公开(公告)号：US20150017748A1

公开(公告)日：2015-01-15

申请号：US14502463

申请日：2014-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won Soo JI ,  Choo Ho KIM ,  Sung Hoon OH ,  Min Hwan KIM ,  Beom Seok SHIN

IPC: H01L21/66 ,  H01L33/48

CPC classification number: H01L22/14 ,  G01R31/2601 ,  G01R31/2635 ,  H01L33/48 ,  H01L2933/0033 ,  H01L2933/005 ,  Y10T29/51

Abstract: An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.

Abstract translation: 一种用于制造发光二极管（LED）封装的装置，包括：加热单元，其将引线框架状态中的LED封装阵列加热，其中安装多个LED封装件以阵列设置在引线框架上; 测试单元，通过向由加热单元加热的LED封装阵列施加电压或电流来测试LED封装阵列中的每个LED封装的工作状态; 以及切割单元，根据测试单元的测试结果，仅将被确定为功能产品的LED封装或从引线框确定为缺陷产品的LED封装以将其去除。

公开(公告)号：US20180040519A1

公开(公告)日：2018-02-08

申请号：US15403330

申请日：2017-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae Seo PARK ,  Song Ho JEONG ,  Oh Seok KWON ,  Jong Tae KIM ,  Choo Ho KIM

IPC: H01L21/66 ,  G01N21/95 ,  G01N21/64 ,  H01L33/56

CPC classification number: H01L22/24 ,  G01N21/64 ,  G01N21/643 ,  G01N21/6452 ,  G01N21/6456 ,  G01N21/8851 ,  G01N21/95 ,  G01N2021/9511 ,  G01N2201/062 ,  H01L33/56 ,  H01L2933/0033

Abstract: A test apparatus includes a lighting unit radiating light on a to-be-tested object having a light transmitting resin containing a light conversion material; a camera unit obtaining an image of the to-be-tested object while the light transmitting resin is emitted by receiving light emitted by the lighting unit; and a controller determining whether the to-be-tested object is defective by calculating gray values from the image obtained by the camera unit.

公开(公告)号：US20150251228A1

公开(公告)日：2015-09-10

申请号：US14719301

申请日：2015-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Kyu BANG ,  Sung Don KWAK ,  Choo Ho KIM ,  Won Soo JI

IPC: B08B5/02 ,  H01L21/687 ,  H01L21/673 ,  H01L21/677 ,  B08B1/00 ,  H01L21/67

CPC classification number: B08B5/02 ,  B08B1/002 ,  H01L21/67051 ,  H01L21/6719 ,  H01L21/67346 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/68764 ,  H01L21/68771

Abstract: There are provided a wafer holder cleaning apparatus and a film deposition system including the same, the wafer holder cleaning apparatus including a housing part including an entrance into and out of which a wafer holder is carried, a door part selectively opening and closing the entrance, a support part provided within the housing part and having the wafer holder disposed thereon, the wafer holder being carried into the housing part through the entrance, and a cleaning part cleaning a surface of the wafer holder.

Abstract translation: 提供了一种晶片支架清洁装置和包括该晶片支架清洁装置的薄膜沉积系统，所述晶片支架清洁装置包括壳体部分，壳体部分包括进入和离开晶片保持器的入口，门部选择性地打开和关闭入口， 设置在所述壳体部分内并具有设置在其上的所述晶片保持器的支撑部，所述晶片保持器通过所述入口被承载到所述壳体部分中;以及清洁部，其清洁所述晶片保持器的表面。

公开(公告)号：US20140130732A1

公开(公告)日：2014-05-15

申请号：US13843203

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Kyu BANG ,  Sung Don KWAK ,  Choo Ho KIM ,  Won Soo JI

IPC: H01L21/67

CPC classification number: B08B5/02 ,  B08B1/002 ,  H01L21/67051 ,  H01L21/6719 ,  H01L21/67346 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/68764 ,  H01L21/68771

Abstract: There are provided a wafer holder cleaning apparatus and a film deposition system including the same, the wafer holder cleaning apparatus including a housing part including an entrance into and out of which a wafer holder is carried, a door part selectively opening and closing the entrance, a support part provided within the housing part and having the wafer holder disposed thereon, the wafer holder being carried into the housing part through the entrance, and a cleaning part cleaning a surface of the wafer holder.

Abstract translation: 提供了一种晶片支架清洁装置和包括该晶片支架清洁装置的薄膜沉积系统，所述晶片支架清洁装置包括壳体部分，壳体部分包括进入和离开晶片保持器的入口，门部选择性地打开和关闭入口， 设置在所述壳体部分内并具有设置在其上的所述晶片保持器的支撑部，所述晶片保持器通过所述入口被承载到所述壳体部分中;以及清洁部，其清洁所述晶片保持器的表面。