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公开(公告)号：US11646400B2
公开(公告)日：2023-05-09
申请号：US17343182
申请日：2021-06-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soonmin Hong , Gyuhwa Kim , Jeonggen Yoon , Tackmo Lee , Gyun Heo , Youngjun Moon , Kyungwoon Jang
CPC classification number: H01L33/62 , H01L25/167 , H01L27/1262 , H01L2933/0066
Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.
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公开(公告)号：US20210305477A1
公开(公告)日：2021-09-30
申请号：US17343182
申请日：2021-06-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soonmin HONG , Gyuhwa Kim , Jeonggen Yoon , Tackmo Lee , Gyun Heo , Youngjun Moon , Kyungwoon Jang
Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.
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公开(公告)号：US11658162B2
公开(公告)日：2023-05-23
申请号：US16629768
申请日：2018-06-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngchul Lee , Taesang Park , Kyoree Lee , Tackmo Lee , Gyun Heo , Youngjun Moon , Won Choi
IPC: H01L25/075 , H01L25/16 , H01L33/00 , H01L33/62 , H01L33/52
CPC classification number: H01L25/0753 , H01L25/167 , H01L33/0095 , H01L33/62 , H01L33/0093 , H01L33/52 , H01L2933/005 , H01L2933/0066
Abstract: The disclosure describes a micro Light Emitting Diode (LED) display. The display may include a Printed Circuit Board (PCB) including a plurality of solder pads, a micro LED package including a plurality of micro LED chips, and a plurality of solder electrodes which bond the micro LED chips onto the solder pads of the PCB. The micro LED package may be re-arranged in an Red Green Blue (RGB) state on a temporary fixing film by using a pickup device in accordance with a display pixel configuration, after the micro LED chips are attached to a carrier film.
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Patent Agency Ranking
公开(公告)号：US11387220B2
公开(公告)日：2022-07-12
申请号：US16650578
申请日：2018-07-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyung Woon Jang , Hyun-Tae Jang , Youngjun Moon , Changjoon Lee
IPC: H01L25/075 , H01L27/12 , H01L33/24 , H01L33/62
Abstract: A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.
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公开(公告)号：US11056630B2
公开(公告)日：2021-07-06
申请号：US16786514
申请日：2020-02-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soonmin Hong , Gyuhwa Kim , Jeonggen Yoon , Tackmo Lee , Gyun Heo , Youngjun Moon , Kyungwoon Jang
Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.
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公开(公告)号：US11805633B2
公开(公告)日：2023-10-31
申请号：US16638645
申请日：2018-07-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyun-Tae Jang , Min Park , Byung Hoon Lee , Youngchul Lee , Changjoon Lee , Jiyoung Jang , Youngjun Moon , Minyoung Park , Jeonggen Yoon , Won Choi , Siho Jang
CPC classification number: H05K13/041 , H01L33/005 , H05K13/02 , H05K13/0409 , Y10T29/53174
Abstract: According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.
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公开(公告)号：US11355479B2
公开(公告)日：2022-06-07
申请号：US16650578
申请日：2018-07-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyung Woon Jang , Hyun-Tae Jang , Youngjun Moon , Changjoon Lee
IPC: H01L25/075 , H01L27/12 , H01L33/24 , H01L33/62
Abstract: A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.
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8.发明授权公开(公告)号：US11189675B2
公开(公告)日：2021-11-30
申请号：US16680764
申请日：2019-11-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Changkyu Chung , Changjoon Lee , Kyungwoon Jang , Gyun Heo , Youngjun Moon , Kwangrae Jo , Soonmin Hong , Daesuck Hwang
Abstract: A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.
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