公开(公告)号：US12131918B2

公开(公告)日：2024-10-29

申请号：US17667459

申请日：2022-02-08

Applicant: SEMES CO., LTD.

Inventor： Sang Min Lee ,  Seung Hoon Oh ,  Yong Joon Im ,  Hyo Won Yang

IPC: H01L21/67 ,  B08B3/04 ,  F26B5/00

CPC classification number: H01L21/67028 ,  H01L21/67023 ,  B08B3/04 ,  F26B5/005 ,  H01L21/6719

Abstract: A substrate processing apparatus includes a process chamber including a first body and a second body that are coupled to each other to form a processing space therein, a clamping member configured to clamp the first body and the second body, and an anti-friction member mounted in a groove formed in a contact region between the first body or the second body and the clamping member.

公开(公告)号：US20230207324A1

公开(公告)日：2023-06-29

申请号：US18057321

申请日：2022-11-21

Applicant: SEMES CO., LTD.

Inventor： Won Sik Son ,  Hyun Yoon ,  Hyo Won Yang ,  Ji Hoon Jeong ,  Young Dae Chung ,  In Ki Jung

IPC: H01L21/268 ,  H01L21/67

CPC classification number: H01L21/268 ,  H01L21/6704 ,  H01L21/67115

Abstract: The present invention provides a substrate treating method of treating a substrate including a plurality of cells, the substrate treating method including: a liquid treating operation of supplying a treatment liquid to the substrate; and a heating operation of heating the substrate by supplying the treatment liquid and irradiating laser light to a specific region located outside a region in which the plurality of cells is provided, in which the laser light is formed to cover the specific region when viewed from the top.