公开(公告)号：US20250081343A1

公开(公告)日：2025-03-06

申请号：US18435155

申请日：2024-02-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Hyeon JEONG ,  Seok Hwan KIM ,  Dong Hyeon LEE ,  Hyun Sang KWAK

IPC: H05K1/11

Abstract: The present disclosure relates to a printed circuit board including: an insulating layer, a through-hole penetrating the insulating layer from an upper surface to a lower surface of the insulating layer and having an inclined wall surface; a metal ball disposed within the through-hole and in contact with the inclined wall surface; and a metal via filling the through-hole and surrounding the metal ball.

公开(公告)号：US20250016917A1

公开(公告)日：2025-01-09

申请号：US18640207

申请日：2024-04-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Uk LEE ,  Chi Hyeon JEONG ,  Youn Gyu HAN

IPC: H05K1/02 ,  H05K1/11

Abstract: The present disclosure relates to a printed circuit board including: an insulating layer; and a plurality of wiring layers disposed in the insulating layer, wherein the plurality of wiring layers include a first wiring layer, a second wiring layer disposed on the first wiring layer, and a third wiring layer disposed on the second wiring layer, the second wiring layer is thicker than each of the first and third wiring layers, and the second wiring layer includes one or microcircuit patterns and has an aspect ratio, which is a ratio of a height to a line width, being 2.4 to 3.6.

公开(公告)号：US20240332208A1

公开(公告)日：2024-10-03

申请号：US18226994

申请日：2023-07-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Hyeon JEONG ,  Hyun Sang KWAK ,  Seong Hwan LEE

IPC: H01L23/552 ,  H01L23/13 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2924/014

Abstract: A printed circuit board includes a substrate portion including a first insulating layer, a first wiring layer disposed on or within the first insulating layer, and a cavity penetrating through at least a portion of the first insulating layer; a connection structure disposed within the cavity of the substrate portion, and including a second insulating layer, a second wiring layer disposed on or within the second insulating layer, and a metal layer disposed on a lower surface and a side surface of the second insulating layer, wherein the metal layer is disposed on an outermost side of the connection structure.

公开(公告)号：US20250098067A1

公开(公告)日：2025-03-20

申请号：US18592291

申请日：2024-02-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Hyeon JEONG ,  Jin Uk LEE ,  Hyun Sang KWAK ,  Seok Hwan KIM

IPC: H05K1/11 ,  H05K3/42

Abstract: The present disclosure relates to a printed circuit board including: an insulating layer; a through-hole penetrating between an upper surface and a lower surface of the insulating layer opposing in a thickness direction; a metal wiring disposed inside the through-hole; and a metal via filling the through-hole and covering the metal wire.

公开(公告)号：US20240413056A1

公开(公告)日：2024-12-12

申请号：US18433895

申请日：2024-02-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Hyeon JEONG ,  Hyun Sang KWAK ,  Seong Hwan LEE ,  Hyun Goo JEON

IPC: H01L23/48 ,  H01L23/64

Abstract: A capacitor component includes a substrate having first and second surfaces opposing each other, a first interlayer disposed on the first surface of the substrate, the first interlayer including a first trench, a first trench capacitor disposed in the first trench, a second interlayer disposed on the second surface of the substrate, the second interlayer including a second trench, a second trench capacitor disposed in the second trench, and a through-via passing through the substrate to connect the first trench capacitor and the second trench capacitor to each other.

公开(公告)号：US20240387344A1

公开(公告)日：2024-11-21

申请号：US18240574

申请日：2023-08-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Hyeon JEONG ,  Hyun Sang KWAK ,  Seong Hwan LEE ,  Seok Hwan KIM

IPC: H01L23/498 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18

Abstract: A circuit board includes a first glass layer, a first wiring layer embedded in an upper portion of the first glass layer, and a second wiring layer embedded in a lower portion of the first glass layer. At least one of the first and second wiring layers includes a plurality of embedded patterns having different thicknesses.

公开(公告)号：US20230343519A1

公开(公告)日：2023-10-26

申请号：US17875988

申请日：2022-07-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Jong LEE ,  Min Cheol PARK ,  Chi Hyeon JEONG ,  Seong Hwan LEE ,  Hyun Sang KWAK

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/008 ,  H01G2/14 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/008 ,  H01G2/14 ,  H01G4/12

Abstract: A capacitor component, includes: a body including first and second surfaces opposing each other in a first direction, wherein, in the body, a first internal electrode, a second internal electrode, a first dielectric layer interposed between the first and second internal electrodes, and a second dielectric layer disposed on the second internal electrode are wound in the first direction as a winding axis; a first external electrode disposed on the first surface and connected to the first internal electrode; and a second external electrode disposed on the second surface and connected to the second internal electrode. The first internal electrode and the second internal electrode include different metals.

公开(公告)号：US20250056119A1

公开(公告)日：2025-02-13

申请号：US18767590

申请日：2024-07-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sang Yong KIM ,  Seok Hwan KIM ,  Chi Hyeon JEONG

IPC: H04N23/68 ,  H04N23/51 ,  H04N23/52

Abstract: An actuator for optical image stabilization includes a fixed frame; a moving frame, accommodated in the fixed frame, configured to move relatively to the fixed frame on a plane perpendicular to an optical axis; and a sensor substrate, on which an image sensor is disposed, comprising a fixed portion coupled to the fixed frame, a moving portion comprising the image sensor and coupled to the moving frame, and a connecting portion disposed between the moving portion and the fixed portion to support movement of the moving portion. The moving portion includes a heat dissipation member dissipating heat generated from the image sensor, and the heat dissipation member includes a substrate having a through-hole, and a conductive electrode filling the through-hole.

公开(公告)号：US20250046725A1

公开(公告)日：2025-02-06

申请号：US18766911

申请日：2024-07-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok Hwan KIM ,  Chi Hyeon JEONG ,  Hyun Sang KWAK ,  Hyung Joon KIM ,  Jung Ho SHIM

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/528 ,  H01L25/18

Abstract: A semiconductor package includes: a package board; a first semiconductor chip disposed on the package board, and having a first recess portion adjacent to a first front surface of the first semiconductor chip facing the package board; a second semiconductor chip disposed side by side with the first semiconductor chip on the package board, and having a second recess portion adjacent to a second front surface of the second semiconductor chip facing the package board; and an interconnect bridge disposed on the first and second front surfaces, and at least partially disposed in each of the first and second recess portions.

公开(公告)号：US20240332199A1

公开(公告)日：2024-10-03

申请号：US18226988

申请日：2023-07-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Hyeon JEONG ,  Seong Hwan LEE ,  Hyun Sang KWAK ,  Min Cheol PARK ,  Sang Jong LEE

IPC: H01L23/538 ,  H01L21/48

CPC classification number: H01L23/5385 ,  H01L21/4846 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2924/014

Abstract: A printed circuit board includes a substrate having an upper surface at which a plurality of first pads are disposed, and an interconnect structure including an encapsulant, a plurality of second pads disposed at an upper surface of the encapsulant, and a plurality of metal wires disposed in the encapsulant and respectively connected to at least one of the plurality of second pads, the interconnect structure disposed on an upper side of the substrate. At least a portion of an upper surface of each of the plurality of first and second pads is exposed in an upward direction from the upper surface of each of the substrate and the encapsulant.