Abstract:
The inventive concept provides a substrate treating apparatus and a substrate treating method. The sub substrate treating apparatus may include a support unit that supports a substrate, a liquid supply unit that supplies a liquid onto the substrate supported by the support unit, and a controller that controls the liquid supply unit and the support unit, the liquid supply unit may include a pre-treatment nozzle that discharges a first treatment liquid in a stream scheme, and a main nozzle that discharges a second treatment liquid in a liquid curtain scheme, and the controller may control the support unit such that a rotational direction of the substrate when the first treatment liquid is discharged from the main nozzle and a rotational direction of the substrate when the second treatment liquid is discharged from the pre-treatment nozzle are opposite to each other.
Abstract:
The present invention relates to a liquid trap tank and a method for trapping liquid, the liquid trap tank may include a tank body configured to have an accommodation space formed therein capable of accommodating a liquid, have an inflow unit formed in one portion thereof, and have a discharge unit formed in the other portion thereof, a first accommodation portion formed inside the tank body and configured to primarily and temporarily accommodate the liquid so that air bubbles are separated from the liquid introduced through the inflow unit, and a second accommodation portion formed inside the tank body and configured to secondarily and temporarily accommodate the liquid moved from the first accommodation portion or to discharge the moved liquid to the outside through the discharge unit.
Abstract:
Provided is a substrate treatment device. The device includes: a substrate support member supporting a substrate to be treated; a rotation driving member rotating the substrate support member; a container provided around the substrate support member; and a treatment solution supply unit including a photoresist nozzle for supplying a photoresist to a top surface of the substrate, wherein the photoresist nozzle starts supplying the photoresist while the substrate support member rotates at a first supply speed and stops supplying the photoresist while the substrate support member rotates at a second supply speed decelerated from the first supply speed.