公开(公告)号：US12027817B2

公开(公告)日：2024-07-02

申请号：US17263811

申请日：2019-08-01

Applicant: OSRAM OLED GmbH

Inventor： Thomas Schwarz ,  Jörg Sorg

IPC: H01S5/02326 ,  H01S5/00 ,  H01S5/0232 ,  H01S5/02335 ,  H01S5/0237 ,  H01S5/0238 ,  H01S5/024 ,  H01S5/028

CPC classification number: H01S5/02326 ,  H01S5/0087 ,  H01S5/0232 ,  H01S5/02335 ,  H01S5/0237 ,  H01S5/0238 ,  H01S5/02476 ,  H01S5/028

Abstract: The invention relates to a laser chip located between a first and a second electrically and thermally conductive component, wherein: a first lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the first component; the second lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the second component; the laser chip has a radiation side which is located between the components; the radiation side is arranged set back inwardly at a predefined distance from the first end faces of the components; and a radiation space, which extends from the radiation side of the laser chip to the first end faces of the components is formed between the first lateral surfaces of the two components and adjacent to the radiation side of the laser chip.

公开(公告)号：US11784062B2

公开(公告)日：2023-10-10

申请号：US16765801

申请日：2018-11-23

Applicant: Osram OLED GmbH

Inventor： Thomas Schwarz ,  Andreas Plössl ,  Jörg Sorg

IPC: H01L21/50 ,  H01L25/075 ,  H01L25/16 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L21/48 ,  H01L21/52

CPC classification number: H01L21/50 ,  H01L21/4803 ,  H01L21/52 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: The invention relates to a method for producing optoelectronic components. The invention comprises: provision of a metal substrate, the substrate having a front side and a rear side opposite the front side; front-side removal of substrate material such that the substrate comprises substrate sections protruding in the region of the front side and recesses arranged there between; formation of a plastic body adjacent to substrate sections; arrangement of optoelectronic semiconductor chips on substrate sections; rear-side removal of substrate material in the region of the recesses, such that the substrate is structured into separate substrate sections; and performance of a separation process. The plastic body is divided into separate substrate sections and individual optoelectronic components with at least one optoelectronic semiconductor chip are formed. The invention also relates to an optoelectronic component.