公开(公告)号：US09125322B2

公开(公告)日：2015-09-01

申请号：US13871803

申请日：2013-04-26

Applicant: STMicroelectronics S.r.I.

Inventor： Cristiano Gianluca Stella

IPC: G06F1/20 ,  H05K5/00 ,  H05K7/20 ,  H01L23/34 ,  H01L23/48 ,  H01L31/107 ,  H01L23/02 ,  H01L21/302 ,  H01L23/367 ,  H01L23/40 ,  H05K13/00 ,  H01L23/38

CPC classification number: H05K7/20 ,  H01L21/302 ,  H01L23/02 ,  H01L23/34 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/38 ,  H01L23/4006 ,  H01L23/4093 ,  H01L23/48 ,  H01L2924/0002 ,  H05K7/2039 ,  H05K13/00 ,  Y10T29/49002 ,  H01L2924/00

Abstract: An electronic system includes an electronic device of through-hole mounting type comprising an insulating body for embedding at least a chip on which electronic components are integrated, a plurality of conductive leads projecting from the insulating body for said mounting, and a dissipation plate exposed from the insulating body for transferring heat from said electronic component in operation towards the outside of the insulating body. The electronic system includes a heat sink in contact with said dissipation plate for dissipating said heat. The heat sink comprises a first dissipation element, a second dissipation element, and clamping means for clamping the first dissipation element and the second dissipation element together against the insulating body of said electronic device.

Abstract translation: 一种电子系统，包括通孔安装型电子装置，该电子装置包括绝缘体，用于至少嵌入电子部件一体化的芯片，从用于所述安装的绝缘体突出的多个导电引线以及从该绝缘体露出的散热板 所述绝缘体用于将来自所述电子部件的热量在操作中传递到所述绝缘体的外部。 电子系统包括与所述散热板接触以散热所述热量的散热器。 散热器包括第一耗散元件，第二耗散元件和夹持装置，用于将第一耗散元件和第二耗散元件夹在一起抵靠所述电子器件的绝缘体。