Abstract:
A method for programming a non-volatile memory device of the multi-level type, includes a plurality of transistor cells grouped into memory words and conventionally provided with gate and drain terminals. The method applies different drain voltage values at different threshold values. Such values are directly proportional to the threshold levels to be attained by the individual memory word bits, and effective to provide for a simultaneous attainment of the levels, in a seeking-to manner, of the levels at the end of a limited number of pulses. Advantageously, a constant gate voltage value is concurrently applied to the gate terminals of said cells, such that the cell programming time is unrelated to the threshold level sought.
Abstract:
The column multiplexer is for a memory matrix having memory cells arranged in rows and columns. The multiplexer includes input lines for input signals, a plurality of output lines for electrical connection to the columns of the matrix, a selective connection device for selecting, in a first operation mode, at least one output line of the plurality of output lines in such a way as to connect it selectively to the input lines. In the first operation mode, the selective connection device selects a first group of output lines among the plurality of output lines, including at least three first lines.
Abstract:
A memory system includes a memory matrix formed on a semiconductor structure. The memory matrix includes a first column line and a second column line which are connected electrically to at least one first memory cell to be read. For the reading of the at least one first cell, a first reading voltage can be supplied to the first column line. The memory matrix also includes a third column line distinct from the first column line and from the second column line. The memory matrix further includes generating circuit for supplying, to the third column line and during the reading of the at least one first memory cell, a biasing voltage which can oppose the establishment of an electric current between the first column line and the third column line in the semiconductor structure. The biasing voltage is preferably substantially equal to the first reading voltage.
Abstract:
A pointer circuit for pointing to elements in at least one collection of elements comprises a base pointer adapted to provide a first binary-coded value defining a first address of an element in the collection. The pointer circuit also comprises a binary shift circuit receiving the first binary-coded value provided by the base pointer and a second binary-coded value defining a shift value. The binary shift circuit combines the first and second binary-coded values to provide a third binary-coded value defining a second address of an element in the collection differing from the first address by the shift value. A shift value generator fed by the first binary-coded value generates the second binary-coded value depending on the first binary-coded value, in such a way that a generated shift value takes into account shift values corresponding to first binary-coded values preceding a current first binary-coded value in a prescribed first binary-coded value progression order. The pointer circuit can be expediently exploited for implementing redundancy in a memory.
Abstract:
A memory counter circuit includes a plurality of mutually connected counter stages, an internal address bus interfaced with each one of the counter stages for sending an external address signal to each one of the counter stages, a circuit for loading the external address signal onto the internal address bus, and an enabling circuit for enabling a connection between the internal bus and each one of the counter stages. The enabling circuit may be driven by a true address latch enable signal. The memory counter circuit may further include a circuit for generating the true address latch enable signal starting from an external address latch signal and a fast address latch enable signal for driving the circuit for loading the external address signal onto the internal address bus. A signal generation circuit may also be included for generating clock signals for synchronizing each one of the counter stages. The synchronization signals are preferably not simultaneously active.
Abstract:
A line selector for a matrix of memory elements, for example a word line selector, comprises a plurality of line group selection circuits, each one allowing the selection of a respective group of matrix lines according to an address; each matrix line group includes at least one matrix line. Flag means are associated with each line group, that can be set to declare a pending status of a prescribed operation, for example an erase operation, for the respective matrix line group. Means are provided for entrusting the flag means with the selection of the respective line group during the execution of the prescribed operation, in alternative to the respective line group selection circuit. The flag means enable, when set, the execution of the prescribed operation on the respective matrix line group.
Abstract:
A process for fabricating a dual charge storage location, electrically programmable memory cell, comprising: forming a first dielectric layer over a semiconductor material layer of a first conductivity type; forming a charge trapping material layer over the first dielectric layer; selectively removing the charge trapping material layer from over a central channel region of the semiconductor material layer, thereby leaving two charge trapping material layer portions at sides of the central channel region; masking the central channel region and selectively implanting dopants of a second conductivity type into the semiconductor material layer to form memory cell source/drain regions at sides of the two charge trapping material layer portions; forming a second dielectric layer over the charge trapping material layer; and forming a polysilicon gate over the second dielectric layer, the polysilicon gate being superimposed over the central channel region and the two charge trapping material layer portions.
Abstract:
A semiconductor memory system comprising a memory matrix including a plurality of memory cells arranged in rows and columns and connected to a plurality of column lines, each memory cell of the same column having a first and a second terminal connected to a first and a second column line respectively. Furthermore, the memory system comprises a first and a second conduction line which can be connected to said first and second column lines, and generating means provided with at least a first and a second output line, making available a first and a second reading/writing voltage to said first and second terminal respectively. The memory system also comprises at least a first and a second selection transistor connected to the same command line and having corresponding operative terminals connected directly to the first and to the second output lines respectively and corresponding cell terminals connected directly to the first and to the second conduction lines respectively.
Abstract:
A timing and control structure for a memory, including the timing and control structure includes a first circuit that can recognize, on the basis of control signals supplied to the memory from the exterior, whether a random-access reading is to be executed, the control signals including a first control signal indicative of the presence of an address supplied to the memory from the exterior, and a second control signal that, upon switching edges of a first type, supplies to the control and timing structure a time base for the execution of the random-access readings and, upon switching edges of a second type, supplies a time base for the execution of the sequential readings, a second circuit controlled by the first circuit and upon a random-access reading, generates a first synchronism signal in response to a transition of the first type in the second control signal, a third circuit sensitive to transitions of the second type in the second control signal and which can generate a second synchronism signal upon transitions of the second type, and a fourth circuit controlled by the first circuit to supply a stimulus signal to a timing circuit of the memory, the stimulus signal corresponding to the first synchronism signal for a random-access reading, or to the second synchronism signal for a sequential reading.
Abstract:
An internal addressing structure for a semiconductor memory with at least two memory banks, includes a counter associated for operation with each memory bank and capable of generating sequences of digital codes for addressing locations in the corresponding bank, a first circuit for causing a selective updating of the counters, a second circuit for loading into the counters a common initial digital code, forming part of an initial address supplied to the memory from the outside through an addressing line bus, corresponding to an initial memory location, and a third circuit capable of detecting a first signal, supplied to the memory from the outside and indicating the presence of a digital code on the bus, to cause the common initial digital code to be loaded into the counters. The first circuit means iscapable of identifying, on the basis of the initial address, the bank to which the initial memory location belongs, and of consequently causing the periodic updating of the counters in a sequence which depends on the bank to which the initial memory location belongs, in such a way that successive memory locations preceding or following the initial location are addressed in sequence, each of these successive locations belonging to a corresponding memory bank, according to an interlaced system.