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公开(公告)号：US10185218B2
公开(公告)日：2019-01-22
申请号：US14733172
申请日：2015-06-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaeseung Chung , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Jong G. Ok , Ilsun Yoon , Sunghoon Lee , Sukgyu Hahm
IPC: G03F7/00
Abstract: A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.
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2.发明授权公开(公告)号：US09703027B2
公开(公告)日：2017-07-11
申请号：US14541652
申请日：2014-11-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaeseung Chung , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Sunghoon Lee , Sukgyu Hahm
IPC: G02F1/1335 , G02B5/30
CPC classification number: G02B5/3058 , G02F1/133528 , G02F2001/133548
Abstract: A wire grid polarizer includes a substrate, a first layer and a second layer disposed on the first layer, in which a first region and a second region are defined in the first layer, the first layer includes: a first wire grid including a plurality of first wires and disposed in the first region, where the first wires are spaced apart from each other, and no wire grid is disposed in the second region; and a first protection layer which covers the first wire grid, a third region and a fourth region are defined in the second layer, and the second layer includes a second wire grid including a plurality of second wires and disposed in the third region, where the second wires are spaced apart from each other, and no wire grid is disposed in the fourth region.
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公开(公告)号：US09696589B2
公开(公告)日：2017-07-04
申请号：US14522787
申请日：2014-10-24
Applicant: Samsung Electronics Co., Ltd. , Samsung Display Co., Ltd.
Inventor： Jaeseung Chung , Dongouk Kim , Joonyong Park , Bongsu Shin , Daeyoung Lee , Sunghoon Lee , Gugrae Jo , Sukgyu Hahm
IPC: G02F1/1335 , G02B5/30
CPC classification number: G02F1/13362 , G02B5/3058 , G02F1/133528 , G02F1/133536 , G02F1/133555 , G02F1/133605 , G02F2001/133548 , G02F2001/133565
Abstract: A liquid crystal display includes a light source unit, a first substrate provided on the light source unit, an electrode layer provided on the first substrate, a second substrate separate from the electrode layer, a polarizing plate provided on a surface of the second substrate, a liquid crystal layer disposed between the electrode layer and the second substrate, a reflecting unit provided on a surface of the first substrate; and a wire grid polarizer provided on an opposite surface of the first substrate.
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公开(公告)号：US20160054498A1
公开(公告)日：2016-02-25
申请号：US14733234
申请日：2015-06-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaeseung Chung , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Sunghoon Lee , Sukgyu Hahm , Jong G. Ok , Ilsun Yoon
CPC classification number: G02B5/3058 , B29D11/00644 , B29K2101/10 , G03F7/0002
Abstract: A pattern structure includes a plurality of pattern structure units arranged substantially on a same plane, where each of the pattern structure units has a first surface and a second surface, which are opposite to each other, and a microstructure is defined on the first surface of each of the pattern structure units, and a flattening layer disposed on the second surface of each of the plurality of pattern structure units, where the flattening layer connects the pattern structure units with each other, and a vertical step difference exists between second surfaces of the pattern structure units.
Abstract translation: 图案结构包括基本上在同一平面上布置的多个图案结构单元，其中每个图案结构单元具有彼此相对的第一表面和第二表面，并且在第一表面上限定微结构 每个图案结构单元和布置在多个图案结构单元的每个的第二表面上的平坦化层，其中平坦化层将图案结构单元彼此连接，并且在第二表面之间存在垂直的阶差 图案结构单位。
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公开(公告)号：US10007124B2
公开(公告)日：2018-06-26
申请号：US14838507
申请日：2015-08-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joonyong Park , Dongouk Kim , Jihyun Bae , Bongsu Shin , Jong G. Ok , Ilsun Yoon , Sunghoon Lee , Jaeseung Chung , Sukgyu Hahm
IPC: H01L21/311 , H01L21/3065 , G02B27/62 , G02B5/30 , G02F1/1333
CPC classification number: G02B27/62 , G02B5/3058 , G02F1/13336 , G02F2001/133548 , H01L23/544 , H01L2223/54426
Abstract: A master wafer includes: a plurality of unit wafers each including a pattern disposed thereon; a coupling surface defined on each of the unit wafers; and a coupling part which couples adjacent unit wafers among the plurality of unit wafers on which the coupling surface is defined, to each other.
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Patent Agency Ranking
公开(公告)号：US20160023400A1
公开(公告)日：2016-01-28
申请号：US14733172
申请日：2015-06-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaeseung Chung , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Jong G. Ok , Ilsun Yoon , Sunghoon Lee , Sukgyu Hahm
IPC: B29C59/16
CPC classification number: G03F7/0002
Abstract: A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.
Abstract translation: 使用压印处理传送反向图案的方法包括：准备主模具，其中第一图案被限定在主模具的表面上; 在母模上涂覆压印树脂以覆盖第一图案; 使用印模部件将压印树脂压向母模; 固化压印树脂以在主模和印模构件之间形成第二图案，其中第二图案具有与第一图案的形状相反的形状; 将印模部件从主模上拆下，将第二图案与主模分离; 并将第二图案转印到转印衬底上。
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7.发明申请公开(公告)号：US20150323721A1
公开(公告)日：2015-11-12
申请号：US14541652
申请日：2014-11-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaeseung Chung , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Sunghoon Lee , Sukgyu Hahm
IPC: G02B5/30 , G02F1/1335
CPC classification number: G02B5/3058 , G02F1/133528 , G02F2001/133548
Abstract: A wire grid polarizer includes a substrate, a first layer and a second layer disposed on the first layer, in which a first region and a second region are defined in the first layer, the first layer includes: a first wire grid including a plurality of first wires and disposed in the first region, where the first wires are spaced apart from each other, and no wire grid is disposed in the second region; and a first protection layer which covers the first wire grid, a third region and a fourth region are defined in the second layer, and the second layer includes a second wire grid including a plurality of second wires and disposed in the third region, where the second wires are spaced apart from each other, and no wire grid is disposed in the fourth region.
Abstract translation: 线栅偏振器包括基板，设置在第一层上的第一层和第二层，其中在第一层中限定第一区域和第二区域，第一层包括：第一线栅，包括多个 第一电线并且设置在第一区域中，其中第一电线彼此间隔开，并且在第二区域中不设置线栅; 并且覆盖第一线栅的第一保护层，第三区域和第四区域被限定在第二层中，并且第二层包括包括多个第二线并且设置在第三区域中的第二线栅格， 第二线彼此间隔开，并且在第四区域中不设置线栅。
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公开(公告)号：US09784896B2
公开(公告)日：2017-10-10
申请号：US14733234
申请日：2015-06-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaeseung Chung , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Sunghoon Lee , Sukgyu Hahm , Jong G. Ok , Ilsun Yoon
IPC: G02B5/30 , G03F7/00 , B29D11/00 , B29K101/10
CPC classification number: G02B5/3058 , B29D11/00644 , B29K2101/10 , G03F7/0002
Abstract: A pattern structure includes a plurality of pattern structure units arranged substantially on a same plane, where each of the pattern structure units has a first surface and a second surface, which are opposite to each other, and a microstructure is defined on the first surface of each of the pattern structure units, and a flattening layer disposed on the second surface of each of the plurality of pattern structure units, where the flattening layer connects the pattern structure units with each other, and a vertical step difference exists between second surfaces of the pattern structure units.
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公开(公告)号：US09759999B2
公开(公告)日：2017-09-12
申请号：US14557602
申请日：2014-12-02
Applicant: Samsung Display Co., Ltd. , Samsung Electronics Co., Ltd.
Inventor： Joonyong Park , Dongouk Kim , Bongsu Shin , Daeyoung Lee , Sunghoon Lee , Jaeseung Chung , Gugrae Jo , Sukgyu Hahm
IPC: B05B5/00 , B05B3/00 , B05C5/00 , C08J7/18 , G03F7/00 , B05D3/00 , B05C5/02 , B82Y40/00 , B05D3/06 , B05D1/42
CPC classification number: G03F7/00 , B05C5/02 , B05D1/42 , B05D3/007 , B05D3/067 , B82Y40/00 , G03F7/0002
Abstract: An imprinting apparatus includes: a coating unit which coats a substrate with ink including a photocurable resin in a diluent; a pressing unit which presses the ink with an imprint stamp including an uneven pattern; and a light source which irradiates light to the ink, which is in a pressed state, and cures the photocurable resin. The coating unit, the pressing unit and the light source move relative to the substrate in a processing direction. The coating unit is located ahead of the pressing unit in the processing direction.
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10.发明授权公开(公告)号：US09757895B2
公开(公告)日：2017-09-12
申请号：US14633272
申请日：2015-02-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sunghoon Lee , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Hongseok Lee , Jaeseung Chung , Sukgyu Hahm
CPC classification number: B29C59/026 , B29K2025/06 , B29K2033/12 , G02B1/12 , G02B5/3058 , G02B5/3066 , G02B2207/101 , G03F7/0002 , Y10T428/2457
Abstract: A patterning method using an imprint mold, to form an imprinted pattern structure, includes providing a resist layer from which the pattern structure will be formed, performing a first imprint process on a first area of the resist layer by using the imprint mold to form a first pattern of the pattern structure through deformation of the resist layer in the first area, and performing a second imprint process on a second area of the resist layer by using the imprint mold to form a second pattern of the pattern structure through deformation of the resist layer in the second area. The first and second areas are overlapped with each other in a third area of the resist layer, and the performing the second imprint process deforms a first portion of the first pattern in the third area to form the second pattern.
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