公开(公告)号：US12040248B2

公开(公告)日：2024-07-16

申请号：US18099663

申请日：2023-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jingu Kim ,  Sangkyu Lee ,  Yongkoon Lee ,  Seokkyu Choi

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10

CPC classification number: H01L23/367 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/20 ,  H01L25/105 ,  H01L2224/214 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1094

Abstract: A semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. A width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.

公开(公告)号：US12183694B2

公开(公告)日：2024-12-31

申请号：US18125989

申请日：2023-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkoon Lee ,  Jingu Kim ,  Sangkyu Lee ,  Seokkyu Choi

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01Q9/04 ,  H01Q19/00

Abstract: A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

公开(公告)号：US11637079B2

公开(公告)日：2023-04-25

申请号：US17206252

申请日：2021-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkoon Lee ,  Jingu Kim ,  Sangkyu Lee ,  Seokkyu Choi

IPC: H01L23/66 ,  H01L23/538 ,  H01L23/00 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01Q9/04 ,  H01Q19/00 ,  H01L23/31

Abstract: A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

公开(公告)号：US11562939B2

公开(公告)日：2023-01-24

申请号：US17235502

申请日：2021-04-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jingu Kim ,  Sangkyu Lee ,  Yongkoon Lee ,  Seokkyu Choi

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10 ,  H01L23/00

Abstract: A semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. A width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.

公开(公告)号：US12154873B2

公开(公告)日：2024-11-26

申请号：US18125989

申请日：2023-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkoon Lee ,  Jingu Kim ,  Sangkyu Lee ,  Seokkyu Choi

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01Q9/04 ,  H01Q19/00

Abstract: A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

公开(公告)号：US20230163038A1

公开(公告)日：2023-05-25

申请号：US18099663

申请日：2023-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jingu Kim ,  Sangkyu Lee ,  Yongkoon Lee ,  Seokkyu Choi

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10 ,  H01L23/00

CPC classification number: H01L23/367 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/105 ,  H01L24/20 ,  H01L2224/214 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1094

Abstract: A semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. A width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.

公开(公告)号：US20250046737A1

公开(公告)日：2025-02-06

申请号：US18925155

申请日：2024-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkoon Lee ,  Jingu Kim ,  Sangkyu Lee ,  Seokkyu Choi

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01Q9/04 ,  H01Q19/00

Abstract: A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

公开(公告)号：US20240347409A1

公开(公告)日：2024-10-17

申请号：US18747798

申请日：2024-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jingu Kim ,  Sangkyu Lee ,  Yongkoon Lee ,  Seokkyu Choi

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10

CPC classification number: H01L23/367 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/20 ,  H01L25/105 ,  H01L2224/214 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1094

Abstract: A semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. A width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.

公开(公告)号：US20230230943A1

公开(公告)日：2023-07-20

申请号：US18125989

申请日：2023-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkoon Lee ,  Jingu Kim ,  SANGKYU LEE ,  Seokkyu Choi

IPC: H01L23/66 ,  H01L23/538 ,  H01L23/00 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01Q9/04 ,  H01Q19/00 ,  H01L23/31

CPC classification number: H01L23/66 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/20 ,  H01L21/6835 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L24/19 ,  H01Q9/0407 ,  H01Q19/005 ,  H01L23/3121 ,  H01L2221/68372 ,  H01L2223/6677 ,  H01L2224/214

Abstract: A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

公开(公告)号：US20220102236A1

公开(公告)日：2022-03-31

申请号：US17235502

申请日：2021-04-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jingu Kim ,  Sangkyu Lee ,  Yongkoon Lee ,  Seokkyu Choi

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/10

Abstract: A semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. A width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.