公开(公告)号：US20020041729A1

公开(公告)日：2002-04-11

申请号：US09925847

申请日：2001-08-08

Applicant: STMicroelectronics S.r.I.

Inventor： Ubaldo Mastromatteo ,  Bruno Murari

IPC: G02B006/26 ,  G02B006/35

CPC classification number: H02N1/004 ,  B81B3/0051 ,  B81B2201/045 ,  B81B2203/051 ,  B81B2203/058 ,  F16H21/02 ,  G02B26/0841 ,  G02B26/0866

Abstract: A microelectromechanical structure, usable in an optical switch for directing a light beam towards one of two light guide elements, including: a mirror element, rotatably movable; an actuator, which can translate; and a motion conversion assembly, arranged between the mirror element and the actuator. The motion conversion assembly includes a projection integral with the mirror element and elastic engagement elements integral with the actuator and elastically loaded towards the projection. The elastic engagement elements are formed by metal plates fixed to the actuator at one of their ends and engaging the projection with an abutting edge countershaped with respect to the projection.

公开(公告)号：US20030209783A1

公开(公告)日：2003-11-13

申请号：US10369114

申请日：2003-02-18

Applicant: STMicroelectronics S.r.I.

Inventor： Paolo Casati ,  Amedeo Maierna ,  Bruno Murari

IPC: H01L023/552

CPC classification number: H01L23/49568 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/552 ,  H01L2224/83855 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/3025

Abstract: An assembly structure for an electronic integrated power circuit, which circuit is fabricated on a semiconductor die having a plurality of contact pads associated with said integrated circuit and connected electrically to respective leads of said structure, wherein a shield element is coupled thermally to said die by a layer of an adhesive material.

Abstract translation: 一种用于电子集成电力电路的组装结构，该电路制造在具有与所述集成电路相关联的多个接触焊盘并且电连接到所述结构的相应引线的半导体管芯上，其中屏蔽元件通过 一层粘合剂材料。

公开(公告)号：US20040070888A1

公开(公告)日：2004-04-15

申请号：US10601332

申请日：2003-06-20

Applicant: STMicroelectronics S.r.I.

Inventor： Ubaldo Mastromatteo ,  Bruno Murari ,  Paolo Ferrari ,  Simone Sassolini

IPC: G11B005/56

CPC classification number: B81B3/0021 ,  H02N1/006

Abstract: A micro-electro-mechanical device formed by a body of semiconductor material having a thickness and defining a mobile part and a fixed part. The mobile part is formed by a mobile platform, supporting arms extending from the mobile platform to the fixed part, and by mobile electrodes fixed to the mobile platform. The fixed part has fixed electrodes facing the mobile electrodes, a first biasing region fixed to the fixed electrodes, a second biasing region fixed to the supporting arms, and an insulation region of insulating material extending through the entire thickness of the body. The insulation region insulates electrically at least one between the first and the second biasing regions from the rest of the fixed part.

Abstract translation: 由具有厚度并限定可移动部分和固定部分的半导体材料体形成的微电子机械装置。 可移动部分由移动平台，从移动平台延伸到固定部分的支撑臂，以及固定到移动平台的移动电极形成。 固定部分具有面向移动电极的固定电极，固定到固定电极的第一偏置区域，固定到支撑臂的第二偏压区域以及延伸穿过主体整个厚度的绝缘材料的绝缘区域。 绝缘区域在第一和第二偏压区域之间至少一个与固定部件的其余部分绝缘。