公开(公告)号：US20180108546A1

公开(公告)日：2018-04-19

申请号：US15785993

申请日：2017-10-17

Applicant: SEMES CO., LTD.

Inventor： Soon-Cheon Cho ,  Bongkyu Shin ,  Byeol Han ,  Hyun Joong Kim

IPC: H01L21/67 ,  B08B7/00 ,  G03F1/82 ,  B08B3/10 ,  H01J37/32 ,  H01L21/3065

CPC classification number: H01L21/67051 ,  B08B3/10 ,  B08B7/0057 ,  G03F1/82 ,  H01J37/32495 ,  H01J37/32623 ,  H01L21/3065 ,  H01L21/67086 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831

Abstract: Disclosed are an apparatus and a method for cleaning a component of a substrate dry processing apparatus. The method for cleaning a component of a substrate dry processing apparatus includes dipping the component in a cleaning solution received in a cleaning bath, generating radicals from the cleaning solution, and cleaning the component with the radicals. The component is cleaned with hydrogen radicals (H2*) and hydroxyl radicals (OH*) generated from ozone water. Accordingly, it is possible to rapidly remove carbon (C) and fluorine (F) deposited on the component.

公开(公告)号：US11967491B2

公开(公告)日：2024-04-23

申请号：US17177135

申请日：2021-02-16

Applicant: SEMES CO., LTD.

Inventor： Soon-Cheon Cho ,  Su Hyung Lee ,  Youngran Ko ,  Juyong Jang

IPC: H01L21/67 ,  B08B7/00 ,  B08B13/00 ,  H01J37/32

CPC classification number: H01J37/32862 ,  B08B7/0035 ,  B08B13/00 ,  H01J37/3244 ,  H01L21/67034 ,  H01J37/32192 ,  H01J37/32825 ,  H01J2237/002 ,  H01J2237/335

Abstract: The present invention provides a method and apparatus for cleaning parts used in substrate processing. In a method for cleaning parts of a substrate processing, plasma generated from cleaning gas is supplied together with a cooling medium to clean the parts, but the cooling medium may be provided at a lower temperature than the plasma.

公开(公告)号：US20230166285A1

公开(公告)日：2023-06-01

申请号：US18060030

申请日：2022-11-30

Applicant: SEMES CO., LTD.

Inventor： Yun Sang Kim ,  Yoon Seok Choi ,  Young Dae Chung ,  Soon-Cheon Cho ,  Se Hoon Oh

IPC: B05C5/02 ,  B05C13/02 ,  H05B6/78 ,  H05B6/80

CPC classification number: B05C5/02 ,  B05C13/02 ,  H05B6/78 ,  H05B6/80 ,  H05B2206/04

Abstract: Provided are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes: a chamber for providing a processing space; a substrate support unit provided in the processing space to support a substrate and rotate the substrate; a liquid supply unit including a chemical liquid discharge nozzle that discharges a chemical liquid to the substrate supported by the substrate support unit; and a microwave applying member for emitting microwaves to the substrate.