公开(公告)号：US07456640B2

公开(公告)日：2008-11-25

申请号：US11355726

申请日：2006-02-16

申请人： Ronald Richard Breton ,  S. Jay Chey ,  Steven Alan Cordes ,  Matthew Farinelli ,  Michael David Fregeau ,  Sherif Ahmed Goma ,  Gene T. Patrick ,  Mohammed S. Shaikh

发明人： Ronald Richard Breton ,  S. Jay Chey ,  Steven Alan Cordes ,  Matthew Farinelli ,  Michael David Fregeau ,  Sherif Ahmed Goma ,  Gene T. Patrick ,  Mohammed S. Shaikh

IPC分类号： G01R31/02

CPC分类号： G01R1/07378 ,  G01R31/2863

摘要： An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate including a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second substrate disposed between the probes and the first substrate for electrically coupling the probes to corresponding electrical contacts disposed on the first surface of the product substrate.

摘要翻译： 一种用于测试集成电路装置的装置包括具有多个探针的探针装置，包括具有第一表面的产品基底的第一基底和设置在其第一表面上的电触点阵列，以及设置在探针和 用于将探针电耦合到布置在产品基板的第一表面上的相应的电触点的第一基板。

公开(公告)号：US07987591B2

公开(公告)日：2011-08-02

申请号：US12540487

申请日：2009-08-13

申请人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Kang-I Tsang

发明人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Kang-I Tsang

IPC分类号： H01K3/10

CPC分类号： G01R3/00 ,  G01R1/07378

摘要： A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

摘要翻译： 提供了一种用于晶片的晶片级测试探针中的硅芯座，包括主体，第一和第二相对面以及通过主体形成的通孔阵列，以在第一和第二面之间延伸通过 分别与第一和第二表面上的每个通孔相关联的引线对可彼此电连接。

公开(公告)号：US20110037489A1

公开(公告)日：2011-02-17

申请号：US12540487

申请日：2009-08-13

申请人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Tsang

发明人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Tsang

IPC分类号： G01R31/02 ,  C23F1/00 ,  G03F7/20

CPC分类号： G01R3/00 ,  G01R1/07378

摘要： A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

公开(公告)号：US08806740B2

公开(公告)日：2014-08-19

申请号：US13095969

申请日：2011-04-28

申请人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Kang-I Tsang

发明人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Kang-I Tsang

IPC分类号： H01R43/00 ,  G01R3/00 ,  G01R1/073

CPC分类号： G01R3/00 ,  G01R1/07378

摘要： A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

摘要翻译： 提供了一种用于晶片的晶片级测试探针中的硅芯座，包括主体，第一和第二相对面以及通过主体形成的通孔阵列，以在第一和第二面之间延伸通过 分别与第一和第二表面上的每个通孔相关联的引线对可彼此电连接。

公开(公告)号：US08487304B2

公开(公告)日：2013-07-16

申请号：US12771697

申请日：2010-04-30

申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

IPC分类号： H01L23/58 ,  H01L23/48 ,  H01L23/52

CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

摘要翻译： 电连接包括由导电材料制成的第一电接触。 第一电触点在其中形成凹陷。 还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。 可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。 还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。

公开(公告)号：US20110266539A1

公开(公告)日：2011-11-03

申请号：US12771697

申请日：2010-04-30

申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

IPC分类号： H01L23/544 ,  H01L23/58

CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

摘要翻译： 电连接包括由导电材料制成的第一电接触。 第一电触点在其中形成凹陷。 还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。 可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。 还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。

公开(公告)号：US20110199108A1

公开(公告)日：2011-08-18

申请号：US13095969

申请日：2011-04-28

申请人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Tsang

发明人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Tsang

IPC分类号： G01R31/20

CPC分类号： G01R3/00 ,  G01R1/07378

摘要： A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

公开(公告)号：US09335346B2

公开(公告)日：2016-05-10

申请号：US13608706

申请日：2012-09-10

申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  G01R1/067

CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

公开(公告)号：US08595919B2

公开(公告)日：2013-12-03

申请号：US13095973

申请日：2011-04-28

申请人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Kang-I Tsang

发明人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Kang-I Tsang

IPC分类号： B23P19/00

CPC分类号： G01R3/00 ,  G01R1/07378

摘要： A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

摘要翻译： 提供了一种用于晶片的晶片级测试探针中的硅芯座，包括主体，第一和第二相对面以及通过主体形成的通孔阵列，以在第一和第二面之间延伸通过 分别与第一和第二表面上的每个通孔相关联的引线对可彼此电连接。

公开(公告)号：US20120329295A1

公开(公告)日：2012-12-27

申请号：US13608706

申请日：2012-09-10

申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

IPC分类号： H05K1/02

CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

摘要翻译： 电连接包括由导电材料制成的第一电接触。 第一电触点在其中形成凹陷。 还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。 可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。 还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。