SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20220019148A1

    公开(公告)日:2022-01-20

    申请号:US17380308

    申请日:2021-07-20

    Abstract: The inventive concept provides a substrate treating apparatus and a substrate treating method. The sub substrate treating apparatus may include a support unit that supports a substrate, a liquid supply unit that supplies a liquid onto the substrate supported by the support unit, and a controller that controls the liquid supply unit and the support unit, the liquid supply unit may include a pre-treatment nozzle that discharges a first treatment liquid in a stream scheme, and a main nozzle that discharges a second treatment liquid in a liquid curtain scheme, and the controller may control the support unit such that a rotational direction of the substrate when the first treatment liquid is discharged from the main nozzle and a rotational direction of the substrate when the second treatment liquid is discharged from the pre-treatment nozzle are opposite to each other.

    LIQUID TRAP TANK AND METHOD FOR TRAPPING LIQUID

    公开(公告)号:US20230311026A1

    公开(公告)日:2023-10-05

    申请号:US18152485

    申请日:2023-01-10

    Applicant: SEMES CO.,LTD.

    CPC classification number: B01D19/0042 H01L21/67017

    Abstract: The present invention relates to a liquid trap tank and a method for trapping liquid, the liquid trap tank may include a tank body configured to have an accommodation space formed therein capable of accommodating a liquid, have an inflow unit formed in one portion thereof, and have a discharge unit formed in the other portion thereof, a first accommodation portion formed inside the tank body and configured to primarily and temporarily accommodate the liquid so that air bubbles are separated from the liquid introduced through the inflow unit, and a second accommodation portion formed inside the tank body and configured to secondarily and temporarily accommodate the liquid moved from the first accommodation portion or to discharge the moved liquid to the outside through the discharge unit.

    SUBSTRATE TREATMENT DEVICE AND METHOD OF APPLYING TREATMENT SOLUTION
    3.
    发明申请
    SUBSTRATE TREATMENT DEVICE AND METHOD OF APPLYING TREATMENT SOLUTION 审中-公开
    基板处理装置及其处理方法

    公开(公告)号:US20150064621A1

    公开(公告)日:2015-03-05

    申请号:US14472986

    申请日:2014-08-29

    CPC classification number: G03F7/162 H01L21/67

    Abstract: Provided is a substrate treatment device. The device includes: a substrate support member supporting a substrate to be treated; a rotation driving member rotating the substrate support member; a container provided around the substrate support member; and a treatment solution supply unit including a photoresist nozzle for supplying a photoresist to a top surface of the substrate, wherein the photoresist nozzle starts supplying the photoresist while the substrate support member rotates at a first supply speed and stops supplying the photoresist while the substrate support member rotates at a second supply speed decelerated from the first supply speed.

    Abstract translation: 提供了一种基板处理装置。 该装置包括:支撑待处理基板的基板支撑部件; 旋转驱动构件,旋转所述基板支撑构件; 设置在所述基板支撑构件周围的容器; 以及处理溶液供给单元,其包括用于将光致抗蚀剂供应到基板的顶表面的光致抗蚀剂喷嘴,其中,当基板支撑构件以第一供给速度旋转时,光致抗蚀剂喷嘴开始供应光致抗蚀剂,并停止供应光致抗蚀剂,同时基板支撑 构件以从第一供给速度减速的第二供给速度旋转。

Patent Agency Ranking