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    High performance compliant wafer test probe
    8.
    发明授权
    High performance compliant wafer test probe 有权
    高性能兼容晶圆测试探头

    公开(公告)号：US08487304B2

    公开(公告)日：2013-07-16

    申请号：US12771697

    申请日：2010-04-30

    申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

    发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

    IPC分类号： H01L23/58 ,  H01L23/48 ,  H01L23/52

    CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

    摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

    摘要翻译： 电连接包括由导电材料制成的第一电接触。 第一电触点在其中形成凹陷。 还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。 可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。 还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。

    High Performance Compliant Wafer Test Probe
    9.
    发明申请
    High Performance Compliant Wafer Test Probe 有权
    高性能合格晶圆测试探头

    公开(公告)号：US20110266539A1

    公开(公告)日：2011-11-03

    申请号：US12771697

    申请日：2010-04-30

    申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

    发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

    IPC分类号： H01L23/544 ,  H01L23/58

    CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

    摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

    摘要翻译： 电连接包括由导电材料制成的第一电接触。 第一电触点在其中形成凹陷。 还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。 可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。 还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。