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12 条记录 (耗时 0.02 秒)

    OPTICAL DEVICE AND LIGHT SOURCE MODULE INCLUDING THE SAME
    1.
    发明申请
    OPTICAL DEVICE AND LIGHT SOURCE MODULE INCLUDING THE SAME 有权
    光学装置和光源模块，包括它们

    公开(公告)号：US20170074484A1

    公开(公告)日：2017-03-16

    申请号：US15147307

    申请日：2016-05-05

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Sang Woo HA ,  Jong Pil WON ,  Won Soo JI

    IPC分类号： F21V5/04 ,  F21K99/00

    CPC分类号： F21V5/048 ,  F21V17/005 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B7/022 ,  G02B17/00 ,  G02B19/0014

    摘要： An optical device and a light source module including the same are provided. The optical device includes a first surface including an incident portion through which light that is emitted from a light source is incident, and a second surface through which the light incident through the incident portion is emitted. The incident portion may include a curved surface that is recessed toward the second surface, and a pointed vertex to which the curved surface is recessed, the pointed vertex being in a central portion of the optical device, and the central portion being through which an optical axis of the optical device passes.

    摘要翻译： 提供了一种光学装置和包括该光学装置的光源模块。 光学装置包括：第一表面，包括入射部分，通过该入射部分从光源发射的光入射;以及第二表面，通过入射部分入射的光被射出。 入射部分可以包括朝向第二表面凹陷的弯曲表面，以及弯曲表面凹入的尖顶点，尖顶部位于光学器件的中心部分，中心部分通过光学器件 光学装置的轴线通过。

    APPARATUS AND METHOD FOR MANUFACTURING LED PACKAGE
    2.
    发明申请
    APPARATUS AND METHOD FOR MANUFACTURING LED PACKAGE 审中-公开
    用于制造LED封装的装置和方法

    公开(公告)号：US20150017748A1

    公开(公告)日：2015-01-15

    申请号：US14502463

    申请日：2014-09-30

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Won Soo JI ,  Choo Ho KIM ,  Sung Hoon OH ,  Min Hwan KIM ,  Beom Seok SHIN

    IPC分类号： H01L21/66 ,  H01L33/48

    CPC分类号： H01L22/14 ,  G01R31/2601 ,  G01R31/2635 ,  H01L33/48 ,  H01L2933/0033 ,  H01L2933/005 ,  Y10T29/51

    摘要： An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.

    摘要翻译： 一种用于制造发光二极管（LED）封装的装置，包括：加热单元，其将引线框架状态中的LED封装阵列加热，其中安装多个LED封装件以阵列设置在引线框架上; 测试单元，通过向由加热单元加热的LED封装阵列施加电压或电流来测试LED封装阵列中的每个LED封装的工作状态; 以及切割单元，根据测试单元的测试结果，仅将被确定为功能产品的LED封装或从引线框确定为缺陷产品的LED封装以将其去除。

    WAFER HOLDER CLEANING APPARATUS AND FILM DEPOSITION SYSTEM INCLUDING THE SAME
    4.
    发明申请
    WAFER HOLDER CLEANING APPARATUS AND FILM DEPOSITION SYSTEM INCLUDING THE SAME 审中-公开
    包括其相同的滤架清洁装置和薄膜沉积系统

    公开(公告)号：US20140130732A1

    公开(公告)日：2014-05-15

    申请号：US13843203

    申请日：2013-03-15

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Sang Kyu BANG ,  Sung Don KWAK ,  Choo Ho KIM ,  Won Soo JI

    IPC分类号： H01L21/67

    CPC分类号： B08B5/02 ,  B08B1/002 ,  H01L21/67051 ,  H01L21/6719 ,  H01L21/67346 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/68764 ,  H01L21/68771

    摘要： There are provided a wafer holder cleaning apparatus and a film deposition system including the same, the wafer holder cleaning apparatus including a housing part including an entrance into and out of which a wafer holder is carried, a door part selectively opening and closing the entrance, a support part provided within the housing part and having the wafer holder disposed thereon, the wafer holder being carried into the housing part through the entrance, and a cleaning part cleaning a surface of the wafer holder.

    摘要翻译： 提供了一种晶片支架清洁装置和包括该晶片支架清洁装置的薄膜沉积系统，所述晶片支架清洁装置包括壳体部分，壳体部分包括进入和离开晶片保持器的入口，门部选择性地打开和关闭入口， 设置在所述壳体部分内并具有设置在其上的所述晶片保持器的支撑部，所述晶片保持器通过所述入口被承载到所述壳体部分中;以及清洁部，其清洁所述晶片保持器的表面。

    LIGHT SOURCE UNIT AND DISPLAY DEVICE INCLUDING THE SAME
    8.
    发明申请
    LIGHT SOURCE UNIT AND DISPLAY DEVICE INCLUDING THE SAME 审中-公开
    光源单元和包括其的显示装置

    公开(公告)号：US20140320781A1

    公开(公告)日：2014-10-30

    申请号：US14245123

    申请日：2014-04-04

    申请人： Samsung Electronics Co., Ltd.

    发明人： Hun Yong PARK ,  Won Soo JI

    IPC分类号： F21K99/00 ,  G02F1/1335

    CPC分类号： G02F1/133603 ,  F21K9/233 ,  F21V5/04 ,  F21Y2115/10 ,  G02B19/0014 ,  G02B19/0028 ,  G02B19/0061 ,  G02F2001/133607

    摘要： A light source unit including a light emitting device emitting light and an optical device including a first surface having an incident surface, through which light from the light emitting device is incident, and a second surface through the incident light is outwardly emitted, wherein the first surface has a recess recessed toward the second surface and forming the incident surface, and the second surface protrudes in a dome shape from an edge of the first surface, the second surface having a concave portion depressed toward a planar portion in a center of the first surface, and the incident surface includes the planar portion at a top portion of the recess and a curved portion, the planar portion and the curved portion forming an opening, the curved portion extending between the planar portion and a portion of the first surface outside the incident surface may be provided.

    摘要翻译： 一种光源单元，包括发光装置的发光装置和包括具有入射表面的第一表面的光学装置，通过该入射表面入射来自发光装置的光和通过入射光的第二表面向外发射，其中第一 表面具有朝向第二表面凹陷并形成入射表面的凹陷，并且第二表面从第一表面的边缘突出成圆顶形，第二表面具有凹陷部分，朝向第一表面的中心的平面部分凹陷 并且所述入射面包括在所述凹部的顶部处的平坦部分和弯曲部分，所述平面部分和所述弯曲部分形成开口，所述弯曲部分在所述平面部分和所述第一表面的与所述第一表面的部分之间延伸的部分 可以提供入射表面。

    LIGHT EMITTING DEVICE PACKAGE, WAVELENGTH CONVERSION FILM, AND MANUFACTURING METHOD THEREOF
    9.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE, WAVELENGTH CONVERSION FILM, AND MANUFACTURING METHOD THEREOF 有权
    发光器件封装，波长转换膜及其制造方法

    公开(公告)号：US20160359089A1

    公开(公告)日：2016-12-08

    申请号：US15098123

    申请日：2016-04-13

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Kyung Mi MOON ,  Won Soo JI

    IPC分类号： H01L33/50

    CPC分类号： H01L33/504 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2933/0041

    摘要： A light emitting device package is provided. The package includes a light emitting device including a substrate, and a light emitting structure having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer stacked on the substrate; and a wavelength conversion film disposed in a path of light emitted by the light emitting device and having phosphor layers stacked on each other. A portion of the phosphor layers includes phosphor structures including a wavelength conversion material receiving light emitted from the light emitting device and converting a wavelength thereof and a binding resin binding the wavelength conversion material, and a transparent resin filling spaces between the phosphor structures.

    摘要翻译： 提供发光器件封装。 该封装包括包括衬底的发光器件和堆叠在衬底上的具有第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构; 以及波长转换膜，其设置在由所述发光器件发射的并且具有彼此堆叠的荧光体层的光的路径中。 荧光体层的一部分包括荧光体结构，所述荧光体结构包括接收从发光器件发射的光并转换​​其波长的波长转换材料和结合波长转换材料的结合树脂以及荧光体结构之间的透明树脂填充空间。

    LIGHT SOURCE MODULE AND LIGHTING DEVICE HAVING THE SAME
    10.
    发明申请
    LIGHT SOURCE MODULE AND LIGHTING DEVICE HAVING THE SAME 审中-公开
    光源模块和具有相同功能的照明设备

    公开(公告)号：US20160131327A1

    公开(公告)日：2016-05-12

    申请号：US14825112

    申请日：2015-08-12

    申请人： SAMSUNG ELECTRONICS CO., LTD

    发明人： Kyung Mi MOON ,  Tetsuo ARIYOSHI ,  Jong Pil WON ,  Seung Gyun JUNG ,  Jun CHO ,  Won Soo JI ,  Sung A CHOI

    IPC分类号： F21V3/00 ,  H01L33/50 ,  H01L33/60

    CPC分类号： H01L33/58 ,  F21V5/008 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/60

    摘要： There is provided a light source module including a light emitting device, and an optical device including a first surface disposed above the light emitting device and having a hollow recessed in a light emitting direction in a central portion through which an optical axis passes, and a second surface disposed to be opposite to the first surface and configured to refract light incident through the hollow to be emitted to the outside. The optical device includes a plurality of ridges disposed on the second surface and periodically arranged in a direction from the optical axis to an edge connected to the first surface.

    摘要翻译： 提供了一种包括发光器件的光源模块和包括设置在发光器件上方的第一表面的光学器件，并且在光轴通过的中心部分中具有在发光方向上凹陷的中空部分，以及 第二表面设置成与第一表面相对，并且被配置为折射入射通过中空的光以发射到外部。 光学装置包括设置在第二表面上并沿着从光轴到连接到第一表面的边缘的方向周期性地布置的多个脊。