Abstract:
A tool for removing an interchangeable cooking insert from a grill has a handle end and an engagement end. A handle extends from the handle end toward the engagement end. A support arm extends from the handle toward the engagement end. The support arm has a first lateral edge defining a first lifting hook and a second lateral edge defining a second lifting hook. The first lifting hook and second lifting hook are configured to engage a portion of the cooking insert. A support pin extends across the support arm between the first lateral edge and the second lateral edge. A latch member is pivotally coupled to one of the support arm and the handle. The latch member includes a first end selectively engageable with a portion of the cooking insert and a second end extending through the handle for actuation of the latching member by a user.
Abstract:
An integrated circuit comprising: at least one test input for receiving test data; test control circuitry between the at least one test input and circuitry to be tested; wherein the test data is clocked in on a rising clock edge and a falling clock edge.
Abstract:
A gallium arsenide (GaAs) integrated circuit device is provided. The GaAs circuit device has a GaAs substrate with a copper contact layer for making electrical ground contact with a pad of a target device. Although copper is known to detrimentally affect GaAS devices, the copper contact layer is isolated from the GaAs substrate using a barrier layer. The barrier layer may be, for example, a layer of nickel vanadium (NiV). This nickel vanadium (NiV) barrier protects the gallium arsenide substrate from the diffusion effects of the copper contact layer. An organic solder preservative may coat the exposed copper to reduce oxidation effects. In some cases, a gold or copper seed layer may be deposited on the GaAs substrate prior to depositing the copper contact layer.
Abstract:
According to an exemplary embodiment, a method for fabricating a wafer level package includes forming a polymer layer on a device wafer, where the device wafer includes at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The method further includes bonding a protective wafer to the device wafer. The method further includes forming at least one via in the protective wafer, where the at least one via extends through the protective wafer and is situated over the at least one device wafer contact pad. The method further includes forming at least one protective wafer contact pad on the protective wafer, where the at least one protective wafer contact pad is situated over the at least one via and electrically connected to the at least one device wafer contact pad.
Abstract:
A method and apparatus are provided for performing on-board, in-circuit, and/or wafer level scan-based testing of integrated circuits. With the apparatus and method, one or more sequential storage elements, e.g., flip/flops, are coupled to combinational logic and are configured to have an additional port for receiving a scan mode signal. The scan mode signal sets the sequential storage element into one of two modes of operation: static mode in which the sequential storage element's output does not change on a falling edge of a scan enable signal or a transitional mode in which the sequential storage element's output is permitted to change on the falling edge. With sequential storage elements configured in this manner, a configuration scan is performed to set certain ones of the sequential storage elements into a static mode and other sequential storage elements into a transitional mode. A test pattern is then applied to the sequential storage elements and a pattern capture cycle is commenced.
Abstract:
The present invention provides an advantageous strap system for use with various objects, such as musical instruments, tools, or other objects that can be carried or supported using a neck strap. In an example embodiment of the present invention, a strap system is provided which comprises a fabric neck loop having two ends and a first connection component affixed to at least one end of the neck loop. A connection strap comprising a length of fabric is provided. A second connection component is affixed to a first end of the connection strap for enabling a connection with the first connection component. A connection means may be affixed to a second end of the connection strap for enabling a connection between an object and the connection strap. The connection means may comprise a hook, a snap ring, or the like.
Abstract:
A power management circuit is provided for a data storage device that is adapted for communicating with a host via an interface circuit. The power management circuit is responsive to a utilization of a control circuit of the data storage device, determined independently of the communication between the data storage device and the host, in providing a supply power to the data storage device. A method is provided comprising connecting a data storage device with a host via an interface circuit; sending data transfer commands from the host to the interface circuit; and monitoring the utilization of a control circuit of the data storage device in terms of the rate at which commands are processed by the control circuit for use in selectively providing a supply power to the data storage device.
Abstract:
An integrated circuit including functional circuitry; test circuitry connected to the functional circuitry, wherein the test circuitry is arranged to control the testing of the functional circuitry; and clock signal generating circuitry connected to both the functional circuitry and the test circuitry. The test circuitry is arranged to use the clock signal for testing the functional circuitry.
Abstract:
An integrated circuit comprising (i) a plurality of portions, each portion including test control circuitry; and (ii) at least one test input arranged to receive test signals, the circuit having a test mode in which one or more of the plurality of portions are testable, wherein the circuit has a reset mode which has priority over the test mode.
Abstract:
There is disclosed an integrated circuit comprising a test access port controller having a first mode of operation in which it is connectable to test logic to effect communication of serial test data and the control of an incoming clock signal, and a second mode of operation in which a data adaptor is connected to input and output pins via the test access port controller, the data adaptor being supplied with parallel data and control signals from on-chip functional circuitry and converting such parallel data and control signals into a sequence of serial bits including flow control bits.