公开(公告)号：US20240136157A1

公开(公告)日：2024-04-25

申请号：US18381151

申请日：2023-10-16

Applicant: SEMES CO., LTD.

Inventor： Je Ho KIM ,  Tae Suk JUNG

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01J37/32633 ,  H01J37/3244 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/68742 ,  H01J2237/334

Abstract: Proposed is a substrate processing apparatus, including a housing configured to provide a processing space therein, a substrate support unit configured to support a substrate within the processing space, and a baffle unit provided to surround a circumference of the substrate support unit. The baffle unit includes a baffle plate provided to surround the circumference of the substrate support unit and having at least one slit therein, and a drive member that lifts and moves the baffle plate, and the housing is provided in a shape capable of changing a size of a space between the processing space and the baffle plate according to a lifting movement of the baffle plate.

公开(公告)号：US20240234100A9

公开(公告)日：2024-07-11

申请号：US18381151

申请日：2023-10-17

Applicant: SEMES CO., LTD.

Inventor： Je Ho KIM ,  Tae Suk JUNG

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01J37/32633 ,  H01J37/3244 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/68742 ,  H01J2237/334

Abstract: Proposed is a substrate processing apparatus, including a housing configured to provide a processing space therein, a substrate support unit configured to support a substrate within the processing space, and a baffle unit provided to surround a circumference of the substrate support unit. The baffle unit includes a baffle plate provided to surround the circumference of the substrate support unit and having at least one slit therein, and a drive member that lifts and moves the baffle plate, and the housing is provided in a shape capable of changing a size of a space between the processing space and the baffle plate according to a lifting movement of the baffle plate.

公开(公告)号：US20170110294A1

公开(公告)日：2017-04-20

申请号：US15392709

申请日：2016-12-28

Applicant: SEMES CO., LTD.

Inventor： Je Ho KIM

IPC: H01J37/32

CPC classification number: H01J37/32522 ,  C23C16/26 ,  C23C16/458 ,  C23C16/46 ,  C23C16/463 ,  C23C16/50 ,  H01J37/32009 ,  H01J37/321 ,  H01J37/3211 ,  H01J37/32119 ,  H01J37/3244 ,  H01J37/32715 ,  H01J2237/334

Abstract: Provided are a system and a method for treating a substrate. The substrate treating system may include a process chamber including a body with an open top and a dielectric window hermetically sealing the top of the body from an outside, a supporting unit provided in the process chamber to support a substrate, a gas-supplying unit supplying a process gas into the process chamber, a plasma source provided outside the process chamber to generate plasma from the process gas supplied into the process chamber, and a heating unit heating the dielectric window. The heating unit may include a heater and a thermally conductive layer provided on one of surfaces of the dielectric window.

公开(公告)号：US20150318146A1

公开(公告)日：2015-11-05

申请号：US14687638

申请日：2015-04-15

Applicant: SEMES CO., LTD.

Inventor： Je Ho KIM

IPC: H01J37/32 ,  C23C16/26 ,  C23C16/458 ,  C23C16/50 ,  C23C16/46

CPC classification number: H01J37/32522 ,  C23C16/26 ,  C23C16/458 ,  C23C16/46 ,  C23C16/463 ,  C23C16/50 ,  H01J37/32009 ,  H01J37/321 ,  H01J37/3211 ,  H01J37/32119 ,  H01J37/3244 ,  H01J37/32715 ,  H01J2237/334

Abstract: Provided are a system and a method for treating a substrate. The substrate treating system may include a process chamber including a body with an open top and a dielectric window hermetically sealing the top of the body from an outside, a supporting unit provided in the process chamber to support a substrate, a gas-supplying unit supplying a process gas into the process chamber, a plasma source provided outside the process chamber to generate plasma from the process gas supplied into the process chamber, and a heating unit heating the dielectric window. The heating unit may include a heater and a thermally conductive layer provided on one of surfaces of the dielectric window.

Abstract translation: 提供了一种用于处理基板的系统和方法。 基板处理系统可以包括处理室，该处理室包括具有敞开顶部的主体和从外部密封该主体顶部的介电窗口，设置在处理室中以支撑基板的支撑单元，供应单元 进入处理室的处理气体，设置在处理室外部的等离子体源，以从供应到处理室中的工艺气体产生等离子体，以及加热单元加热电介质窗口。 加热单元可以包括加热器和设置在电介质窗口的一个表面上的导热层。