Substrate treating apparatus and method
    1.
    发明授权
    Substrate treating apparatus and method 有权
    底物处理装置及方法

    公开(公告)号:US09506695B2

    公开(公告)日:2016-11-29

    申请号:US14556334

    申请日:2014-12-01

    CPC classification number: F26B21/003 H01L21/67017 H01L21/67034 H01L21/67051

    Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus includes a first unit, a second unit, a supply line connecting the first unit to the second unit to supply a supercritical fluid from the first unit to the second unit, a flow rate adjustment member disposed in the supply line, and a filter disposed in the supply line to remove foreign substances. The supply line disposed between the flow rate adjustment member and the filter is disposed to get out of a straight line.

    Abstract translation: 提供了一种基板处理装置。 基板处理装置包括第一单元,第二单元,将第一单元连接到第二单元的供应线,以将超临界流体从第一单元供应到第二单元,设置在供给管线中的流量调节构件,以及 设置在供给管线中以除去异物的过滤器。 设置在流量调节构件和过滤器之间的供给管线被设置为脱离直线。

    Recycling unit and substrate treating apparatus
    2.
    发明授权
    Recycling unit and substrate treating apparatus 有权
    回收单元和基板处理装置

    公开(公告)号:US09275847B2

    公开(公告)日:2016-03-01

    申请号:US14228731

    申请日:2014-03-28

    CPC classification number: H01L21/00 H01L21/67028 H01L21/67034 H01L21/67051

    Abstract: The substrate treating apparatus includes a drying chamber in which an organic solvent remaining on a substrate is dissolved by using a fluid, and a recycling unit including a separator for separating the organic solvent from the fluid discharged from the drying chamber to recycle the fluid. The separator includes a distiller in which a fluid containing an organic solvent having a first concentration is introduced, a heating unit heating a fluid containing an organic solvent having a second concentration discharged from the distiller, and supplying an evaporated fluid containing an organic solvent having a third concentration into the distiller, and a condensation unit liquefying a fluid containing an organic solvent having a fourth concentration discharged from the distiller. The organic solvent has the second concentration, the first concentration, the third concentration, and the fourth concentration which are successively lowered in concentration.

    Abstract translation: 基板处理装置包括通过使用流体溶解残留在基板上的有机溶剂的干燥室,以及包括用于从有机溶剂与从干燥室排出的流体分离以使循环流体的分离器的再循环单元。 分离器包括:蒸馏器,其中引入含有具有第一浓度的有机溶剂的流体;加热单元,加热含有从蒸馏器排出的第二浓度的有机溶剂的流体,以及供给包含有机溶剂的蒸发流体, 第三浓度进入蒸馏器,以及冷凝单元液化含有从蒸馏器排出的第四浓度的有机溶剂的流体。 有机溶剂具有浓度连续降低的第二浓度,第一浓度,第三浓度和第四浓度。

    Apparatus for treating substrate
    3.
    发明授权

    公开(公告)号:US09922850B2

    公开(公告)日:2018-03-20

    申请号:US14744563

    申请日:2015-06-19

    CPC classification number: H01L21/67051

    Abstract: Disclosed is a substrate treating apparatus which includes a treating container having a treating space therein and including a plurality of collecting vessels surrounding the treating space and provided such that inlets for inputting a fluid in the treating space are vertically stacked on each other, a support unit supporting a substrate in the treating space, a solution supply unit supplying a treating solution to the substrate supported by the support unit, and elevation units respectively joined with the collecting vessels and lifting up and down the collecting vessels. Each of the elevation units includes a base having a ring shape and joined with a corresponding collecting vessel, an elevation load joined with the base, and a driver lifting up and down the elevation load.

    SUBSTRATE TREATING APPARATUS AND METHOD
    4.
    发明申请
    SUBSTRATE TREATING APPARATUS AND METHOD 有权
    基板处理装置和方法

    公开(公告)号:US20150155158A1

    公开(公告)日:2015-06-04

    申请号:US14556334

    申请日:2014-12-01

    CPC classification number: F26B21/003 H01L21/67017 H01L21/67034 H01L21/67051

    Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus includes a first unit, a second unit, a supply line connecting the first unit to the second unit to supply a supercritical fluid from the first unit to the second unit, a flow rate adjustment member disposed in the supply line, and a filter disposed in the supply line to remove foreign substances. The supply line disposed between the flow rate adjustment member and the filter is disposed to get out of a straight line.

    Abstract translation: 提供了一种基板处理装置。 基板处理装置包括第一单元,第二单元,将第一单元连接到第二单元的供应线,以将超临界流体从第一单元供应到第二单元,设置在供给管线中的流量调节构件,以及 设置在供给管线中以除去异物的过滤器。 设置在流量调节构件和过滤器之间的供给管线被设置为脱离直线。

    APPARATUS FOR TREATING SUBSTRATE
    6.
    发明申请
    APPARATUS FOR TREATING SUBSTRATE 有权
    用于处理基板的装置

    公开(公告)号:US20150380279A1

    公开(公告)日:2015-12-31

    申请号:US14744563

    申请日:2015-06-19

    CPC classification number: H01L21/67051

    Abstract: Disclosed is a substrate treating apparatus which includes a treating container having a treating space therein and including a plurality of collecting vessels surrounding the treating space and provided such that inlets for inputting a fluid in the treating space are vertically stacked on each other, a support unit supporting a substrate in the treating space, a solution supply unit supplying a treating solution to the substrate supported by the support unit, and elevation units respectively joined with the collecting vessels and lifting up and down the collecting vessels. Each of the elevation units includes a base having a ring shape and joined with a corresponding collecting vessel, an elevation load joined with the base, and a driver lifting up and down the elevation load.

    Abstract translation: 公开了一种基板处理装置,其包括处理容器,其中具有处理空间,并且包括围绕处理空间的多个收集容器,并且设置成使得在处理空间中输入流体的入口彼此垂直堆叠,支撑单元 在处理空间中支撑基板,将处理溶液供给到由支撑单元支撑的基板的解决方案供应单元,以及分别与收集容器连接并提升收集容器的升降单元。 每个高度单元包括具有环形并与相应的收集容器连接的基座,与基座接合的仰角载荷和升高和升高升降载荷的驾驶员。

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