公开(公告)号：US20230211436A1

公开(公告)日：2023-07-06

申请号：US18145245

申请日：2022-12-22

申请人： SEMES CO., LTD.

发明人： Hyo Won YANG ,  Hyun Yoon ,  Ji Hoon Jeong ,  Ki Hoon Choi ,  In Ki Jung ,  Won Sik Son ,  Tae Hee Kim

IPC分类号： B23K26/03 ,  G03F1/84 ,  G03F1/42 ,  G03F1/60 ,  B23K26/122 ,  B23K26/06 ,  B23K26/04 ,  B23K26/362

CPC分类号： B23K26/032 ,  G03F1/84 ,  G03F1/42 ,  G03F1/60 ,  B23K26/122 ,  B23K26/0648 ,  B23K26/043 ,  B23K26/362

摘要： The inventive concept provides a mask treating method. The mask treating method includes treating a mask by supplying a liquid to the mask, and irradiating a laser to a region of the mask on which a specific pattern is formed while the liquid remains on the mask; moving an optical module including a laser unit configured to irradiate the laser between a process position for treating the substrate and a standby position deviating from the process position; and adjusting a state of the optical module at an inspection port provided at the standby position to a set condition before the optical module is moved to the process position.

公开(公告)号：US20230207324A1

公开(公告)日：2023-06-29

申请号：US18057321

申请日：2022-11-21

申请人： SEMES CO., LTD.

发明人： Won Sik Son ,  Hyun Yoon ,  Hyo Won Yang ,  Ji Hoon Jeong ,  Young Dae Chung ,  In Ki Jung

IPC分类号： H01L21/268 ,  H01L21/67

CPC分类号： H01L21/268 ,  H01L21/6704 ,  H01L21/67115

摘要： The present invention provides a substrate treating method of treating a substrate including a plurality of cells, the substrate treating method including: a liquid treating operation of supplying a treatment liquid to the substrate; and a heating operation of heating the substrate by supplying the treatment liquid and irradiating laser light to a specific region located outside a region in which the plurality of cells is provided, in which the laser light is formed to cover the specific region when viewed from the top.