface to be brought into contact with a distal end face of the optical fiber, and a lower surface to be brought into contact with a light emitting portion of the light emitting element.

    ENDOSCOPE AND IMAGING MODULE
    4.
    发明申请
    ENDOSCOPE AND IMAGING MODULE 有权

    公开(公告)号：US20220417401A1

    公开(公告)日：2022-12-29

    申请号：US17897539

    申请日：2022-08-29

    Applicant: OLYMPUS CORPORATION

    Inventor： Keiichi KOBAYASHI ,  Takatoshi IGARASHI

    IPC: H04N5/225 ,  G02B23/24 ,  H01L27/146

    Abstract: An endoscope comprising: an objective optical system; an imager having a light receiving plane that faces an emitting plane of the objective optical system; a semiconductor device provided so as to face a plane, of the imager, opposite to the light receiving plane; and a conductive member that covers the objective optical system, the imager, and the semiconductor device, the conductive member having an external dimension that is identical between a side of the objective optical system and a side of the imager. A distance from an end portion of the semiconductor device in a direction orthogonal to an optical axis of the objective optical system to an inner wall of the conductive member is shorter than a distance from an end portion of the imager in the direction orthogonal to the optical axis of the objective optical system to the inner wall of the conductive member.

    SEMICONDUCTOR DEVICE, ENDOSCOPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    8.
    发明申请
    SEMICONDUCTOR DEVICE, ENDOSCOPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20210288023A1

    公开(公告)日：2021-09-16

    申请号：US17336499

    申请日：2021-06-02

    Applicant: OLYMPUS CORPORATION

    Inventor： Keiichi KOBAYASHI

    IPC: H01L23/00 ,  H01L27/146 ,  H01L23/498 ,  H04N5/225

    Abstract: An image pickup apparatus includes: an image pickup member having a first surface and a second surface, an external electrode being disposed on the second surface; a terminal where a core wire terminal is disposed on a first upper surface and a core wire electrode is disposed on a lower surface; a wiring layer including an insulation layer and a wiring, the wiring being in contact with the external electrode and the core wire electrode, a third surface being in contact with the second surface and the lower surface; a resin layer disposed on the third surface, an outer dimension of the resin layer being equal to an outer dimension of the wiring layer, the resin layer fixing the image pickup member and the terminal; and an electric cable including a core wire bonded to the core wire terminal.

    ENDOSCOPE
    9.
    发明申请
    ENDOSCOPE 审中-公开

    公开(公告)号：US20200000328A1

    公开(公告)日：2020-01-02

    申请号：US16568399

    申请日：2019-09-12

    Applicant: OLYMPUS CORPORATION

    Inventor： Youhei SAKAI ,  Keiichi KOBAYASHI ,  Yusuke NAKAGAWA

    IPC: A61B1/05 ,  A61B1/00

    Abstract: An endoscope includes an opto-electric composite module, an optical fiber, and a plurality of electric cables each including a core wire and a shielding wire. The opto-electric composite module includes a light emitting device, a wiring board including a plurality of bonding electrodes to which the plurality of core wires are bonded, a ferrule causing the optical fiber inserted into a first through hole to be optically coupled to the light emitting device, and a cable holder having grooves to which the plurality of core wires are fixed with the plurality of core wires so disposed as to be bonded to the plurality of respective bonding electrodes. The cable holder is a holder conductor electrically connected to a ground potential electrode of the image pickup device, and the shielding wires in the electric cables are bonded to the holder conductor of the cable holder via an electrically conductive member.

    OPTICAL TRANSMISSION MODULE AND ENDOSCOPE
    10.
    发明申请
    OPTICAL TRANSMISSION MODULE AND ENDOSCOPE 审中-公开

    公开(公告)号：US20180307035A1

    公开(公告)日：2018-10-25

    申请号：US16020059

    申请日：2018-06-27

    Applicant: OLYMPUS CORPORATION

    Inventor： Keiichi KOBAYASHI ,  Youhei SAKAI

    IPC: G02B23/24

    CPC classification number: G02B23/2476 ,  A61B1/04 ,  G02B23/2469

    Abstract: An optical transmission module includes: an optical fiber a cross section of which has a circular shape and an end surface of which is an inclined surface; and an optical element part including an optical element, wherein a cutout surface extending in an optical axis direction is formed in an outer circumference of an end portion of the optical fiber, and the angle of the inclined surface with respect to the main surface of the optical element is defined by the cutout surface, such that light guided through the optical fiber is optically coupled to the optical element.

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