公开(公告)号：US20220005719A1

公开(公告)日：2022-01-06

申请号：US17191018

申请日：2021-03-03

Applicant: Samsung Display Co., Ltd.

Inventor： Won Ho LEE ,  Buem Joon KIM ,  Jong Hyuk KANG ,  Hyun Deok IM ,  Chung Sic CHOI

IPC: H01L21/68 ,  H01L25/075 ,  H01L21/67 ,  H01L23/00

Abstract: An apparatus for aligning dipoles is provided. The apparatus includes: an electric field forming unit including a stage and a probe unit, the probe unit being configured to form an electric field on the stage; an inkjet printing device including an inkjet head, the inkjet head being configured to spray ink including a solvent and dipoles dispersed in the solvent onto the stage; a light irradiation device configured to irradiate light onto the stage; and a temperature control device including a temperature control unit, the temperature control unit being configured to control a temperature of the solvent sprayed on the stage.

公开(公告)号：US20240136208A1

公开(公告)日：2024-04-25

申请号：US18224973

申请日：2023-07-20

Applicant: Samsung Display Co., LTD.

Inventor： Jeong Won HAN ,  Chung Sic CHOI ,  Won Hee OH ,  Han Chun RYU ,  Jae Woo LEE

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67132 ,  H01L21/67144 ,  H01L21/67265 ,  H01L21/67766 ,  H01L25/167

Abstract: A light-emitting element transfer system includes raw film cutting device for forming a transfer member by cutting a raw film, a stretching device for stretching a transfer film with a plurality of light-emitting elements disposed thereon, a circuit board support member for supporting a circuit board and transport head for adsorbing the transfer member and transferring the light-emitting elements on the transfer film onto the circuit board by using the adsorbed transfer member.

公开(公告)号：US20240313153A1

公开(公告)日：2024-09-19

申请号：US18481568

申请日：2023-10-05

Applicant: Samsung Display Co., LTD.

Inventor： Futoshi YOSHIDA ,  Jong Hyup KIM ,  Jin Pyung LEE ,  Chung Sic CHOI

IPC: H01L33/00 ,  G01L1/24 ,  G06T7/90 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/0095 ,  G01L1/24 ,  G06T7/90 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L25/0753 ,  H01L33/62 ,  G06T2207/10024 ,  G06T2207/10056 ,  G06T2207/30148 ,  H01L2224/32227 ,  H01L2224/75283 ,  H01L2224/7592 ,  H01L2224/83005 ,  H01L2224/83203 ,  H01L2224/83908 ,  H01L2924/12041 ,  H01L2924/1426 ,  H01L2933/0066

Abstract: The disclosure provides a pressure detection method of a bonding device and a bonding system. The pressure detection method of a bonding device includes forming a backplane substrate including a light emitting element, disposing a pressure detection sheet on the backplane substrate, transferring the backplane substrate and the pressure detection sheet into a chamber, bonding the light emitting element by pressurizing the pressure detection sheet, photographing the pressure detection sheet, and detecting a color developing area of the pressure detection sheet. In the pressure detection method of the bonding device and the bonding system, it can be inspected whether uniform pressure is applied to a pressure detection sheet.

公开(公告)号：US20240234179A9

公开(公告)日：2024-07-11

申请号：US18224973

申请日：2023-07-21

Applicant: Samsung Display Co., LTD.

Inventor： Jeong Won HAN ,  Chung Sic CHOI ,  Won Hee OH ,  Han Chun RYU ,  Jae Woo LEE

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67132 ,  H01L21/67144 ,  H01L21/67265 ,  H01L21/67766 ,  H01L25/167

Abstract: A light-emitting element transfer system includes raw film cutting device for forming a transfer member by cutting a raw film, a stretching device for stretching a transfer film with a plurality of light-emitting elements disposed thereon, a circuit board support member for supporting a circuit board and transport head for adsorbing the transfer member and transferring the light-emitting elements on the transfer film onto the circuit board by using the adsorbed transfer member.

公开(公告)号：US20230386878A1

公开(公告)日：2023-11-30

申请号：US18448869

申请日：2023-08-11

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Won Ho LEE ,  Buem Joon KIM ,  Jong Hyuk KANG ,  Hyun Deok IM ,  Chung Sic CHOI

IPC: H01L21/68 ,  H01L25/075 ,  H01L21/67 ,  H01L23/00

CPC classification number: H01L21/68 ,  H01L25/0753 ,  H01L21/6715 ,  H01L24/75 ,  H01L2224/75283 ,  H01L2924/12041 ,  H01L2224/75701 ,  H01L2224/75251 ,  H01L2224/75501 ,  H01L2224/759 ,  H01L2224/75252 ,  H01L2224/75655 ,  B41J2/095

Abstract: An apparatus for aligning dipoles is provided. The apparatus includes: an electric field forming unit including a stage and a probe unit, the probe unit being configured to form an electric field on the stage; an inkjet printing device including an inkjet head, the inkjet head being configured to spray ink including a solvent and dipoles dispersed in the solvent onto the stage; a light irradiation device configured to irradiate light onto the stage; and a temperature control device including a temperature control unit, the temperature control unit being configured to control a temperature of the solvent sprayed on the stage.

公开(公告)号：US20220165928A1

公开(公告)日：2022-05-26

申请号：US17528745

申请日：2021-11-17

Applicant: Samsung Display Co., LTD.

Inventor： Jin Won BAEK ,  Lae Ho KIM ,  Sang Woong BAEK ,  Young Geun CHO ,  Chung Sic CHOI

IPC: H01L33/62 ,  H01L33/00 ,  H01L25/16

Abstract: An apparatus for manufacturing a display device includes a stage, a first electric field applying module including first probe pins and disposed on a first side of the stage, a light irradiation module including light-emitting elements and disposed on the stage, and a first voltage output module that outputs an emission driving signal that drives the light-emitting elements, outputs a first alignment signal to one of the first probe pins, and outputs a second alignment signal to another one of the first probe pins.