摘要:
A component mounting apparatus includes a board transfer section for carrying in circuit boards to a component mounting position and carrying out the circuit board after component-mounting operation. A component feed section is provided for feeding, to a specified position, a component to be mounted onto the circuit board, and a component mounting section is provided for loading a suction nozzle matching the component to be mounted, sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. A controller is provided for controlling operations of the individual sections is order to execute a productional operation of component-mounting onto the circuit boards. Also, a remaining-component discarding device performs an operation of discarding a component which remains at the suction nozzle during a time period following the component-mounting operation while the component mounting section is kept halted.
摘要:
A component mounting method including carrying in a circuit board to a component mounting position and carrying out the circuit board after component-mounting operation. The component mounting operation includes sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. Also, a remaining-component discarding operation is performed to discard a component which remains at the suction nozzle during a specified time period following the component-mounting operation while the component mounting operation is stopped.
摘要:
The present invention is to provide a method and an apparatus for mounting components having a feature of detecting with high accuracy component pick up failure by the nozzle at component pick up stage, and/or component carrying back by the nozzle at component mounting stage. Achieved vacuum pressure is initialized to zero after completion of component pick up by the nozzle 25, and vacuum pressure decrease of the nozzle 25 is detected from the initialized zero point. If the detected value is bigger than the predetermined threshold, it may be judged that at least one of the nozzles failed to pick up a component. The failed nozzle may be identified by using a component recognition device 37. Blowing air blow volume flowing through the nozzle 25 is measured upon completion of component mounting. If the blowing air flow is smaller that the predetermined threshold, it is judged that the nozzle 25 carries back a component 30. Two thresholds may be used, and it may be judged that the component has been properly mounted if the measurement value is bigger than both thresholds, filter 22 is clogged if the measurement value is in between the two thresholds, and the nozzle 25 carries back the component if the measurement value is smaller than both thresholds.
摘要:
A slide-type solvent transfer unit is used, and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer flux to electronic components. In comparison with an electronic component mounting method including a transfer operation whereby nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent transfer unit, the time required for moving the nozzles up and down is shortened and a total cycle time is reduced, so that production efficiency is improved.
摘要:
A solvent transfer unit is made a slide type and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer the flux to electronic components. In comparison with an electronic component mounting method including a transfer operation whereby nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent transfer unit, a time for moving the nozzles up, down is shortened and a total cycle time is reduced, so that production efficiency is improved.
摘要:
Disclosed are a component recognizing method and apparatus, and a component mounting method and apparatus, by which components with various heights held by a plurality of nozzles can be recognized continuously. The drive of a head is transmitted to nozzles, with surfaces to be recognized of components being controlled so as to be positioned in a recognizable range during respective recognizing operations of the components, and a continuous recognition is thereby made possible. The adjustment of heights of the surfaces to be recognized during the recognizing operations of the components is achieved by one drive unit and a plurality of drive transmitting units.
摘要:
A component mounting apparatus and method allows for components supplied from component supplying members to be simultaneously or continuously held by component holding members without being affected by positional displacements of the component holding members relative to a head, a positional displacement of the component supplying members or the like. With a positional displacement amount (&Dgr;y) along a Y direction relative to a reference position of a nozzle taken into account, at a component supply cassette, driving a motor for moving components one by one along the Y direction to a component supply position is controlled, thereby positionally adjusting a component at the component supply position and absorbing the positional displacement amount.
摘要:
An apparatus and a method for mounting electronic components are provided which shorten a cycle time required for mounting and enable a component mounting machine to be arranged in a small area. There is provided a controller, so that a retreat control for a second electronic component is performed to a second component feeder so as to avoid an interference if a first electronic component or a component holder interferes with the second electronic component of the second component feeder because of movement of a mounting head. The time conventionally required for moving up and down a component holder can be reduced, and moreover the need of uselessly moving along a detour at a time of moving the mounting head is eliminated. The cycle time can be shortened, and eventually costs can be reduced.
摘要:
An offset measuring board is formed of a rectangular metal plate which can be positioned at a component mounting position by a positioning device and which has at least in proximity to one corner portion thereof a recognition through hole, serving as a recognition mark, having a black bottom face within a recessed portion.
摘要:
An apparatus and a method for mounting electronic components are provided which shorten a cycle time required for mounting and enable a component mounting machine to be arranged in a small area. There is provided a controller, so that a retreat control for a second electronic component is performed to a second component feeder so as to avoid an interference if a first electronic component or a component holder interferes with the second electronic component of the second component feeder because of movement of a mounting head. The time conventionally required for moving up and down a component holder can be reduced, and moreover the need of uselessly moving along a detour at a time of moving the mounting head is eliminated. The cycle time can be shortened, and eventually costs can be reduced.