公开(公告)号：US20250119985A1

公开(公告)日：2025-04-10

申请号：US18897107

申请日：2024-09-26

Applicant: SEMES CO., LTD.

Inventor： Ju Mi LEE ,  Jae Oh BANG ,  Min Young KIM

IPC: H05B3/28 ,  H05B3/12

Abstract: Disclosed is a heating plate for supporting and heating a substrate, the heating plate including: a base layer on which a substrate is seated; a heating wire layer located under the base layer and including a transition metal material and a metal bond; and a protective layer located under the heating wire layer and including a ceramic material and an additive material, in which the additive material is melted at a lower temperature than the ceramic material and the transition metal material, and the metal bond is a material produced by bonding of components contained in the transition metal material and the additive material.

公开(公告)号：US20240203746A1

公开(公告)日：2024-06-20

申请号：US18391618

申请日：2023-12-20

Applicant: SEMES CO., LTD. ,  UIF (University Industry Foundation), Yonsei University

Inventor： Hang Lim LEE ,  Min Young KIM ,  Jung Woo OH ,  Kyung Hwan KIM ,  Sun Hae CHOI

IPC: H01L21/306

CPC classification number: H01L21/30604

Abstract: A chemical etching method using a metal catalyst is provided that prevents deterioration of device performance by preventing the formation of deep-level impurities inside silicon. The etching method comprises forming a metal catalyst containing nickel silicide on a silicon substrate, and selectively etching the silicon substrate in contact with the metal catalyst through chemical etching of the metal catalyst.

公开(公告)号：US20250096028A1

公开(公告)日：2025-03-20

申请号：US18810699

申请日：2024-08-21

Applicant: SEMES CO., LTD.

Inventor： Ju Mi LEE ,  Min Young KIM ,  Jae Oh BANG ,  Yun Hwa HONG

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

Abstract: Disclosed is a substrate treating apparatus including: a heating unit including a heating plate for supporting and heating a substrate; and a pressure reducing unit for applying a vacuum pressure to a space between a top surface of the heating plate and a substrate supported on the heating plate, in which the heating plate is provided with a lift hole, which is a movement passage for a lift pin to lift the substrate supported on the heating plate, and a top end of the lift hole is provided at a position higher than the top surface of the heating plate.

公开(公告)号：US20250149374A1

公开(公告)日：2025-05-08

申请号：US18812989

申请日：2024-08-22

Applicant: SEMES CO., LTD.

Inventor： Jae Oh BANG ,  Min Young KIM ,  Ju Mi LEE

IPC: H01L21/687 ,  H01L21/67

Abstract: The present disclosure provides a vacuum hole connector, a substrate support, and a substrate treatment apparatus. A vacuum hole connector according to an embodiment of the present disclosure includes a first connection member fixed to a lower portion of a first vacuum hole of a heating plate, and in which a first connection hole is formed; and a second connection member installed in a second vacuum hole of a heater cup, attached to the first connection member, and in which a second connection hole is formed, wherein the first connection member and the second connection member include a metal material, and the first vacuum hole communicates with the second vacuum hole through the first connection hole and the second connection hole, when the first connection member and the second connection member are assembled.

公开(公告)号：US20250096496A1

公开(公告)日：2025-03-20

申请号：US18803641

申请日：2024-08-13

Applicant: SEMES CO., LTD.

Inventor： Jae Oh BANG ,  Min Young KIM ,  Ju Mi LEE ,  Seung Hwan LEE

IPC: H01R13/187 ,  H01L21/687 ,  H01R13/24 ,  H01R107/00

Abstract: An electrical terminal connector, a substrate support, and a substrate processing apparatus are provided. The electrical terminal connector includes a housing unit installed by penetrating through a heater cup and having a housing ring, and a terminal connection unit installed to reciprocate within the housing unit and having a terminal connection portion to or from which an electric terminal is attached and detached. The terminal connection portion is variable so that the electric terminal is insertable when the terminal connection portion is separated from the housing ring and the electric terminal is fixed when the terminal connection portion is inserted into the housing ring together with the inserted electric terminal.

公开(公告)号：US20230343740A1

公开(公告)日：2023-10-26

申请号：US17726487

申请日：2022-04-21

Applicant: SEMES CO., LTD.

Inventor： Min Young KIM ,  Hang Lim LEE ,  Ji Hoon PARK

IPC: H01L23/00 ,  H05H1/24

CPC classification number: H01L24/74 ,  H05H1/24 ,  H01L24/05 ,  H01L2224/05647 ,  H01L2224/05541 ,  H01L24/80 ,  H01L2224/80013 ,  H01L2224/80395 ,  H05H2245/40

Abstract: There are provided a die surface treatment apparatus capable of sequentially performing reduction and activation processes on dies in a dual zone and a die bonding system including the die surface treatment apparatus. The die surface treatment apparatus includes: a stage supporting dies, a first plasma generator installed on a moving path of the dies, the first plasma generator performing a reduction process on surfaces of the dies, in a first plasma area; and a second plasma generator installed on the moving path of the dies, the second plasma generator performing a hydrophilization process on the surfaces of the dies, in a second plasma area.