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公开(公告)号：US11851319B2
公开(公告)日：2023-12-26
申请号：US16560518
申请日：2019-09-04
Applicant: STMicroelectronics S.r.l.
Inventor： Anna Angela Pomarico , Giuditta Roselli , Daniele Caltabiano , Roberto Brioschi , Mohammad Abbasi Gavarti
CPC classification number: B81B3/0072 , B60T1/065 , B60T8/17 , B60T8/171 , G01L1/18 , G01L3/00 , G01L9/06 , B81B2201/0264 , B81B2201/0292 , B81B2203/0127 , B81B2203/0315
Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.
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2.发明授权Sensor device provided with a circuit for detection of single or multiple events for generating corresponding interrupt signals 有权传感器装置具有用于检测单个或多个事件的电路，用于产生相应的中断信号公开(公告)号：US09234911B2
公开(公告)日：2016-01-12
申请号：US14104873
申请日：2013-12-12
Applicant: STMicroelectronics S.r.l.
Inventor： Giuditta Roselli , Michele Tronconi , Fabio Pasolini
CPC classification number: G01P15/125 , G01P13/00 , G01P15/0802 , G06F1/1613 , G06F1/1684 , G06F3/017 , G06F3/0383 , G06F13/24 , G06F2200/1636 , G06F2200/1637
Abstract: A sensor device for an electronic apparatus, including a sensing structure for generating a first detection signal, and a dedicated integrated circuit connected to the sensing structure for detecting a first event associated with the electronic apparatus and for generating a first interrupt signal upon detection of the first event. The dedicated integrated circuit detects the first event as a function of changes to the first detection signal over time (i.e., temporal evolution), and in particular as a function of values assumed by the first detection signal within one or more successive time windows, and of a relation between these values.
Abstract translation: 一种用于电子设备的传感器装置，包括用于产生第一检测信号的感测结构和连接到感测结构的专用集成电路，用于检测与电子设备相关联的第一事件，并且用于在检测到第一检测信号时产生第一中断信号 第一件事 专用集成电路根据一段时间内的第一检测信号（即，时间演化）检测第一事件，特别是作为第一检测信号在一个或多个连续时间窗内所假设的值的函数，以及 这些价值之间的关系。
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公开(公告)号：US11009412B2
公开(公告)日：2021-05-18
申请号：US16904123
申请日：2020-06-17
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mohammad Abbasi Gavarti , Daniele Caltabiano , Andrea Picco , Anna Angela Pomarico , Giuditta Roselli , Francesco Braghin
Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.
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Patent Agency Ranking
公开(公告)号：US10724909B2
公开(公告)日：2020-07-28
申请号：US15894770
申请日：2018-02-12
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mohammad Abbasi Gavarti , Daniele Caltabiano , Andrea Picco , Anna Angela Pomarico , Giuditta Roselli , Francesco Braghin
Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.
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公开(公告)号：US10401379B2
公开(公告)日：2019-09-03
申请号：US15884019
申请日：2018-01-30
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giuditta Roselli , Michele Tronconi , Fabio Pasolini
Abstract: A sensor device for an electronic apparatus is provided with: a sensing structure generating a first detection signal; and a dedicated integrated circuit, connected to the sensing structure, detecting, as a function of the first detection signal, a first event associated to the electronic apparatus and generating a first interrupt signal upon detection of the first event. The dedicated integrated circuit detects the first event as a function of a temporal evolution of the first detection signal, and in particular as a function of values assumed by the first detection signal within one or more successive time windows, and of a relation between these values.
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公开(公告)号：US09915678B2
公开(公告)日：2018-03-13
申请号：US14957118
申请日：2015-12-02
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giuditta Roselli , Michele Tronconi , Fabio Pasolini
CPC classification number: G01P15/125 , G01P13/00 , G01P15/0802 , G06F1/1613 , G06F1/1684 , G06F3/017 , G06F3/0383 , G06F13/24 , G06F2200/1636 , G06F2200/1637
Abstract: A sensor device for an electronic apparatus is provided with: a sensing structure generating a first detection signal; and a dedicated integrated circuit, connected to the sensing structure, detecting, as a function of the first detection signal, a first event associated to the electronic apparatus and generating a first interrupt signal upon detection of the first event. The dedicated integrated circuit detects the first event as a function of a temporal evolution of the first detection signal, and in particular as a function of values assumed by the first detection signal within one or more successive time windows, and of a relation between these values.
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公开(公告)号：US20200095114A1
公开(公告)日：2020-03-26
申请号：US16560518
申请日：2019-09-04
Applicant: STMicroelectronics S.r.l.
Inventor： Anna Angela Pomarico , Giuditta Roselli , Daniele Caltabiano , Roberto Brioschi , Mohammad Abbasi Gavarti
Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.
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8.发明申请SENSOR DEVICE PROVIDED WITH A CIRCUIT FOR DETECTION OF SINGLE OR MULTIPLE EVENTS FOR GENERATING CORRESPONDING INTERRUPT SIGNALS 审中-公开用于检测用于产生相应中断信号的单个或多个事件的电路的传感器设备公开(公告)号：US20140165722A1
公开(公告)日：2014-06-19
申请号：US14104873
申请日：2013-12-12
Applicant: STMicroelectronics S.r.l.
Inventor： Giuditta Roselli , Michele Tronconi , Fabio Pasolini
CPC classification number: G01P15/125 , G01P13/00 , G01P15/0802 , G06F1/1613 , G06F1/1684 , G06F3/017 , G06F3/0383 , G06F13/24 , G06F2200/1636 , G06F2200/1637
Abstract: A sensor device for an electronic apparatus, is provided with: a sensing structure generating a first detection signal; and a dedicated integrated circuit, connected to the sensing structure, detecting, as a function of the first detection signal, a first event associated to the electronic apparatus and generating a first interrupt signal upon detection of the first event. The dedicated integrated circuit detects the first event as a function of a temporal evolution of the first detection signal, and in particular as a function of values assumed by the first detection signal within one or more successive time windows, and of a relation between these values.
Abstract translation: 一种用于电子设备的传感器装置，具有：产生第一检测信号的检测结构; 以及连接到感测结构的专用集成电路，根据第一检测信号检测与电子设备相关联的第一事件，并且在检测到第一事件时产生第一中断信号。 专用集成电路根据第一检测信号的时间演变检测第一事件，特别是作为在一个或多个连续时间窗内由第一检测信号所假定的值的函数，以及这些值之间的关系 。
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