公开(公告)号：US12278119B2

公开(公告)日：2025-04-15

申请号：US17837135

申请日：2022-06-10

Applicant: SEMES CO., LTD.

Inventor： Myung Seok Cha ,  Sang Min Lee ,  Jin Woo Jung ,  Do Hyeon Yoon

IPC: H01L21/67 ,  C23C16/44 ,  H01L21/02

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing an inner space; a fluid supply unit configured to supply a treating fluid to the inner space; and a fluid exhaust unit configured to exhaust the treating fluid from the inner space, and wherein the fluid exhaust unit includes: an exhaust line connected to the chamber; and a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space to a set pressure, and wherein the fluid supply unit includes: a fluid supply source; and a supply line provided between the fluid supply source and the chamber, and wherein at the supply line or the exhaust line a flow rate measuring member configured to measure a flow rate per unit time of the treating fluid flowing at the inner space is installed.

公开(公告)号：US12222159B2

公开(公告)日：2025-02-11

申请号：US17408953

申请日：2021-08-23

Applicant: SEMES CO., LTD.

Inventor： Do Hyeon Yoon ,  Yong Hyun Choi ,  Eui Sang Lim ,  Jun Young Choi

IPC: F26B21/14 ,  F26B5/14 ,  F26B21/10

Abstract: An apparatus for treating a substrate includes a body having an inner space in which the substrate is dried by a drying fluid in a supercritical state, a fluid supply unit that supplies the drying fluid into the inner space, a fluid exhaust unit that releases the drying fluid from the inner space, and a controller. The controller controls the fluid supply unit and the fluid exhaust unit to perform a pressure-raising step of raising pressure in the inner space to a set pressure and a flow step of generating a flow of the drying gas in the inner space by releasing, by the fluid exhaust unit, the drying fluid from the inner space while the fluid supply unit supplies the drying fluid into the inner space.

公开(公告)号：US12266561B2

公开(公告)日：2025-04-01

申请号：US17529649

申请日：2021-11-18

Applicant: SEMES CO., LTD.

Inventor： Sang Min Lee ,  Do Hyeon Yoon

IPC: H01L21/687 ,  B08B3/02 ,  B08B3/08

Abstract: The present invention provides an apparatus for treating a substrate, including: a process chamber including a first body and a second body which are combined with each other to form a treatment space for treating a substrate is treated therein; a driver which moves the process chamber to an open position or a close position; a support unit which supports a substrate within the treatment space; and a fluid supply unit which supplies a fluid to the treatment space, in which the support unit includes: a support pin coupled to the first body or the second body; and a guide member which is coupled to the support pin and extends in a lateral direction of the support pin to support the substrate.

公开(公告)号：US11908710B2

公开(公告)日：2024-02-20

申请号：US17520826

申请日：2021-11-08

Applicant: SEMES CO., LTD.

Inventor： Jin Woo Jung ,  Do Hyeon Yoon ,  Yong Hee Lee

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

CPC classification number: H01L21/67028 ,  H01L21/02101 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/67739

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.