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公开(公告)号:US09177793B2
公开(公告)日:2015-11-03
申请号:US13953917
申请日:2013-07-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyongsoo Kim , Joon Kim , WonSeok Yoo
IPC: H01L21/00 , H01L21/027 , H01L21/033 , H01L21/311 , H01L23/544 , G03F9/00
CPC classification number: H01L21/027 , G03F9/708 , H01L21/0274 , H01L21/0337 , H01L21/31144 , H01L23/544 , H01L2223/54426 , H01L2223/5446 , H01L2924/0002 , H01L2924/00
Abstract: A method of fabricating a semiconductor device includes forming an etch-target layer on a substrate having an alignment key, forming a transparent first pattern on the etch-target layer to face the alignment key, forming an opaque second pattern on the etch-target layer to be adjacent to the first pattern, and etching the etch-target layer using the first pattern and the second pattern as an etch mask.
Abstract translation: 制造半导体器件的方法包括在具有对准键的衬底上形成蚀刻目标层,在蚀刻目标层上形成透明的第一图案以面对对准键,在蚀刻靶层上形成不透明的第二图案 与第一图案相邻,并且使用第一图案和第二图案作为蚀刻掩模蚀刻蚀刻目标层。
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公开(公告)号:US09842841B2
公开(公告)日:2017-12-12
申请号:US14849651
申请日:2015-09-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ji Hun Kim , Ilgweon Kim , Junhwa Song , Jeonghoon Oh , WonSeok Yoo , Eun-Sun Lee
IPC: H01L21/8242 , H01L21/762 , H01L21/311 , H01L27/108 , H01L21/8234 , H01L21/8238 , H01L49/02
CPC classification number: H01L27/10894 , H01L21/76224 , H01L21/823412 , H01L21/823807 , H01L27/10805 , H01L27/10814 , H01L27/10817 , H01L27/1085 , H01L27/10855 , H01L27/10873 , H01L27/10891 , H01L28/91
Abstract: A method of fabricating a semiconductor device, the method including etching a portion of a substrate including a first region and a second region to form a device isolation trench; forming a device isolation layer defining active regions by sequentially stacking a first insulating layer, a second insulating layer, and a third insulating layer on an inner surface of the device isolation trench; forming word lines buried in the substrate of the first region, the word lines extending in a first direction to intersect the active region of the first region, the word lines being spaced apart from each other; forming a first mask layer covering the word lines on the substrate of the first region, the first mask layer exposing the substrate of the second region; forming a channel layer on the substrate of the second region; and forming a gate electrode on the channel layer.
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