公开(公告)号：US20240363598A1

公开(公告)日：2024-10-31

申请号：US18625111

申请日：2024-04-02

Applicant: Samsung Display Co., LTD.

Inventor： Jeong Won HAN ,  Won Hee OH

IPC: H01L25/075

CPC classification number: H01L25/0753

Abstract: A transfer device of a light-emitting element, the transfer device including: a transferer including a transferring portion, a folding portion at an edge, a stamp layer having a tacky or adhesive surface, and a base layer above one surface of the stamp layer; a protective film above an other surface of the stamp layer, and defining an incision groove with the transferring portion at a center thereof on a plane; an inverter for inverting up, down, left, and right sides of the transferer, and including a support chuck configured to adsorb the protective film overlapping the transferring portion, and a side chuck configured to adsorb the protective film overlapping the folding portion; a transfer head having a head chuck configured to be adsorbed to the base layer, and movable up, down, left, and right; and a folder including a detachable first clamp.

公开(公告)号：US20240234179A9

公开(公告)日：2024-07-11

申请号：US18224973

申请日：2023-07-21

Applicant: Samsung Display Co., LTD.

Inventor： Jeong Won HAN ,  Chung Sic CHOI ,  Won Hee OH ,  Han Chun RYU ,  Jae Woo LEE

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67132 ,  H01L21/67144 ,  H01L21/67265 ,  H01L21/67766 ,  H01L25/167

Abstract: A light-emitting element transfer system includes raw film cutting device for forming a transfer member by cutting a raw film, a stretching device for stretching a transfer film with a plurality of light-emitting elements disposed thereon, a circuit board support member for supporting a circuit board and transport head for adsorbing the transfer member and transferring the light-emitting elements on the transfer film onto the circuit board by using the adsorbed transfer member.

公开(公告)号：US20240113252A1

公开(公告)日：2024-04-04

申请号：US18464038

申请日：2023-09-08

Applicant: Samsung Display Co., LTD.

Inventor： Jeong Won HAN ,  Won Hee OH

IPC: H01L33/00

CPC classification number: H01L33/0075

Abstract: An apparatus for transferring light emitting elements includes: a transfer member including a stamp layer having an adhesive property and a base layer on a first surface of the stamp layer, the transfer member having a transfer portion, a folding portion, and an incision groove at a boundary between the transfer portion and the folding portion; a protective film on a second surface of the stamp layer, the protective film having an incision groove defining a transfer area and a folding area; an inversion member supporting the transfer member; and a transfer head including a chuck configured to adsorb to the base layer and to move the transfer member vertically and horizontally. The transfer portion is at a center with respect to the incision groove, and the folding portion is at an outer side of the incision groove with respect to the transfer portion.

公开(公告)号：US20240136208A1

公开(公告)日：2024-04-25

申请号：US18224973

申请日：2023-07-20

Applicant: Samsung Display Co., LTD.

Inventor： Jeong Won HAN ,  Chung Sic CHOI ,  Won Hee OH ,  Han Chun RYU ,  Jae Woo LEE

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67132 ,  H01L21/67144 ,  H01L21/67265 ,  H01L21/67766 ,  H01L25/167

Abstract: A light-emitting element transfer system includes raw film cutting device for forming a transfer member by cutting a raw film, a stretching device for stretching a transfer film with a plurality of light-emitting elements disposed thereon, a circuit board support member for supporting a circuit board and transport head for adsorbing the transfer member and transferring the light-emitting elements on the transfer film onto the circuit board by using the adsorbed transfer member.

公开(公告)号：US20240072027A1

公开(公告)日：2024-02-29

申请号：US18453190

申请日：2023-08-21

Applicant: Samsung Display Co., LTD.

Inventor： Jeong Won HAN ,  Won Hee OH

IPC: H01L25/16 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/95 ,  H01L24/05 ,  H01L24/08 ,  H01L2221/68381 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05138 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/0518 ,  H01L2224/05573 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05686 ,  H01L2224/05693 ,  H01L2224/08145 ,  H01L2224/80006 ,  H01L2224/80024 ,  H01L2224/80224 ,  H01L2224/80805 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2224/83005 ,  H01L2224/95001 ,  H01L2924/01006 ,  H01L2924/0106 ,  H01L2924/0549 ,  H01L2924/12041

Abstract: The present disclosure may provide a method of fabricating a display panel, the method includes picking up, by a transfer head, a transfer member located on a support member, detaching a light-emitting element from a donor substrate by attaching the transfer member picked up by the transfer head to the light-emitting element on the donor substrate to lift the light-emitting element, aligning, by the transfer head, the light-emitting element attached to the transfer member on a circuit board, and detaching the transfer member from the transfer head, bonding the light-emitting element attached to the transfer member onto the circuit board and separating, by the transfer head, the transfer member from the light-emitting element bonded to the circuit board to remove the transfer member.