公开(公告)号：US20240332199A1

公开(公告)日：2024-10-03

申请号：US18226988

申请日：2023-07-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Hyeon JEONG ,  Seong Hwan LEE ,  Hyun Sang KWAK ,  Min Cheol PARK ,  Sang Jong LEE

IPC: H01L23/538 ,  H01L21/48

CPC classification number: H01L23/5385 ,  H01L21/4846 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2924/014

Abstract: A printed circuit board includes a substrate having an upper surface at which a plurality of first pads are disposed, and an interconnect structure including an encapsulant, a plurality of second pads disposed at an upper surface of the encapsulant, and a plurality of metal wires disposed in the encapsulant and respectively connected to at least one of the plurality of second pads, the interconnect structure disposed on an upper side of the substrate. At least a portion of an upper surface of each of the plurality of first and second pads is exposed in an upward direction from the upper surface of each of the substrate and the encapsulant.

公开(公告)号：US20230307179A1

公开(公告)日：2023-09-28

申请号：US17851542

申请日：2022-06-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Cheol PARK ,  Sang Jong LEE ,  Hyung Joon KIM ,  Hyun Sang KWAK ,  Chi Hyeon JEONG ,  Seong Hwan LEE

IPC: H01G4/005 ,  H01G4/30 ,  H01G4/228 ,  H01G4/12 ,  H05K1/18

CPC classification number: H01G4/005 ,  H01G4/30 ,  H01G4/228 ,  H01G4/1227 ,  H05K1/182 ,  H05K2201/10015

Abstract: A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and respectively disposed on first and second surfaces of the body, the first and second surfaces opposing each other. The body further includes a first via electrode, connecting the at least one first internal electrode and the first external electrode to each other in the first direction, and a second via electrode connecting the at least one second internal electrode and the second external electrode to each other in the first direction.

公开(公告)号：US20240413056A1

公开(公告)日：2024-12-12

申请号：US18433895

申请日：2024-02-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Hyeon JEONG ,  Hyun Sang KWAK ,  Seong Hwan LEE ,  Hyun Goo JEON

IPC: H01L23/48 ,  H01L23/64

Abstract: A capacitor component includes a substrate having first and second surfaces opposing each other, a first interlayer disposed on the first surface of the substrate, the first interlayer including a first trench, a first trench capacitor disposed in the first trench, a second interlayer disposed on the second surface of the substrate, the second interlayer including a second trench, a second trench capacitor disposed in the second trench, and a through-via passing through the substrate to connect the first trench capacitor and the second trench capacitor to each other.

公开(公告)号：US20240387344A1

公开(公告)日：2024-11-21

申请号：US18240574

申请日：2023-08-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Hyeon JEONG ,  Hyun Sang KWAK ,  Seong Hwan LEE ,  Seok Hwan KIM

IPC: H01L23/498 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18

Abstract: A circuit board includes a first glass layer, a first wiring layer embedded in an upper portion of the first glass layer, and a second wiring layer embedded in a lower portion of the first glass layer. At least one of the first and second wiring layers includes a plurality of embedded patterns having different thicknesses.

公开(公告)号：US20230343519A1

公开(公告)日：2023-10-26

申请号：US17875988

申请日：2022-07-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Jong LEE ,  Min Cheol PARK ,  Chi Hyeon JEONG ,  Seong Hwan LEE ,  Hyun Sang KWAK

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/008 ,  H01G2/14 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/008 ,  H01G2/14 ,  H01G4/12

Abstract: A capacitor component, includes: a body including first and second surfaces opposing each other in a first direction, wherein, in the body, a first internal electrode, a second internal electrode, a first dielectric layer interposed between the first and second internal electrodes, and a second dielectric layer disposed on the second internal electrode are wound in the first direction as a winding axis; a first external electrode disposed on the first surface and connected to the first internal electrode; and a second external electrode disposed on the second surface and connected to the second internal electrode. The first internal electrode and the second internal electrode include different metals.

公开(公告)号：US20220074731A1

公开(公告)日：2022-03-10

申请号：US17101070

申请日：2020-11-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Su Bong JANG ,  Hee Soo YOON ,  Sang Jong LEE ,  Seung Jae SONG ,  Seong Hwan LEE

IPC: G01B7/30 ,  G01D5/20 ,  G04G21/00 ,  G04B3/04

Abstract: A rotor apparatus is provided. The rotor apparatus includes a rotor, configured to rotate around a rotational axis, an angular position identification layer configured to surround surface of the rotor, and configured to rotate with the rotor, and configured to have a width that varies based on an angular position of the rotor, and a permeability layer configured to surround the surface of the rotor, and configured to have a higher permeability than a permeability of the rotor.

公开(公告)号：US20240332208A1

公开(公告)日：2024-10-03

申请号：US18226994

申请日：2023-07-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Hyeon JEONG ,  Hyun Sang KWAK ,  Seong Hwan LEE

IPC: H01L23/552 ,  H01L23/13 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2924/014

Abstract: A printed circuit board includes a substrate portion including a first insulating layer, a first wiring layer disposed on or within the first insulating layer, and a cavity penetrating through at least a portion of the first insulating layer; a connection structure disposed within the cavity of the substrate portion, and including a second insulating layer, a second wiring layer disposed on or within the second insulating layer, and a metal layer disposed on a lower surface and a side surface of the second insulating layer, wherein the metal layer is disposed on an outermost side of the connection structure.