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公开(公告)号：US20230027120A1
公开(公告)日：2023-01-26
申请号：US17411322
申请日：2021-08-25
发明人： Shao-Tzu Tang , Wen-Jung Tsai , Chih-Hsien Chiu , Ko-Wei Chang , Yu-Wei Yeh , Yu-Cheng Pai , Chuan-Yi Pan , Chi-Rui Wu
IPC分类号： H01Q1/22 , H01L23/552
摘要： An electronic package is provided, in which a carrier structure provided with electronic components is disposed onto an antenna structure, where a stepped portion is formed at an edge of the antenna structure, so that a shielding body is arranged along a surface of the stepped portion. Therefore, the shielding body only covers a part of the surface of the antenna structure to prevent the shielding body from interfering with operation of the antenna structure.
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公开(公告)号：US20200090952A1
公开(公告)日：2020-03-19
申请号：US16196503
申请日：2018-11-20
发明人： Yu-Wei Yeh , Yen-Hung Lin , Chih-Yi Liao , Chih-Hsien Chiu
IPC分类号： H01L21/48 , H01L23/538 , H01L23/31 , H01L21/56
摘要： The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.
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公开(公告)号：US20230163082A1
公开(公告)日：2023-05-25
申请号：US17571901
申请日：2022-01-10
发明人： Chih-Hsien Chiu , Wen-Jung Tsai , Chien-Cheng Lin , Ko-Wei Chang , Yu-Wei Yeh , Shun-Yu Chien , Chia-Yang Chen
IPC分类号： H01L23/00 , H01L23/498 , H01L23/31
CPC分类号： H01L23/562 , H01L23/49822 , H01L23/3121
摘要： An electronic package is provided in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure is embedded in the packaging layer. Therefore, thermal stress is dispersed through the frame body to avoid warpage of the electronic package, so as to facilitate the arrangement of other electronic components around the electronic component.
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4.发明申请公开(公告)号：US20210351097A1
公开(公告)日：2021-11-11
申请号：US17241199
申请日：2021-04-27
发明人： Chih-Chiang He , Yu-Wei Yeh , Chia-Yang Chen , Chih-Yi Liao , Chih-Hsien Chiu , Chang-Chao Su
IPC分类号： H01L23/31 , H01L23/00 , H01L21/56 , H01L23/498 , H01L23/538 , H01L21/768
摘要： An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.
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公开(公告)号：US20200251395A1
公开(公告)日：2020-08-06
申请号：US16460766
申请日：2019-07-02
发明人： Chih-Chiang He , Yu-Wei Yeh , Chia-Yang Chen , Chih-Yi Liao , Chih-Hsien Chiu , Chang-Chao Su
IPC分类号： H01L23/31 , H01L23/498
摘要： An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulating layer encapsulates the electronic component and the conductive elements. The encapsulating layer is formed with recessed portions corresponding in position to the conductive elements. A gap is formed between the conductive elements and the recessed portions.
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公开(公告)号：US12057409B2
公开(公告)日：2024-08-06
申请号：US17571901
申请日：2022-01-10
发明人： Chih-Hsien Chiu , Wen-Jung Tsai , Chien-Cheng Lin , Ko-Wei Chang , Yu-Wei Yeh , Shun-Yu Chien , Chia-Yang Chen
IPC分类号： H01L23/00 , H01L23/16 , H01L23/31 , H01L23/498 , H01L23/58
CPC分类号： H01L23/562 , H01L23/3121 , H01L23/49822
摘要： An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.
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公开(公告)号：US20210375783A1
公开(公告)日：2021-12-02
申请号：US16931180
申请日：2020-07-16
发明人： Chih-Hsien Chiu , Wen-Jung Tsai , Yu-Wei Yeh , Tsung-Hsien Tsai , Chi-Liang Shih , Sheng-Ming Yang , Ping-Hung Liao
IPC分类号： H01L23/552 , H01L23/00 , H01L23/31 , H01L23/498
摘要： An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.
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公开(公告)号：US20230082767A1
公开(公告)日：2023-03-16
申请号：US17989554
申请日：2022-11-17
发明人： Chih-Hsien Chiu , Wen-Jung Tsai , Yu-Wei Yeh , Tsung-Hsien Tsai , Chi-Liang Shih , Sheng-Ming Yang , Ping-Hung Liao
IPC分类号： H01L23/552 , H01L23/00 , H01L23/31 , H01L23/498
摘要： An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.
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公开(公告)号：US11532568B2
公开(公告)日：2022-12-20
申请号：US16931180
申请日：2020-07-16
发明人： Chih-Hsien Chiu , Wen-Jung Tsai , Yu-Wei Yeh , Tsung-Hsien Tsai , Chi-Liang Shih , Sheng-Ming Yang , Ping-Hung Liao
IPC分类号： H01L23/552 , H01L23/00 , H01L23/31 , H01L23/498
摘要： An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.
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公开(公告)号：US20210005524A1
公开(公告)日：2021-01-07
申请号：US16793667
申请日：2020-02-18
发明人： Chih-Chiang He , Yu-Wei Yeh , Chia-Yang Chen , Chih-Yi Liao , Chih-Hsien Chiu , Chang-Chao Su
IPC分类号： H01L23/31 , H01L23/00 , H01L21/56 , H01L21/768 , H01L23/498 , H01L23/538
摘要： An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.
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