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公开(公告)号：US11812555B2
公开(公告)日：2023-11-07
申请号：US17718891
申请日：2022-04-12
发明人： Jinyong Park , Taewoo Kim , Hyeongju Lee , Bongkyu Min , Jungsik Park , Hyelim Yun
IPC分类号： H01Q1/24 , H05K1/14 , H05K5/00 , H05K1/02 , H05K1/11 , H05K3/46 , H04M1/02 , H05K1/03 , H04M1/03
CPC分类号： H05K1/144 , H01Q1/243 , H04M1/0264 , H04M1/0277 , H05K1/025 , H05K1/0243 , H05K1/0366 , H05K1/115 , H05K3/4644 , H05K5/0086 , H04M1/03 , H05K2201/042 , H05K2201/09027 , H05K2201/1009 , H05K2201/10098 , H05K2201/10121 , H05K2201/10151 , H05K2201/10234
摘要： According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical terminal and the third electrical terminal are electrically coupled to each other, the second electrical terminal and the fourth electrical terminal are electrically coupled to each other, and the first ground terminal and the second ground terminal are electrically coupled to each other.
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公开(公告)号：US11277949B2
公开(公告)日：2022-03-15
申请号：US16921801
申请日：2020-07-06
发明人： Hyelim Yun , Bongkyu Min , Dohoon Kim , Taewoo Kim , Jinyong Park , Jungje Bang , Hyeongju Lee
摘要： Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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公开(公告)号：US12022614B2
公开(公告)日：2024-06-25
申请号：US17487673
申请日：2021-09-28
发明人： Bongkyu Min , Taewoo Kim , Jinyong Park , Hyelim Yun , Hyeongju Lee , Sanghoon Park , Jiseon Han
IPC分类号： H05K1/00 , H01L23/528 , H04M1/02 , H05K1/11 , H05K1/14
CPC分类号： H05K1/141 , H01L23/528 , H04M1/0277 , H05K1/111 , H05K1/115 , H05K1/144 , H05K2201/10378
摘要： The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.
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公开(公告)号：US11330716B2
公开(公告)日：2022-05-10
申请号：US17132484
申请日：2020-12-23
发明人： Jinyong Park , Taewoo Kim , Hyeongju Lee , Bongkyu Min , Jungsik Park , Hyelim Yun
IPC分类号： H05K1/14 , H05K1/11 , H05K5/00 , H05K1/02 , H05K3/46 , H04M1/02 , H01Q1/24 , H05K1/03 , H04M1/03
摘要： According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical terminal and the third electrical terminal are electrically coupled to each other, the second electrical terminal and the fourth electrical terminal are electrically coupled to each other, and the first ground terminal and the second ground terminal are electrically coupled to each other.
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公开(公告)号：US11923709B2
公开(公告)日：2024-03-05
申请号：US17551793
申请日：2021-12-15
发明人： Sungtae Park , Minki Kim , Kicheol Bae , Yongjae Song , Hyelim Yun , Woosung Jang
CPC分类号： H02J7/0042 , H01Q7/00 , H02J50/10 , H05K1/11 , H05K1/144 , H05K1/181 , H05K5/0086 , H05K2201/10734
摘要： An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.
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公开(公告)号：US11825639B2
公开(公告)日：2023-11-21
申请号：US17694529
申请日：2022-03-14
发明人： Hyelim Yun , Bongkyu Min , Dohoon Kim , Taewoo Kim , Jinyong Park , Jungje Bang , Hyeongju Lee
CPC分类号： H05K9/0032 , H05K1/115 , H05K1/144 , H05K1/181 , H05K7/1427 , H05K2201/10371 , H05K2201/10378
摘要： An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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公开(公告)号：US11388277B2
公开(公告)日：2022-07-12
申请号：US16985516
申请日：2020-08-05
发明人： Taewoo Kim , Dui Kang , Bongkyu Min , Bongchoon Park , Sanghoon Park , Jinyong Park , Hyelim Yun , Hyeongju Lee , Younoh Chi
摘要： An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.
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公开(公告)号：US10709043B2
公开(公告)日：2020-07-07
申请号：US16575679
申请日：2019-09-19
发明人： Hyelim Yun , Bongkyu Min , Dohoon Kim , Taewoo Kim , Jinyong Park , Jungje Bang , Hyeongju Lee
摘要： Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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