公开(公告)号：US11424202B2

公开(公告)日：2022-08-23

申请号：US16674056

申请日：2019-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bowo Choi ,  Youngtak Kim ,  Sangjine Park ,  Suji Kim ,  Jaeuk Shin ,  Hyunjung Lee ,  Jihun Cheon

IPC: H01L27/108 ,  H01L23/00

Abstract: A semiconductor device includes a landing pad, a first insulating pattern in contact with a lower portion of a side surface of the landing pad, a pad oxide layer having a lateral portion disposed on a portion of an upper surface of the landing pad and a vertical portion in contact with an upper portion of the side surface of the landing pad, a second insulating pattern in contact with an upper surface of the first insulating pattern and covering the first insulating pattern and the pad oxide layer, and a lower electrode that vertically passes through the second insulating pattern and is in contact with a portion of the upper surface and an upper portion of a side surface of the landing pad.

公开(公告)号：US11742222B2

公开(公告)日：2023-08-29

申请号：US18057397

申请日：2022-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihun Cheon ,  Hyun Jung Lee ,  Pyojin Jeon ,  Yong-Jhin Cho ,  Wonjun Lee

IPC: H01L21/67 ,  B08B7/00 ,  B08B3/02 ,  B08B7/04 ,  G03F7/30 ,  B08B5/02

CPC classification number: H01L21/67051 ,  B08B3/024 ,  B08B5/02 ,  B08B7/0057 ,  B08B7/04 ,  G03F7/30 ,  B08B2203/005

Abstract: An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.

公开(公告)号：US11545373B2

公开(公告)日：2023-01-03

申请号：US16715123

申请日：2019-12-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihun Cheon ,  Hyun Jung Lee ,  Pyojin Jeon ,  Yong-Jhin Cho ,  Wonjun Lee

IPC: H01L21/30 ,  H01L21/67 ,  B08B7/00 ,  B08B3/02 ,  B08B7/04 ,  G03F7/30 ,  B08B5/02

Abstract: An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.