OXYGEN-DOPED GROUP III METAL NITRIDE AND METHOD OF MANUFACTURE

    公开(公告)号:US20180195206A1

    公开(公告)日:2018-07-12

    申请号:US15865391

    申请日:2018-01-09

    Applicant: SORAA, INC.

    Abstract: A gallium-containing nitride crystals are disclosed, comprising: a top surface having a crystallographic orientation within about 5 degrees of a plane selected from a (0001) +c-plane and a (000-1) −c-plane; a substantially wurtzite structure; n-type electronic properties; an impurity concentration of hydrogen greater than about 5×1017 cm−3; an impurity concentration of oxygen between about 2×1017 cm−3 and about 1×1020 cm−3; an [H]/[O] ratio of at least 0.3; an impurity concentration of at least one of Li, Na, K, Rb, Cs, Ca, F, and Cl greater than about 1×1016 cm−3; a compensation ratio between about 1.0 and about 4.0; an absorbance per unit thickness of at least 0.01 cm−1 at wavenumbers of approximately 3175 cm−1, 3164 cm−1, and 3150 cm−1; and wherein, at wavenumbers between about 3200 cm−1 and about 3400 cm−1 and between about 3075 cm−1 and about 3125 cm−1, said gallium-containing nitride crystal is essentially free of infrared absorption peaks having an absorbance per unit thickness greater than 10% of the absorbance per unit thickness at 3175 cm

    Method for quantification of extended defects in gallium-containing nitride crystals
    2.
    发明授权
    Method for quantification of extended defects in gallium-containing nitride crystals 有权
    含镓氮化物晶体中扩展缺陷的定量方法

    公开(公告)号:US09275912B1

    公开(公告)日:2016-03-01

    申请号:US14013753

    申请日:2013-08-29

    Applicant: SORAA, INC.

    CPC classification number: H01L22/12 H01L22/24

    Abstract: Methods for quantifying extended defects in a gallium-containing nitride crystal, wafer, or device, are disclosed. The methods include providing a gallium-containing nitride crystal, wafer, or device, processing the gallium-containing nitride crystal, wafer, or device in an etchant solution comprising one or more of H3PO4, H3PO4 that has been conditioned by prolonged heat treatment to form polyphosphoric acid, and H2SO4; removing the gallium-containing nitride crystal, wafer, or device from the etchant solution; and quantifying the concentration of at least one of etch pits or etch grooves.

    Abstract translation: 公开了用于量化含氮氮化物晶体,晶片或器件中的扩展缺陷的方法。 所述方法包括提供含镓氮化物晶体,晶片或器件,在包含通过长时间热处理调理的H3PO4,H3PO4中的一种或多种的蚀刻剂溶液中处理含镓氮化物晶体,晶片或器件以形成 多磷酸和H2SO4; 从蚀刻剂溶液中除去含镓氮化物晶体,晶片或器件; 以及量化蚀刻坑或蚀刻槽中的至少一个的浓度。

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