公开(公告)号：US5252544A

公开(公告)日：1993-10-12

申请号：US712264

申请日：1991-06-07

申请人： Toshihiko Maeda ,  Kazuhiro Sakuyama ,  Shin-ichi Koriyama ,  Ataru Ichinose ,  Hisao Yamauchi ,  Shoji Tanaka

发明人： Toshihiko Maeda ,  Kazuhiro Sakuyama ,  Shin-ichi Koriyama ,  Ataru Ichinose ,  Hisao Yamauchi ,  Shoji Tanaka

IPC分类号： C01G3/00 ,  C01G1/00 ,  C01G21/00 ,  C04B35/45 ,  H01B12/00 ,  H01L39/12 ,  C01F11/02 ,  C01F17/00 ,  C01G3/02

CPC分类号： H01L39/126 ,  C01G21/006 ,  C04B35/45 ,  C01P2002/30 ,  C01P2002/72 ,  C01P2002/77 ,  Y10S505/778 ,  Y10S505/779

摘要： An oxide superconductor which has a composition expressed by the following general formula and whose crystal structure is 1222-phase structure.Pb.sub.a (M.sub.1-x-y Ce.sub.x Sr.sub.y).sub.4 Cu.sub.3-a O.sub.z (I)(where M represents at least one element selected from the group consisting of Y, La, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Yb, and Lu, and a, x, y, and z denote the numbers which satisfy 0.3.ltoreq.a.ltoreq.0.7, 0

公开(公告)号：US5407908A

公开(公告)日：1995-04-18

申请号：US91832

申请日：1993-07-13

申请人： Toshihiko Maeda ,  Kazuhiro Sakuyama ,  Shin-ichi Koriyama ,  Ataru Ichinose ,  Hisao Yamauchi ,  Shoji Tanaka

发明人： Toshihiko Maeda ,  Kazuhiro Sakuyama ,  Shin-ichi Koriyama ,  Ataru Ichinose ,  Hisao Yamauchi ,  Shoji Tanaka

IPC分类号： C01G3/00 ,  C01G1/00 ,  C01G21/00 ,  C04B35/45 ,  H01B12/00 ,  H01L39/12

CPC分类号： H01L39/126 ,  C01G21/006 ,  C04B35/45 ,  C01P2002/30 ,  C01P2002/72 ,  C01P2002/77 ,  Y10S505/778 ,  Y10S505/779

摘要： A method for manufacturing a Pb-based Cu oxide superconductor. The method includes the steps of mixing powders of a raw material containing at least Pb, Sr, Ce, M, where M is at least one element selected from the group consisting of Y, La, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Yb, and Lu, and Cu in a proportion to have the composition of the formula (I),Pb.sub.a (M.sub.1-x-y Ce.sub.x Sr.sub.y).sub.4 Cu.sub.3-a O.sub.z(I)where M is at least one element selected from the group consisting of Y, La, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Yb, and Lu, and a, x, y, and z denote the numbers which satisfy 0.3.ltoreq.a.ltoreq.0.7, 0

摘要翻译： 一种Pb系Cu氧化物超导体的制造方法。 该方法包括混合至少含有Pb，Sr，Ce，M的原料的粉末的步骤，其中M是选自Y，La，Nd，Sm，Eu，Gd，Tb， Dy，Ho，Er，Yb和Lu，以及具有式（I）的组成的比例的Pba（M1-x-yCexSry）4Cu3-aOz（I），其中M是选自 由Y，La，Nd，Sm，Eu，Gd，Tb，Dy，Ho，Er，Yb和Lu组成的组，a，x，y和z表示满足0.3 < = 0.7,0

公开(公告)号：US5190914A

公开(公告)日：1993-03-02

申请号：US662457

申请日：1991-02-28

申请人： Shin-ichi Koriyama ,  Kazuhiro Sakuyama ,  Toshihiko Maeda ,  Hisao Yamauchi ,  Shoji Tanaka

发明人： Shin-ichi Koriyama ,  Kazuhiro Sakuyama ,  Toshihiko Maeda ,  Hisao Yamauchi ,  Shoji Tanaka

IPC分类号： C01G21/00 ,  C01G1/00 ,  C04B35/00 ,  C04B35/45 ,  H01B12/00 ,  H01B13/00 ,  H01L39/12 ,  H01L39/24

CPC分类号： H01L39/126 ,  Y10S505/779 ,  Y10S505/78 ,  Y10S505/781

摘要： A superconducting material is disclosed which includes oxides of metals having the following composition:(Pb.sub.1-z Cu.sub.z) ((Sr.sub.1-y Ba.sub.y).sub.1-v Ca.sub.v).sub.2 (A.sub.1-x Ca.sub.x)Cu.sub.2wherein A is at least one element selected from the group consisting of Y, La, Nd, Sm, Eu, Gd, Ho, Er, Yb and mixtures of at least one of Y, La, Nd, Sm, Eu, Gd, Ho, Er and Yb with at least one of Tb, Tm and Lu, x, y, v and z are numbers satisfying the following conditions:0.ltoreq.x.ltoreq.0.4,0.1.ltoreq.y

公开(公告)号：US20090091018A1

公开(公告)日：2009-04-09

申请号：US12094132

申请日：2006-11-16

申请人： Toshihiko Maeda ,  Katsuyuki Yoshida ,  Kouzou Makinouchi

发明人： Toshihiko Maeda ,  Katsuyuki Yoshida ,  Kouzou Makinouchi

IPC分类号： H01L23/48 ,  H01L21/02

CPC分类号： B81B7/0064 ,  B81B2207/092 ,  B81B2207/093 ,  B81B2207/095 ,  B81B2207/097 ,  B81C2203/0118 ,  B81C2203/035 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component sealing substrate capable of configuring an electronic apparatus in which the influence of electromagnetic coupling and radio frequency noises between an electrical connection path and a micro electronic mechanical system is suppressed is provided. An electronic component sealing substrate (4) for hermetically sealing a micro electronic mechanical system (4) of an electronic component (2) that includes a semiconductor substrate (5), the micro electronic mechanical system (3) formed on a main face of the semiconductor substrate (5), and an electrode (6) electrically connected to the micro electronic mechanical system (3), includes an insulating substrate (7) that has a first main face joined to the main face of the semiconductor substrate (5) so as to hermetically seal the micro electronic mechanical system (3), and a wiring conductor (8) that has an end extending to the first main face of the insulating substrate (7) and is electrically connected to the electrode (6) of the electronic component (2), and the end of the wiring conductor (8) is positioned outside a joined portion of the main face of the semiconductor substrate (5) and the first main face of the insulating substrate (7).

摘要翻译： 提供一种电子部件密封基板，其能够构成抑制电连接路径和微电子机械系统之间的电磁耦合和无线电频率噪声的影响的电子设备。 一种用于气密密封包括半导体衬底（5）的电子部件（2）的微电子机械系统（4）的电子部件密封基板（4），形成在所述微电子机械系统 半导体衬底（5）和与微电子机械系统（3）电连接的电极（6）包括绝缘衬底（7），其具有接合到半导体衬底（5）的主面的第一主面，因此 为了气密地密封微电子机械系统（3），以及布线导体（8），其具有延伸到绝缘基板（7）的第一主面的端部，并且电连接到电子器件的电极（6） （2），并且布线导体（8）的端部位于半导体基板（5）的主面和绝缘基板（7）的第一主面的接合部的外侧。

公开(公告)号：US06626692B2

公开(公告)日：2003-09-30

申请号：US10054478

申请日：2002-01-22

申请人： Toshihiko Maeda ,  Yoshinori Mizusawa ,  Osamu Hashiguchi ,  Kazuomi Sato ,  Hisashi Ishida ,  Hiroyuki Tsuzuki ,  Masahiro Yamada ,  Masahiro Yamauchi

发明人： Toshihiko Maeda ,  Yoshinori Mizusawa ,  Osamu Hashiguchi ,  Kazuomi Sato ,  Hisashi Ishida ,  Hiroyuki Tsuzuki ,  Masahiro Yamada ,  Masahiro Yamauchi

IPC分类号： H01R13627

CPC分类号： H01R13/518 ,  B63B22/04 ,  F16B5/02 ,  H01R13/6272 ,  H01R13/62905 ,  H01R13/64 ,  H04Q1/023 ,  H04Q1/14 ,  Y10S439/953 ,  Y10S439/954

摘要： There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces. The lance (5f) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance (5g) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion (10d) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition members.

摘要翻译： 提供了插入和取出连接器装置，其中多个连接器只能在能够与连接器接收体内的多个配合连接器接合和分离的范围内移动。 连接器接收体（1）具有一对平行框架（3），位于两端部的一对框架块（4）和多个分隔构件（5）。 一个连接器（10）和一个配合连接器被接收在多个空间部分中的每一个中，即，由一对框架分隔的接收室，一对框架块和多个分隔构件。 每个分隔构件具有一对具有弹簧特性的喷枪（5f，5g），并且每个连接器在两个侧表面上具有一对互锁槽部分（10g）。 喷枪（5f）与连接器中的一个侧表面上的互锁槽部互锁，并且喷枪（5g）与连接器中的另一侧面上的互锁槽部互锁。 每个连接器在一个侧表面上的上端部和另一个侧表面的下端部处具有凸部（10d），并且每个凸部与每个分隔构件互锁。

公开(公告)号：US06149447A

公开(公告)日：2000-11-21

申请号：US145844

申请日：1998-09-02

申请人： Toshihiko Maeda ,  Yoshinori Mizusawa ,  Osamu Hashiguchi ,  Kazuomi Sato ,  Hisashi Ishida ,  Hiroyuki Tsuzuki ,  Masahiro Yamada ,  Masahiro Yamauchi

发明人： Toshihiko Maeda ,  Yoshinori Mizusawa ,  Osamu Hashiguchi ,  Kazuomi Sato ,  Hisashi Ishida ,  Hiroyuki Tsuzuki ,  Masahiro Yamada ,  Masahiro Yamauchi

IPC分类号： B63B22/04 ,  H01R13/518 ,  H01R13/629 ,  H04Q1/14 ,  H01R13/62

CPC分类号： H01R13/518 ,  B63B22/04 ,  F16B5/02 ,  H01R13/62905 ,  H01R13/64 ,  H04Q1/023 ,  H04Q1/14 ,  H01R13/6272 ,  Y10S439/953 ,  Y10S439/954

摘要： There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces. The lance (5f) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance (5g) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion (10d) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition members.

公开(公告)号：US5220246A

公开(公告)日：1993-06-15

申请号：US565210

申请日：1990-08-08

申请人： Eizo Ide ,  Kitoshi Hashimoto ,  Takijiro Shimamoto ,  Tetsuo Horie ,  Yasuyuki Maehara ,  Toshihiko Maeda

发明人： Eizo Ide ,  Kitoshi Hashimoto ,  Takijiro Shimamoto ,  Tetsuo Horie ,  Yasuyuki Maehara ,  Toshihiko Maeda

IPC分类号： H04R23/00

CPC分类号： H04R23/004

摘要： An information transmission method using arc and apparatus thereof are applied to a loudspeaker and the like having the function of illumination. The information transmission method is characterized in that arc current supplied to an arc generating device is modulated by a signal based on information to vibrate arc column so that at least one of audible waves, ultrasonic waves and arc light is employed to transmit the information. Arc having small mechanical inertia is employed as a sound producing device and accordingly can be used as a loudspeaker having a good frequency characteristic and large output. It can be used as a sound producing device having the function of illumination by utilizing strong light emitted from arc column.

摘要翻译： 使用电弧及其装置的信息传输方法应用于具有照明功能的扬声器等。 信息传输方法的特征在于，提供给电弧发生装置的电弧电流通过基于信息的信号进行调制，以振动电弧列，使得使用声波，超声波和电弧光中的至少一个来传送信息。 采用具有小的机械惯性的电弧作为声音产生装置，因此可以用作具有良好的频率特性和大的输出的扬声器。 它可以用作通过利用从电弧柱发出的强光而具有照明功能的声音产生装置。

公开(公告)号：US08204352B2

公开(公告)日：2012-06-19

申请号：US12745634

申请日：2008-12-01

申请人： Toshihiko Maeda

发明人： Toshihiko Maeda

IPC分类号： G02B6/00

CPC分类号： B81B7/007 ,  B81C1/00317 ,  G02B26/0841 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/0401

摘要： An optical apparatus includes an element substrate on whose surface an optical element is provided; a wiring board disposed so as to face the optical element; a sealing member and a conductive member provided between the element substrate and the wiring board. The sealing member surrounds and hermetically seals the optical element. The conductive member electrically connects the optical element and the wiring board. The wiring board has a light-transmitting area transmitting light to the optical element.

摘要翻译： 光学装置包括其表面上设置有光学元件的元件基板; 以与所述光学元件相对的方式配置的布线板; 密封构件和设置在元件基板和布线基板之间的导电构件。 密封构件包围并密封光学元件。 导电部件电连接光学元件和布线板。 布线板具有将光传递到光学元件的透光区域。

公开(公告)号：US20060019832A1

公开(公告)日：2006-01-26

申请号：US11239204

申请日：2005-09-30

申请人： Toshihiko Maeda ,  Toru Izumi ,  Katsuya Hasegawa ,  Shigenobu Asada ,  Teruo Izumi ,  Yuh Shiohara

发明人： Toshihiko Maeda ,  Toru Izumi ,  Katsuya Hasegawa ,  Shigenobu Asada ,  Teruo Izumi ,  Yuh Shiohara

IPC分类号： H01L39/24

CPC分类号： H01L39/2454 ,  Y10T29/49014

摘要： A metal substrate for an oxide superconducting wire, which comprises a polycrystalline metal substrate with a rolled aggregate structure having a {100} plane which is parallel to the rolled surface and a axis which is parallel to the rolling direction, and an oxide crystal layer comprising an oxide of the polycrystalline metal and formed on a surface of the polycrystalline metal substrate, wherein at least 90% of grain boundaries in the oxide crystal layer have an inclination of 10° or less, and at least 90% of the {100} plane of the oxide crystal layer make an angle of 10° or less with the surface of the polycrystalline metal substrate.

摘要翻译： 一种用于氧化物超导线的金属基底，其包括具有平行于轧制表面的{100}平面和平行于轧制方向的<001>轴的轧制骨料结构的多晶金属基体和氧化物 所述多晶金属的氧化物形成在所述多晶金属基板的表面上，所述氧化物晶层中的至少90％的晶界倾斜度为10°以下，所述{ 100}面与多晶金属基板的表面成10°以下的角度。

公开(公告)号：US06287135B1

公开(公告)日：2001-09-11

申请号：US09537980

申请日：2000-03-29

申请人： Osamu Hashiguchi ,  Yoshinori Mizusawa ,  Toshihiko Maeda ,  Masahiro Yamada ,  Shin Kamiyamane ,  Satoru Nagase

发明人： Osamu Hashiguchi ,  Yoshinori Mizusawa ,  Toshihiko Maeda ,  Masahiro Yamada ,  Shin Kamiyamane ,  Satoru Nagase

IPC分类号： H01R1362

CPC分类号： H01R13/518

摘要： A connector engaging/disengaging mechanism comprises a frame member (3) and connector carriers (7) for engaging and disengaging first connector (40) mounted on a printed circuit board (5) fixed onto the frame (3) and second connectors (30) held on said connector carriers (7). The frame member is provided with guide grooves (11) in which the connector carriers (7) are received to be slidable in an engaging direction (A) and a disengaging direction (B). Each of the connector carriers (7) has connector holding portions for holding the second connectors and an operating portion (15) for moving the connector carrier to engage and disengage the second connectors (30) to and from the first connector (40). When the operating portion (15) is manually operated to move the connector carrier in the engaging direction, the second connectors (30) are connected with the first connectors (40). When the connector carrier is moved in the disengaging direction, the second connectors (30) are disconnected from the first connectors (40).

摘要翻译： 连接器接合/分离机构包括框架构件（3）和用于接合和分离安装在固定到框架（3）和第二连接器（30）上的印刷电路板（5）上的第一连接器（40）的连接器支架（7） 保持在所述连接器支架（7）上。 框架构件设置有引导槽（11），其中，接合器支架（7）被容纳在接合方向（A）和分离方向（B）上可滑动。 每个连接器支架（7）具有用于保持第二连接器的连接器保持部分和用于移动连接器托架以使第二连接器（30）与第一连接器（40）接合和分离的操作部分（15）。 当操作部分（15）被手动操作以沿接合方向移动连接器支架时，第二连接器（30）与第一连接器（40）连接。 当连接器支架沿分离方向移动时，第二连接器（30）与第一连接器（40）断开。