LASER RESEAL INCLUDING STRESS COMPENSATION LAYER

    公开(公告)号:US20170158492A1

    公开(公告)日:2017-06-08

    申请号:US15355798

    申请日:2016-11-18

    Abstract: A method is described for manufacturing a micromechanical component including a substrate and including a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity. An access opening connecting the first cavity to surroundings of the micromechanical component is formed in the substrate or cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or cap using a laser. A layer is deposited or grown on a surface of the substrate or the cap in the area of the access opening to produce a second mechanical stress, which counteracts a first mechanical stress occurring in the case of sealed access opening.

    Laser reseal including a protective structure

    公开(公告)号:US10183861B2

    公开(公告)日:2019-01-22

    申请号:US15368740

    申请日:2016-12-05

    Abstract: A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate, the cap, together with the substrate, enclosing a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity. An access opening connecting the first cavity to surroundings of the micromechanical component is formed in the substrate or in the cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or of the cap with the aid of a laser. A layer for protecting the sealed access opening is applied to or deposited on or grown on a material area, which transitions into a liquid aggregate state and then transitions into a solid aggregate state and seals the access opening.

    Micromechanical component including a diffusion stop channel

    公开(公告)号:US10029911B2

    公开(公告)日:2018-07-24

    申请号:US15401808

    申请日:2017-01-09

    Abstract: A method for manufacturing a micromechanical component is provided including a substrate and including a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the cap together with the substrate enclosing a second cavity, a second pressure prevailing and a second gas mixture having a second chemical composition being enclosed in the second cavity. A recess situated essentially between the first cavity and the second cavity is formed for diverting at least one first particle type of the first gas mixture and/or at least one second particle type of the second gas mixture.

    LASER RESEAL INCLUDING DIFFERENT CAP MATERIALS

    公开(公告)号:US20170158495A1

    公开(公告)日:2017-06-08

    申请号:US15369038

    申请日:2016-12-05

    Abstract: A method for manufacturing a micromechanical component including a substrate, and a cap connected to the substrate, the cap, together with the substrate, encloses a cavity, a pressure prevailing and a gas mixture having a first chemical composition being enclosed in the cavity. An access opening connecting the cavity to surroundings of the micromechanical component is formed in the substrate or in the cap. The pressure and/or the chemical composition is adjusted in the cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or the cap with the aid of a laser. A first crystalline, amorphous, nanocrystalline, or polycrystalline layer is deposited or grown on a surface of the substrate or of the cap, and/or a substrate including a second crystalline, amorphous, nanocrystalline, and/or polycrystalline layer, and/or a cap including the second crystalline, amorphous, nanocrystalline, and/or polycrystalline layer is provided.

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