公开(公告)号：US09076701B2

公开(公告)日：2015-07-07

申请号：US14147051

申请日：2014-01-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-Won Han ,  Jae-Hyun Kim ,  Tae-Hoon Kim ,  Ho-Geun Lee ,  You-Jeong Jeong ,  Jung-Sik Choi

IPC: H01L21/58 ,  H01L23/00 ,  B32B7/06 ,  H01L21/683

CPC classification number: H01L24/14 ,  B32B7/06 ,  H01L21/486 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/18161 ,  H01L2924/3511 ,  Y10T428/1476 ,  Y10T428/2839 ,  H01L2924/00014

Abstract: A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate.

Abstract translation: 晶片支撑结构包括用于支撑晶片的支撑衬底，用于将晶片从支撑衬底分离的释放层以及用于将晶片附接到支撑衬底的粘合剂层。

公开(公告)号：US20150024574A1

公开(公告)日：2015-01-22

申请号：US14334265

申请日：2014-07-17

Applicant: Samsung Electronics Co., Ltd. ,  Shin-Etsu Chemical Co., Ltd.

Inventor： Tae-Hoon Kim ,  Hideto Kato ,  Jae-Hyun Kim ,  Jun-Won Han ,  Hiroyuki Yasuda ,  Shohei Tagami ,  Michihiro Sugo ,  Jung-Sik Choi

IPC: H01L21/762 ,  C09J183/06 ,  C09J183/04

CPC classification number: C09J183/06 ,  B05D3/02 ,  B32B27/283 ,  C08G77/52 ,  C08G77/70 ,  C08L83/00 ,  C09J183/04 ,  C09J183/14 ,  H01L21/6835 ,  H01L25/0652 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2924/15311

Abstract: A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.

Abstract translation: 临时粘合剂组合物包括包含热固性聚有机硅氧烷的第一化合物和包含热塑性聚有机硅氧烷的第二化合物。