-
公开(公告)号:US20120222889A1
公开(公告)日:2012-09-06
申请号:US13504792
申请日:2010-10-28
申请人: Richard Charles Davis , Simon Richard Ford , Stephen Anthony Hall , Matthias Khaus , Karl-Heinz Ognibeni
发明人: Richard Charles Davis , Simon Richard Ford , Stephen Anthony Hall , Matthias Khaus , Karl-Heinz Ognibeni
IPC分类号: H05K1/03 , C09J163/00 , B29C65/02 , C09J177/00
CPC分类号: H05K3/386 , C08G18/345 , C08G73/14 , C09J175/04 , C09J179/08 , H05K1/0393 , H05K3/4691 , H05K2201/0154
摘要: The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.
摘要翻译: 本发明涉及包含聚酰胺酰亚胺树脂的可固化,液体,粘合剂组合物,该聚酰胺酰亚胺树脂用于粘结电子部件如金属包覆层压材料(例如柔性电路板)中的材料层。 特别地,本发明涉及包含具有由可热解离的异氰酸酯封闭基团封端的末端异氰酸酯基的聚酰胺酰亚胺和使用这些组合物制备柔性电子部件的液体粘合剂组合物。
-
公开(公告)号:US20120000696A1
公开(公告)日:2012-01-05
申请号:US13256619
申请日:2010-03-16
申请人: Stephen Anthony Hall , Richard Charles Davis , Simon Richard Ford , Matthias Klaus , Karl-Heinz Ognibeni
发明人: Stephen Anthony Hall , Richard Charles Davis , Simon Richard Ford , Matthias Klaus , Karl-Heinz Ognibeni
IPC分类号: H05K1/02 , B05D5/12 , H05K3/46 , C09D179/08
CPC分类号: C08G18/345 , C08G18/8074 , C08G73/14 , C08L63/00 , C09D179/08 , H01B3/306 , H05K1/0393 , H05K3/285 , H05K3/287 , H05K2201/0154 , C08L2666/22
摘要: The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.
摘要翻译: 本发明涉及可固化液体覆盖物组合物,其包含用于可固化组合物的聚酰胺酰亚胺树脂,其用作电子部件如柔性电路板中的金属包覆层压材料的保护性覆盖层涂料。 特别地,本发明涉及包含具有由可热解离的异氰酸酯封闭基团封端的末端异氰酸酯基团的聚酰胺酰亚胺和使用这些组合物制备柔性电子部件的液体覆盖物组合物。
-
公开(公告)号:US09670306B2
公开(公告)日:2017-06-06
申请号:US13256619
申请日:2010-03-16
申请人: Stephen Anthony Hall , Richard Charles Davis , Simon Richard Ford , Matthias Klaus , Karl-Heinz Ognibeni
发明人: Stephen Anthony Hall , Richard Charles Davis , Simon Richard Ford , Matthias Klaus , Karl-Heinz Ognibeni
IPC分类号: C08G73/14 , C09J177/08 , C08G18/34 , C08G18/80 , C09D179/08 , H05K3/28 , C08L63/00 , H01B3/30 , H05K1/03
CPC分类号: C08G18/345 , C08G18/8074 , C08G73/14 , C08L63/00 , C09D179/08 , H01B3/306 , H05K1/0393 , H05K3/285 , H05K3/287 , H05K2201/0154 , C08L2666/22
摘要: The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.
-
公开(公告)号:US09668360B2
公开(公告)日:2017-05-30
申请号:US13504792
申请日:2010-10-28
申请人: Richard Charles Davis , Simon Richard Ford , Stephen Anthony Hall , Matthias Klaus , Karl-Heinz Ognibeni
发明人: Richard Charles Davis , Simon Richard Ford , Stephen Anthony Hall , Matthias Klaus , Karl-Heinz Ognibeni
IPC分类号: C08G73/14 , C09J177/08 , H05K3/38 , C08G18/34 , C09J175/04 , C09J179/08 , H05K1/03 , H05K3/46
CPC分类号: H05K3/386 , C08G18/345 , C08G73/14 , C09J175/04 , C09J179/08 , H05K1/0393 , H05K3/4691 , H05K2201/0154
摘要: The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.
-
-
-