公开(公告)号：US11917770B2

公开(公告)日：2024-02-27

申请号：US18144592

申请日：2023-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonah Kim ,  Kiwoong Kim ,  Dowan Kim ,  Chiun Park ,  Kwangsung Hwang

IPC: H05K5/00 ,  H01L25/075 ,  H05K5/02

CPC classification number: H05K5/0021 ,  H01L25/0753 ,  H05K5/0214 ,  H05K5/0217

Abstract: A display apparatus includes: a display module including a substrate on which a plurality of light emitting diodes (LEDs) are mounted, a holder covering a rear side of the substrate, a reinforcement member provided on a rear side of the holder, and a fixing member protruding rearward from the holder; a cabinet provided to support the display module and including a plurality of first magnets and a through hole through which the fixing member passes; and a circuit case including a plurality of second magnets and coupled to the cabinet. The display module is coupled to the cabinet by a first magnetic attraction between the plurality of first magnets and the reinforcement member and a second magnetic attraction between the plurality of second magnets and the reinforcement member.

公开(公告)号：US10082732B2

公开(公告)日：2018-09-25

申请号：US14280900

申请日：2014-05-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungmo Yang ,  Kiwoong Kim ,  Kwangsu Seo ,  Sungjae Lee ,  Yongwoo Jeon ,  Wonhee Choi ,  Byounguk Yoon

IPC: G03F7/00 ,  G03F7/20 ,  B29C37/00 ,  B29C43/02 ,  B29C43/18 ,  B29C35/08 ,  B29C45/16 ,  H05K5/03 ,  H04M1/02

CPC classification number: G03F7/0002 ,  B29C35/0805 ,  B29C37/0053 ,  B29C43/021 ,  B29C43/18 ,  B29C45/1679 ,  B29C2035/0827 ,  B29C2037/0035 ,  B29C2037/0042 ,  G03F7/20 ,  H04M1/0283 ,  H05K5/03 ,  Y10T428/13 ,  Y10T428/1352

Abstract: A surface treatment method of an electronic device is provided. The surface treatment method includes processing a first pattern on a surface of a top mold and a second pattern on a surface of a bottom mold, coating a Ultra-Violet (UV) molding liquid on each of a front surface of a raw sheet material and the bottom mold facing a rear surface of the raw sheet material raw, positioning the raw sheet material between the top mold and the bottom mold, pressing the top mold and the bottom mold to each other, curing the UV molding liquid, and separating the raw sheet material from the top mold and the bottom mold and forming a print layer on the front surface and the rear surface of the raw sheet material.

公开(公告)号：US10211396B2

公开(公告)日：2019-02-19

申请号：US15943698

申请日：2018-04-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juhyun Kim ,  Kiwoong Kim ,  Sechung Oh ,  Woochang Lim

IPC: H01L43/02 ,  H01L43/08 ,  H01L43/10 ,  H01L43/12

Abstract: A semiconductor device and a method of forming the semiconductor device are disclosed. The semiconductor device includes a lower electrode and a magnetic tunnel junction structure disposed on the lower electrode. The magnetic tunnel junction structure includes a seed pattern disposed on the lower electrode. The seed pattern includes an amorphous seed layer and an oxidized seed layer disposed on a surface of the amorphous seed layer. The seed pattern may prevent the lattice structure of the lower electrode from adversely affecting the lattice structure of a pinned magnetic layer of the magnetic tunnel junction structure.

公开(公告)号：US12265426B2

公开(公告)日：2025-04-01

申请号：US17711619

申请日：2022-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiwoong Kim ,  Haekwon Lee

IPC: H04M1/02 ,  G06F1/16

Abstract: According to various embodiments of the disclosure, an electronic device may comprise a first structure, a second structure receiving at least a portion of the first structure and guiding a sliding movement of the first structure, a flexible display including a first area connected with the first structure and a second area extending from the first area and bendable, and a sweeper member formed to slide along an inside of the second structure while being attached to an end of the second area of the flexible display, in response to the sliding movement of the flexible display.