公开(公告)号：US20230345669A1

公开(公告)日：2023-10-26

申请号：US17659977

申请日：2022-04-20

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Po-Kai TSENG

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20263 ,  H05K7/20254 ,  G06F1/20

Abstract: A heat transmissive chassis for a fan-less equipment component such as a 5G component is disclosed. The chassis includes a heat sink section having an interior surface and an exterior surface. The interior surface is configured for contact with a heat-generating electronic device. A lateral hollow compartment is located near the interior surface. A coolant is contained in the hollow compartment.

公开(公告)号：US20230025554A1

公开(公告)日：2023-01-26

申请号：US17380845

申请日：2021-07-20

Applicant: QUANTA COMPUTER INC.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Tzu-Hsuan HSU

IPC: G06F1/20 ,  H05K7/20

Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.

公开(公告)号：US20170325361A1

公开(公告)日：2017-11-09

申请号：US15414311

申请日：2017-01-24

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yi-Chieh CHEN ,  Jen-Mao CHEN ,  Wei-Chun CHANG

IPC: H05K7/20

CPC classification number: H05K7/20736 ,  G06F1/187 ,  G11B33/128 ,  G11B33/142 ,  H05K7/20781 ,  H05K7/20836

Abstract: The present technology provides a system for supplying fresh air to downstream components. The system comprises a housing with a first end and a second end, a first plurality of partitions disposed in the housing, and a second plurality of partitions disposed in the housing. The housing comprises a base portion and first and second opposing sidewalls extending from the first end to the second end. Each of the first plurality of partitions includes at least one first ventilation opening associated with each of the plurality of compartments. Each one of the second plurality of partitions comprises at least one partition duct extending through the plurality of partition rows and at least one second ventilation opening connecting the at least one partition duct to associated ones of the plurality of compartments.

公开(公告)号：US20240268057A1

公开(公告)日：2024-08-08

申请号：US18165830

申请日：2023-02-07

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Tzu-Hsuan HSU

IPC: H05K7/20

CPC classification number: H05K7/20136 ,  H05K7/20209

Abstract: An example assembly includes an equipment room, a cabinet fan module having fans, and a processor configured to execute logic. Temperature sensors are positioned in the air inlet channel and the equipment room. An electrical component having an air inlet area is also positioned in the equipment room. The logic causes the fans to operate at a predetermined speed, and compare a temperature in the air inlet channel with a temperature at the air inlet area. In response to determining that the temperature at the air inlet area is greater than the temperature in the air inlet channel plus a constant value, the operating speed of the fans is increased. Moreover, the operating speed of the fans is decreased in response to determining that the ambient temperature in the air inlet channel plus a constant value is greater than or equal to the temperature at the air inlet area.

公开(公告)号：US20240265903A1

公开(公告)日：2024-08-08

申请号：US18165838

申请日：2023-02-07

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Tzu-Hsuan HSU

IPC: G10K11/168 ,  H05K7/20

CPC classification number: G10K11/168 ,  H05K7/20736

Abstract: An example compute cabinet assembly includes an equipment room, an air inlet channel coupled to the equipment room, and a cabinet fan module coupled to the equipment room. The compute cabinet assembly further includes first and second air outlet channels. The first air outlet channel extends along a side of the equipment room towards an outlet of the first air outlet channel. The second air outlet channel extends along another side of the equipment room towards an outlet of the second air outlet channel. The compute cabinet assembly also includes electric fans positioned in the cabinet fan module. The electric fans are configured to create airflow originating at an inlet of the air inlet channel, extending through the equipment room and cabinet fan module, and exiting the compute cabinet assembly at the outlets of the first and second air outlet channels.

公开(公告)号：US20170265332A1

公开(公告)日：2017-09-14

申请号：US15063901

申请日：2016-03-08

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yi-Chieh CHEN ,  Jen-Mao CHEN ,  Wei-Chun CHANG

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20572 ,  G11B33/128 ,  G11B33/142 ,  H05K7/1489 ,  H05K7/20727

Abstract: Systems, methods and computer-readable media for reducing upstream preheat for high-density hard disk drive storage. A system can include first and second rows of storage devices installed in a storage rack, the first and second rows having a first distance between consecutive storage devices. The second row can be located behind the first row and farther away from a source of an airflow than the first row. The system can monitor a temperature associated with the second row and when the temperature rises above a threshold, the system can remove a storage device from the first row. The system can then adjust placement within the first row such that the remaining devices have a second, larger distance between each other to increase airflow to storage devices in the second row and reduce system impedance.

公开(公告)号：US20160353613A1

公开(公告)日：2016-12-01

申请号：US14723135

申请日：2015-05-27

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Chih-Ming CHEN ,  Yi-Chieh CHEN

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20781

Abstract: In some implementations, a hybrid cooling apparatus can be used to cool computing components within a computing device. For example, the apparatus can comprise a plurality of conductors coupled at one end to a plurality of heat generating computing components. The plurality of conductors can be coupled at another end to a liquid cooling rack. The liquid cooling rack can comprise a radiator, and the plurality of conductors can be coupled to the liquid cooling rack at the radiator. The liquid cooling rack can be adapted to cycle cold liquid coolant through the radiator. Heat generated by the computing components is conducted through the conductors to the radiator and dissipated by the cold liquid coolant.

Abstract translation: 在一些实施方案中，可以使用混合冷却装置来冷却计算装置内的计算组件。 例如，该装置可以包括在一端耦合到多个发热计算部件的多个导体。 多个导体可以在另一端耦合到液体冷却架。 液体冷却架可以包括散热器，并且多个导体可以联接到散热器处的液体冷却架。 液体冷却架可适用于使冷却液冷却剂循环通过散热器。 由计算组件产生的热量通过导体传导到散热器并由冷液体冷却剂消散。

公开(公告)号：US20240196573A1

公开(公告)日：2024-06-13

申请号：US18335720

申请日：2023-06-15

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yan-Kuei CHEN ,  Yi-Ta HSU

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20163 ,  H05K7/20718

Abstract: An example method for providing cooling capacity and reducing power consumption of a server assembly is disclosed. The method includes receiving temperature information corresponding to a CPU of an electrical component in the server assembly, which further includes an equipment room, and a cabinet fan module positioned adjacent to a side of the equipment room. The cabinet fan module includes electric fans therein, and the electrical component is implemented in the equipment room. The method includes determining a current power level of the CPU, and determining, using the temperature information and the current power level, a first operating speed for the electric fans. Furthermore, the method includes combining the first operating speed with a second operating speed received from a proportional-integral-derivative controller to determine a combined operating speed. The method still further includes instructing the electric fans to operate at the combined operating speed.

公开(公告)号：US20230247800A1

公开(公告)日：2023-08-03

申请号：US17587484

申请日：2022-01-28

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yan-Kuei CHEN ,  Yangtzu LEE

IPC: H05K7/20

CPC classification number: H05K7/207 ,  H05K7/20181

Abstract: A computing system includes a cabinet, an inlet temperature sensor, a cooling device, an environmental sensor, and at least one processor. The cabinet houses at least one computing device. The inlet temperature sensor is configured to detect inlet temperature data for the at least one computing device. The inlet temperature data represents internal temperature within the cabinet. The cooling device is coupled to the cabinet for maintaining temperature within the cabinet. The environmental sensor is configured to detect environmental temperature data external to the cabinet. The environmental temperature data represents external temperature outside the cabinet. The at least one processor is configured to: (a) determine if one or more of the inlet temperature data and the environmental temperature data exceeds a temperature range; and (b) in response to the temperature range being exceeded, generate a first warning signal indicating a temperature problem.

公开(公告)号：US20220418154A1

公开(公告)日：2022-12-29

申请号：US17304704

申请日：2021-06-24

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Tzu-Hsuan HSU

IPC: H05K7/20 ,  G06F1/20

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.