公开(公告)号：US12274040B2

公开(公告)日：2025-04-08

申请号：US18514331

申请日：2023-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyelim Yun ,  Bongkyu Min ,  Dohoon Kim ,  Taewoo Kim ,  Jinyong Park ,  Jungje Bang ,  Hyeongju Lee

IPC: H05K9/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

公开(公告)号：US20230315115A1

公开(公告)日：2023-10-05

申请号：US18136987

申请日：2023-04-20

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Dohoon Kim ,  Boseok Moon

IPC: G05D1/02 ,  A47L9/28 ,  A47L9/00

CPC classification number: G05D1/0223 ,  A47L9/009 ,  A47L9/2805 ,  A47L9/2852 ,  G05D1/0246 ,  G05D1/0274 ,  A47L2201/04 ,  G05D2201/0203

Abstract: An electronic apparatus includes a sensor and a processor configured to acquire distance information about a distance of the electronic apparatus to a sensed obstacle in a different direction based on a travel direction of the electronic apparatus and sensing data received from the sensor during a travel of the electronic apparatus, identify a viewing angle of the electronic apparatus based on the acquired distance information, and adjust a travel velocity of the electronic apparatus based on the identified viewing angle being less than a threshold value.

公开(公告)号：US11031425B2

公开(公告)日：2021-06-08

申请号：US16430791

申请日：2019-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Kwan Seo ,  Kookki Lee ,  Dohoon Kim ,  Changrai Kim ,  Joonghoon Lee ,  Eunsang Cho

IPC: H01L31/0232 ,  H01L27/146

Abstract: An image sensor includes a substrate including a pixel region and a pad region, a first conductive pad on the substrate in the pad region, a micro lens layer on the substrate in the pixel region, and a first protective pattern covering the pad region and exposing the first conductive pad. The first protective pattern and the micro lens layer include the same material, and the first protective pattern and the micro lens layer are apart from each other.

公开(公告)号：US11729302B2

公开(公告)日：2023-08-15

申请号：US15734612

申请日：2019-05-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohoon Kim ,  Chulwoo Park

IPC: H04M1/02 ,  H01M50/519 ,  H01M50/538 ,  H01M50/574 ,  H01M50/534

CPC classification number: H04M1/0262 ,  H01M50/519 ,  H01M50/538 ,  H01M50/574 ,  H04M1/0266 ,  H04M1/0277 ,  H01M50/534 ,  H01M2220/30

Abstract: According to various embodiments of the present invention, an electronic device may comprise: a housing, which comprises a first plate, a second plate facing the opposite direction to the first plate, and a side surface member surrounding a space between the first plate and the second plate; a display viewed through at least a part of the first plate; a battery, which is disposed in the housing and comprises a battery cell comprising multiple cell parts, at least some of which are arranged to overlap each other when viewed from above one surface of the battery, and multiple conductive members arranged so as to overlap each other at the edges of the multiple cell parts when viewed from above the one surface; a battery protection circuit joined to the multiple conductive members; and a processor operationally connected to the display and the battery. Various other embodiments may also be possible.

公开(公告)号：US11277949B2

公开(公告)日：2022-03-15

申请号：US16921801

申请日：2020-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyelim Yun ,  Bongkyu Min ,  Dohoon Kim ,  Taewoo Kim ,  Jinyong Park ,  Jungje Bang ,  Hyeongju Lee

IPC: H05K7/00 ,  H05K9/00 ,  H05K1/18 ,  H05K1/11 ,  H05K7/14 ,  H05K1/14

Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

公开(公告)号：US09725648B2

公开(公告)日：2017-08-08

申请号：US14566614

申请日：2014-12-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takamasa Izawa ,  Dohoon Kim ,  Masahiko Yoshino ,  Takatoshi Seto

IPC: C09K11/77 ,  F21K99/00 ,  H01L33/50 ,  H01L33/56 ,  C09K11/08 ,  F21S8/10 ,  F21K9/23 ,  F21Y115/10

CPC classification number: C09K11/7792 ,  C09K11/0883 ,  F21K9/23 ,  F21S41/125 ,  F21S41/14 ,  F21S41/147 ,  F21S41/16 ,  F21Y2115/10 ,  H01L33/502 ,  H01L33/504 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A yellow phosphor is provided. The yellow phosphor includes a crystal formed of a compound that is represented by the following formula (1): Ln4−x(EuzM1−z)xSi12−yAlyO3+x+yN18−x−y(0.5≦x≦3, 0

公开(公告)号：US12216477B2

公开(公告)日：2025-02-04

申请号：US17843394

申请日：2022-06-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dohoon Kim ,  Aron Baik ,  Chanho Yoon ,  Eunsoll Chang

IPC: G05D1/00

Abstract: A robot is provided. The robot includes a driving part, a three dimensional (3D) depth sensor, a memory storing instructions, and a processor connected to the driving part, the 3D depth sensor, and the memory. The processor is configured to execute the instructions to acquire a depth image of a driving surface photographed by the 3D depth sensor while the robot is driving in a space, acquire, based on the acquired depth image, location information of a boundary area where tilt information of the driving surface is changed, acquire type information corresponding to an outside area of the boundary area based on the acquired location information of the boundary area and the changed tilt information, and control the driving part based on the acquired type information.

公开(公告)号：US12183591B2

公开(公告)日：2024-12-31

申请号：US17701846

申请日：2022-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohoon Kim ,  Wonwoong Chung ,  Taehyung Kim ,  Heejun Park ,  Handuck Song ,  Heonjong Jeong ,  Younglae Kim ,  Byeongok Cho

IPC: H01L21/467 ,  C09K13/00 ,  H01L21/311

Abstract: An etching gas composition includes a first organofluorine compound having 3 to 6 carbon atoms, and an organosulfur compound having 1 to 4 sulfur atoms. The organosulfur compound may include a carbon-fluorine (C—F) bond, a carbon-sulfur (C—S) bond, at least one carbon-carbon double (—C═C—) bond. When the etching gas composition is used, excellent etch selectivity may be obtained, and the linearity and verticality of a pattern may be greatly increased by improving line edge roughness (LER) and line width roughness (LWR) due to an improvement in the roughness of an etched surface.

公开(公告)号：US11825639B2

公开(公告)日：2023-11-21

申请号：US17694529

申请日：2022-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyelim Yun ,  Bongkyu Min ,  Dohoon Kim ,  Taewoo Kim ,  Jinyong Park ,  Jungje Bang ,  Hyeongju Lee

IPC: H05K9/00 ,  H05K1/18 ,  H05K1/11 ,  H05K7/14 ,  H05K1/14

CPC classification number: H05K9/0032 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K7/1427 ,  H05K2201/10371 ,  H05K2201/10378

Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

公开(公告)号：US10709043B2

公开(公告)日：2020-07-07

申请号：US16575679

申请日：2019-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyelim Yun ,  Bongkyu Min ,  Dohoon Kim ,  Taewoo Kim ,  Jinyong Park ,  Jungje Bang ,  Hyeongju Lee

IPC: H05K7/00 ,  H05K9/00 ,  H05K1/18 ,  H05K1/11 ,  H05K7/14 ,  H05K1/14

Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.