公开(公告)号：US20160291653A1

公开(公告)日：2016-10-06

申请号：US14675393

申请日：2015-03-31

Applicant: QUALCOMM INCORPORATED

Inventor： ANIL VOOTUKURU ,  ANKUR JAIN ,  UNNIKRISHNAN VADAKKANMARUVEEDU ,  VINAY MITTER ,  CHRISTOPHER LEE MEDRANO

IPC: G06F1/20 ,  G05B15/02 ,  G01K13/00

CPC classification number: G06F1/206 ,  G01K7/427 ,  G01K13/00 ,  G05B15/02 ,  G06F1/203 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3243 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/152 ,  Y02D10/172

Abstract: Thermal management in a portable computing device differentiates between a temperature increase caused by a steady workload and a temperature increase caused by an instantaneous workload. If it is determined that a detected temperature increase is caused by a steady workload, then a configuration of thermal parameters is applied that optimizes thermal performance for a steady workload. If it is determined that a temperature increase is caused by an instantaneous workload increase, then a configuration of thermal parameters is applied that optimizes thermal performance for an instantaneous workload.

Abstract translation: 便携式计算设备中的热管理区分由稳定的工作负载导致的温度升高和由瞬时工作量引起的温度升高。 如果确定检测到的温度升高是由稳定的工作量引起的，则应用热参数的配置，其优化用于稳定工作负载的热性能。 如果确定温度升高是由瞬间工作量增加引起的，则应用热参数的配置，其优化了瞬时工作负荷的热性能。

公开(公告)号：US20150220125A1

公开(公告)日：2015-08-06

申请号：US14690330

申请日：2015-04-17

Applicant: QUALCOMM INCORPORATED

Inventor： UNNIKRISHNAN VADAKKANMARUVEEDU ,  PARAS S. DOSHI ,  ANKUR JAIN ,  VINAY MITTER ,  RICHARD A. STEWART

IPC: G06F1/26 ,  G06F1/20 ,  G06F1/32

CPC classification number: G06F1/26 ,  G06F1/203 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  G06F2217/80 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for thermal energy management in a portable computing device (“PCD”) based on power level calculations are disclosed. An exemplary method includes tracking instantaneous operating temperatures and active power supply levels to one or more components. With an estimate or measurement of ambient temperature, the instantaneous operating temperature values and active power supply level values can be used to calculate an instantaneous thermal resistance value. In the event that thermal energy generation should be managed, a target operating temperature may be used with the ambient temperature and the instantaneous thermal resistance value to solve for an optimum power supply level. The active power supply level may then be adjusted based on the calculated optimum power supply level.

Abstract translation: 公开了基于功率电平计算的便携式计算设备（“PCD”）中用于热能管理的方法和系统的各种实施例。 示例性方法包括将瞬时操作温度和有功电力供应水平跟踪到一个或多个组件。 通过对环境温度的估计或测量，可以使用瞬时工作温度值和有功电源电平值来计算瞬时热阻值。 在管理热能产生的情况下，可以使用目标工作温度与环境温度和瞬时热阻值来求解最佳供电水平。 然后可以基于计算的最佳电源电平来调整有功电源电平。

公开(公告)号：US20150026495A1

公开(公告)日：2015-01-22

申请号：US13945181

申请日：2013-07-18

Applicant: Qualcomm Incorporated

Inventor： ANKUR JAIN ,  UNNIKRISHNAN VADAKKANMARUVEEDU ,  VINAY MITTER ,  HENRI BEGIN ,  PRAVEEN CHIDAMBARAM

IPC: G06F1/32

CPC classification number: G06F1/32 ,  G06F1/3203 ,  G06F1/3243

Abstract: Various embodiments of methods and systems for idle state optimization in a portable computing device (“PCD”) are disclosed. An exemplary method includes comparing an aggregate power consumption level for all processing cores in the PCD to a power budget and, if there is available headroom in the power budget, transitioning cores operating in a first idle state to a different idle state. In doing so, the latency value associated with bringing the transitioned cores out of an idle state and into an active state, should the need arise, may be reduced. The result is that user experience and QoS may be improved as an otherwise idle core in an idle state with a long latency time may be better positioned to quickly transition to an active state and process a workload.

Abstract translation: 公开了便携式计算设备（“PCD”）中用于空闲状态优化的方法和系统的各种实施例。 一种示例性方法包括将PCD中的所有处理核心的总功耗级别与功率预算进行比较，并且如果在功率预算中存在可用余量，则将在第一空闲状态中操作的核心转换到不同的空闲状态。 在这样做时，如果需要，可以减少与将转换的核心从空闲状态转变为活动状态相关联的延迟值。 结果是可以改善用户体验和QoS，因为空闲状态下的空闲核心具有长延迟时间可能更好地定位成快速转换到活动状态并处理工作负载。

公开(公告)号：US20150169016A1

公开(公告)日：2015-06-18

申请号：US14600667

申请日：2015-01-20

Applicant: QUALCOMM INCORPORATED

Inventor： PARAS S. DOSHI ,  ANKUR JAIN ,  UNNIKRISHNAN VADAKKANMARUVEEDU ,  VINJAY MITTER ,  ANIL VOOTUKURU ,  RONALD F. ALTON ,  JON J. ANDERSON

IPC: G06F1/20 ,  G06F11/30 ,  G06F1/32

CPC classification number: G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3287 ,  G06F1/3296 ,  G06F11/3031 ,  G06F11/3037 ,  G06F11/3058 ,  Y02D10/126 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device (“PCD”) are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package (“PoP”) memory temperatures and the “touch temperature” of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power.

Abstract translation: 公开了在便携式计算设备（“PCD”）中实现的用于自适应热管理技术的方法和系统的各种实施例。 值得注意的是，在许多PCD中，与PCD中各种组件相关的温度阈值，例如但不限于芯片结温度，封装封装（“PoP”）存储器温度和器件外表面的“触摸温度” 本身限制了可以利用PCD的性能能力的程度。 对于自适应热管理的方法和系统的各种实施例的优点在于，当违反温度阈值时，PCD的性能只能在授权热攻击之前被尽可能多地牺牲，并且在必要时被清除， 处理组件返回到最大操作功率。

公开(公告)号：US20140371944A1

公开(公告)日：2014-12-18

申请号：US13918962

申请日：2013-06-16

Applicant: Qualcomm Incorporated

Inventor： UNNIKRISHNAN VADAKKANMARUVEEDU ,  ZENGHUI ZHAO ,  VINAY MITTER ,  ROY SILVERSTEIN ,  ANKUR JAIN ,  JON ANDERSON

IPC: G01K7/16 ,  G05D23/20

CPC classification number: G01K7/16 ,  G05D23/1917 ,  G05D23/20 ,  G05D23/24 ,  G06F1/206

Abstract: Various embodiments of methods and systems for estimating environmental ambient temperature of a portable computing device (“PCD”) from electrical resistance measurements taken voice coils in a speaker or microphone component are disclosed. In an exemplary embodiment, it may be recognized that the PCD is in an idle state, thus producing little or no thermal energy. Electrical resistance measurements are taken from a voice coil and used to estimate the environmental ambient temperature to which the PCD is exposed. Certain embodiments may simply render the estimated ambient temperature for the benefit of the user or use the estimated ambient temperature as an input to a program or application running on the PCD. It is envisioned that certain embodiments of the systems and methods may use the estimated ambient temperature to adjust temperature thresholds in the PCD against which thermal management policies govern thermally aggressive processing components.

Abstract translation: 公开了用于通过扬声器或麦克风组件中的音圈的电阻测量来估计便携式计算设备（“PCD”）的环境温度的方法和系统的各种实施例。 在示例性实施例中，可以认识到PCD处于空闲状态，因此产生很少的或没有热能。 电阻测量取自音圈，用于估计PCD暴露于的环境温度。 某些实施例可以简单地使估计的环境温度为用户的利益或使用估计的环境温度作为在PCD上运行的程序或应用的输入。 可以设想，系统和方法的某些实施例可以使用估计的环境温度来调整PCD中的温度阈值，热管理策略对该温度阈值控制热侵蚀性处理组件。