公开(公告)号：US20230209197A1

公开(公告)日：2023-06-29

申请号：US17983470

申请日：2022-11-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Su Bong JANG ,  Sang Jong LEE ,  Hee Soo YOON ,  Seung Jae SONG

IPC: H04N5/232 ,  G02B7/08 ,  H02K41/035 ,  H04N5/225

CPC classification number: H04N5/23287 ,  G02B7/08 ,  H02K41/0356 ,  H04N5/2257 ,  H04N5/2253

Abstract: A sensor shifting actuator is provided. The sensor shifting actuator include a first movable body in which an image sensor having an imaging surface is disposed, a fixed body in which the first movable body is disposed to be movable in first and second directions parallel to the imaging surface, a driving unit configured to provide a driving force to the first movable body, and a position sensing unit configured to sense a position of the first movable body and including a sensing coil disposed on any one of the first movable body and the fixed body and a sensing yoke unit disposed on the other thereof, wherein the sensing yoke unit includes a plurality of sensing yokes spaced apart from each other in a direction orthogonal to the imaging surface, and each sensing yoke is configured to change in width in a moving direction of the first movable body.

公开(公告)号：US20230156310A1

公开(公告)日：2023-05-18

申请号：US17967222

申请日：2022-10-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Su Bong JANG ,  Sang Jong LEE ,  Hee Soo YOON ,  Tae Ho YUN ,  Ju Ho KIM

IPC: H04N5/225 ,  H04N5/232 ,  H02K11/215 ,  H02K41/035

CPC classification number: H04N5/2253 ,  H04N5/23287 ,  H04N5/23258 ,  H02K11/215 ,  H02K41/0354 ,  H02K2201/18

Abstract: A sensor shifting module includes a fixed body; a movable body movably, disposed in the fixed body, comprising an image sensor having an imaging plane oriented in a first direction; a substrate configured to deform based on a movement of the movable body with respect to the fixed body; and a driver, configured to move the movable body in a direction orthogonal to the first direction, comprising a driving coil coupled to one of the fixed body and the movable body, and a driving yoke coupled to another of the fixed body and the movable body. The driving yoke is disposed to oppose the driving coil in the direction orthogonal to the first direction. When current is applied to the driving coil, the movable body is configured to move in the direction orthogonal to the first direction by electromagnetic interaction between the driving coil and the driving yoke.

公开(公告)号：US20210173226A1

公开(公告)日：2021-06-10

申请号：US17096079

申请日：2020-11-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sang Jong LEE ,  Su Bong JANG ,  Young Bok YOON ,  Seung Hee HONG ,  Nam Ki PARK ,  Hee Soo YOON

IPC: G02B27/64 ,  G02B7/04 ,  G03B5/02 ,  H02K41/035

Abstract: A camera module includes: a housing in which a lens module is accommodated; and a shake correction portion including first and second movable yokes mounted on the lens module and first and second coil portions disposed to oppose the first and second movable yokes, respectively. The first coil portion is configured to attract the first movable yoke in response to power being applied to the first coil portion. The second coil portion is configured to attract the second movable yoke in response to power being applied to the second coil portion.

公开(公告)号：US20200168591A1

公开(公告)日：2020-05-28

申请号：US16454907

申请日：2019-06-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chul Kyu KIM ,  Dae Hyun PARK ,  Jung Ho SHIM ,  Jae Hyun LIM ,  Mi Ja HAN ,  Sang Jong LEE ,  Han KIM

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/528

Abstract: A semiconductor package includes a frame having a through-hole, and a first semiconductor chip disposed in the through-hole of the frame and having an active surface on which a connection pad is disposed, an inactive surface opposing the active surface, and a side surface connecting the active and inactive surfaces. A first encapsulant covers at least a portion of each of the inactive surface and the side surface of the first semiconductor chip. A connection structure has a first surface having disposed thereon the active surface of the first semiconductor chip, and includes a redistribution layer electrically connected to the connection pad of the first semiconductor chip. A first passive component is disposed on a second surface of the connection structure opposing the first surface, the first passive component being electrically connected to the redistribution layer and having a thickness greater than a thickness of the first semiconductor chip.

公开(公告)号：US20190237861A1

公开(公告)日：2019-08-01

申请号：US16185118

申请日：2018-11-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Sung Yong AN ,  Sang Jong LEE ,  Seong Hee CHOI ,  Kyu Bum HAN ,  Jeong Ki RYOO ,  Byeong Cheol MOON ,  Chang Hak CHOI

IPC: H01Q1/38 ,  H01Q15/14 ,  H01Q1/48 ,  H01Q9/04

CPC classification number: H01Q1/38 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/0407 ,  H01Q15/14

Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.

公开(公告)号：US20190080843A1

公开(公告)日：2019-03-14

申请号：US16004049

申请日：2018-06-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Su Bong JANG ,  Seung Hee HONG ,  Hee Soo YOON ,  Sang Jong LEE ,  Min Ki JUNG

IPC: H01G4/012 ,  H01G4/228 ,  H01G4/30

CPC classification number: H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and first and second external electrodes disposed on one surface of the body and respectively connected to the first and second internal electrodes. The first internal electrode includes a first main portion and a first lead out portion connecting the first main portion and the first external electrode, the second internal electrode includes a second main portion and a second lead out portion connecting the second main portion and the second external electrode, and the second main portion has a greater area than the first main portion and includes a corner portion defining an open space to compensate for a capacitance formed by an area in which the first lead out portion and the second main portion overlap each other.

公开(公告)号：US20180174758A1

公开(公告)日：2018-06-21

申请号：US15664931

申请日：2017-07-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Jong LEE ,  Han KIM ,  Seung Hee HONG ,  Min Ki JUNG ,  Su Bong JANG

IPC: H01G4/40 ,  H01G4/232 ,  H01G4/012 ,  H01G4/30 ,  H05K1/11 ,  H05K1/18 ,  H01F27/28 ,  H01F27/29 ,  H01F27/40

CPC classification number: H01G4/40 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F27/32 ,  H01F27/40 ,  H01F2027/2809 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/1006

Abstract: A composite electronic component includes a body including a capacitor unit and an inductor unit and having a plurality of insulating layers stacked in a first direction perpendicular to a mounting surface of the body. A plurality of external electrodes are on external surfaces of the body. The capacitor unit includes first and second internal electrodes alternately stacked with insulating layers interposed therebetween. The inductor unit includes a coil including coil patterns having a spiral shape, on respective insulating layers, and connected together.

公开(公告)号：US20180174750A1

公开(公告)日：2018-06-21

申请号：US15675446

申请日：2017-08-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hee Soo YOON ,  Su Bong JANG ,  Sang Jong LEE ,  Seung Hee HONG

IPC: H01G4/06 ,  H01G4/248 ,  H01G4/33

Abstract: A thin film capacitor includes a body including a dielectric layer, a first internal electrode layer and a second internal electrode layer, a melting point of a material included in the first internal electrode layer being lower than a melting point of a material included in the second internal electrode layer, and a first external electrode and a second external electrode disposed on an upper surface of the body, the second internal electrode layer being disposed on an upper surface of the first internal electrode layer and a lower surface of the first internal electrode layer opposing the upper surface of the first internal electrode layer.

公开(公告)号：US20170194089A1

公开(公告)日：2017-07-06

申请号：US15270484

申请日：2016-09-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Su Bong JANG ,  Won Gi KIM ,  Han KIM ,  Sang Jong LEE

IPC: H01F27/29 ,  H01F27/28

Abstract: A coil component includes: a coil including connection pads; a first bonding wire connected to a first connection pad among the connection pads; and a second bonding wire connected to a second connection pad among the connection pads.

公开(公告)号：US20230343519A1

公开(公告)日：2023-10-26

申请号：US17875988

申请日：2022-07-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Jong LEE ,  Min Cheol PARK ,  Chi Hyeon JEONG ,  Seong Hwan LEE ,  Hyun Sang KWAK

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/008 ,  H01G2/14 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/008 ,  H01G2/14 ,  H01G4/12

Abstract: A capacitor component, includes: a body including first and second surfaces opposing each other in a first direction, wherein, in the body, a first internal electrode, a second internal electrode, a first dielectric layer interposed between the first and second internal electrodes, and a second dielectric layer disposed on the second internal electrode are wound in the first direction as a winding axis; a first external electrode disposed on the first surface and connected to the first internal electrode; and a second external electrode disposed on the second surface and connected to the second internal electrode. The first internal electrode and the second internal electrode include different metals.