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公开(公告)号：US20230273070A1
公开(公告)日：2023-08-31
申请号：US18143565
申请日：2023-05-04
Applicant: PIXART IMAGING INC.
Inventor： MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
IPC: G01J5/04 , G01J5/12 , G01J5/0875 , G01J5/00 , G01J5/05 , G01J5/0802
CPC classification number: G01J5/048 , G01J5/12 , G01J5/0875 , G01J5/0025 , G01J5/05 , G01J5/0802
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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公开(公告)号：US20190086267A1
公开(公告)日：2019-03-21
申请号：US16194212
申请日：2018-11-16
Applicant: PIXART IMAGING INC.
Inventor： CHIH-MING SUN , MING-HAN TSAI , CHENG-NAN TSAI
CPC classification number: G01J5/0265 , B81B7/0064 , B81B7/0067 , B81B2201/0278 , G01J5/041 , G01J5/045 , G01J5/06 , H04N5/2257 , H04N5/33
Abstract: A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.
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公开(公告)号：US20230358412A1
公开(公告)日：2023-11-09
申请号：US18224288
申请日：2023-07-20
Applicant: PixArt Imaging Inc.
Inventor： CHIH-MING SUN , MING-HAN TSAI , CHIUNG-WEN LIN , PO-WEI YU , WEI-MING WANG , SEN-HUANG HUANG
CPC classification number: F24C15/2042 , A61F13/42 , B66B5/0012 , G01J5/0025 , G01J5/10 , A61F2013/421 , G01J2005/0077 , G01J2005/106
Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.
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公开(公告)号：US20230314229A1
公开(公告)日：2023-10-05
申请号：US18330371
申请日：2023-06-07
Applicant: PIXART IMAGING INC.
Inventor： CHIH-MING SUN , MING-HAN TSAI , CHENG-NAN TSAI
CPC classification number: G01J5/0265 , G01J5/041 , H04N5/33 , G01J5/045 , G01J5/06 , B81B7/0064 , B81B7/0067 , H04N23/57 , B81B2201/0278
Abstract: A wearable device includes a case and a temperature sensing device. The case has a first opening. The temperature sensing device is disposed inside the case of the wearable device. The temperature sensing device includes a first substrate, a sensor chip, and a metal shielding structure. The sensor chip is disposed on the first substrate. The metal shielding structure surrounds the sensor chip, and has a second opening. The sensor chip faces towards the first opening and the second opening.
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公开(公告)号：US20230002214A1
公开(公告)日：2023-01-05
申请号：US17939205
申请日：2022-09-07
Applicant: PixArt Imaging Inc.
Inventor： CHIH-MING SUN , MING-HAN TSAI , YU-TAO LEE
IPC: B81B3/00 , H01L27/146 , H01L23/00 , B81C1/00
Abstract: A MEMS package including a fixed frame, a moveable platform and elastic restoring members is provided. The moveable platform is moved with respect to the fixed frame. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position.
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Patent Agency Ranking
公开(公告)号：US20250123149A1
公开(公告)日：2025-04-17
申请号：US19002742
申请日：2024-12-27
Applicant: PIXART IMAGING INC.
Inventor： CHIH-MING SUN , MING-HAN TSAI , CHENG-NAN TSAI
Abstract: A handheld electronic product includes a case and a temperature sensing device. The case has a first opening. The temperature sensing device is disposed inside the case of the handheld electronic product. The temperature sensing device includes a first substrate, a sensor chip, and a metal shielding structure. The sensor chip is disposed on the first substrate. The metal shielding structure surrounds the sensor chip, and has a second opening. The sensor chip faces towards the first opening and the second opening.
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公开(公告)号：US20160349114A1
公开(公告)日：2016-12-01
申请号：US14972563
申请日：2015-12-17
Applicant: PIXART IMAGING INC.
Inventor： MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
CPC classification number: G01J5/048 , G01J5/0025 , G01J5/043 , G01J5/0862 , G01J5/0875 , G01J5/12
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
Abstract translation: 电子设备包括外壳，电路基板，热电堆传感器芯片，过滤器结构和防水结构。 外壳有一个开口。 电路基板设置在外壳的内部。 热电堆传感器芯片设置在电路基板上。 过滤器结构设置在热电堆传感器芯片的上方。 防水结构围绕连接在过滤器结构和外壳之间以密封外壳的开口，其中防水结构具有用于暴露过滤器结构并与外壳的开口连通的通孔。
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公开(公告)号：US20160282187A1
公开(公告)日：2016-09-29
申请号：US15172983
申请日：2016-06-03
Applicant: PIXART IMAGING INC.
Inventor： CHIH-MING SUN , MING-HAN TSAI , CHENG-NAN TSAI
CPC classification number: G01J5/0265 , B81B7/0064 , B81B7/0067 , B81B2201/0278 , G01J5/041 , G01J5/045 , G01J5/06 , H04N5/2257 , H04N5/33
Abstract: A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.
Abstract translation: 可佩戴装置包括壳体和远红外温度感测装置。 案件有第一个开口。 远红外温度感测装置设置在可穿戴装置的壳体内。 远红外温度感测装置包括组装结构，传感器芯片，过滤器结构和金属屏蔽结构。 组装结构具有容纳空间和顶部开口。 传感器芯片设置在组装结构的容纳空间中。 滤波器结构设置在传感器芯片上方。 金属屏蔽结构设置在传感器芯片上方，并且具有第二开口以暴露过滤器结构。 第一和第二开口被连通以协作地限定通孔。
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公开(公告)号：US20220146115A1
公开(公告)日：2022-05-12
申请号：US17584755
申请日：2022-01-26
Applicant: PixArt Imaging Inc.
Inventor： CHIH-MING SUN , MING-HAN TSAI , CHIUNG-WEN LIN , PO-WEI YU , WEI-MING WANG , SEN-HUANG HUANG
Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.
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公开(公告)号：US20220136905A1
公开(公告)日：2022-05-05
申请号：US17578691
申请日：2022-01-19
Applicant: PIXART IMAGING INC.
Inventor： CHIH-MING SUN , MING-HAN TSAI , CHENG-NAN TSAI
Abstract: A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.
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