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    Textured substrate for epitaxial film formation, and method for manufacturing the same
    4.
    发明授权
    Textured substrate for epitaxial film formation, and method for manufacturing the same 有权
    用于外延膜形成的纹理基板及其制造方法

    公开(公告)号：US09242433B2

    公开(公告)日：2016-01-26

    申请号：US14381255

    申请日：2013-03-21

    申请人： TANAKA KIKINZOKU KOGYO K.K.

    发明人： Naoji Kashima ,  Tomonori Watanabe ,  Shigeo Nagaya ,  Kunihiro Shima ,  Shuichi Kubota

    IPC分类号： B32B15/04 ,  B32B9/00 ,  C30B25/18 ,  B32B15/01 ,  H01L39/24 ,  H01L39/12

    CPC分类号： B32B15/01 ,  B32B15/04 ,  C30B25/18 ,  H01L39/125 ,  H01L39/2454 ,  H01L39/2461 ,  Y10T428/1259

    摘要： The present invention relates to a textured substrate for epitaxial film formation, comprising a textured metal layer at least on one side, wherein the textured metal layer includes a copper layer having a cube texture and a nickel layer having a thickness of 100 to 20000 nm formed on the copper layer; the nickel layer has a nickel oxide layer formed on a surface thereof, having a thickness of 1 to 30 nm, and including a nickel oxide; and the nickel layer further includes a palladium-containing region formed of palladium-containing nickel at an interface with the nickel oxide layer. The top layer of the textured substrate, i.e. the nickel oxide layer, has a surface roughness of preferably 10 nm or less.

    摘要翻译： 本发明涉及一种用于外延膜形成的织构化衬底，其至少在一侧包括有纹理的金属层，其中织构金属层包括具有立体结构的铜层和形成厚度为100至20000nm的镍层 在铜层上; 镍层在其表面上形成有氧化镍层，其厚度为1〜30nm，并且包含氧化镍; 并且镍层还包括在与氧化镍层的界面处由含钯的镍形成的含钯区域。 纹理化衬底的顶层即氧化镍层的表面粗糙度优选为10nm以下。

    METHOD FOR PRODUCING SUBSTRATES FOR SUPERCONDUCTING LAYERS
    6.
    发明申请
    METHOD FOR PRODUCING SUBSTRATES FOR SUPERCONDUCTING LAYERS 审中-公开
    用于生产超级层的基板的方法

    公开(公告)号：US20150087524A1

    公开(公告)日：2015-03-26

    申请号：US14402802

    申请日：2013-05-17

    申请人： Danmarks Tekniske Universitet

    发明人： Anders Christian Wulff

    IPC分类号： H01L39/24 ,  H05K1/09

    CPC分类号： H01L39/2454 ,  H01L39/143 ,  H01L39/248 ,  H05K1/092 ,  Y10T29/49014

    摘要： There is provided a method for producing a substrate (600) suitable for supporting an elongated superconducting element, wherein, e.g., a deformation process is utilized in order to form disruptive strips in a layered solid element, and where etching is used to form undercut volumes (330, 332) between an upper layer (316) and a lower layer (303) of the layered solid element. Such relatively simple steps enable providing a substrate which may be turned into a superconducting structure, such as a superconducting tape, having reduced AC losses, since the undercut volumes (330, 332) may be useful for separating layers of material. In a further embodiment, there is placed a superconducting layer on top of the upper layer (316) and/or lower layer (303), so as to provide a superconducting structure with reduced AC losses.

    摘要翻译： 提供了一种用于制造适合于支撑细长超导元件的基底（600）的方法，其中例如使用变形过程以在层状固体元件中形成破坏性条带，并且其中使用蚀刻形成底切体积 （330,332）在层状固体元件的上层（316）和下层（303）之间。 这种相对简单的步骤使得能够提供可以变成具有减小的AC损耗的超导结构（例如超导带）的衬底，因为底切体积（330,332）可用于分离材料层。 在另一个实施例中，在上层（316）和/或下层（303）的顶部设置超导层，以便提供具有减小的AC损耗的超导结构。

    High-temperature superconducting tape
    8.
    发明授权
    High-temperature superconducting tape 有权
    高温超导胶带

    公开(公告)号：US08633137B2

    公开(公告)日：2014-01-21

    申请号：US13226678

    申请日：2011-09-07

    申请人： Hong Soo Ha ,  Sang Soo Oh ,  Ho Sup Kim

    发明人： Hong Soo Ha ,  Sang Soo Oh ,  Ho Sup Kim

    IPC分类号： H01L39/24 ,  H01B12/00

    CPC分类号： H01L39/2461 ,  H01L39/2454

    摘要： Disclosed herein is a high-temperature superconducting tape, including: a substrate; a buffer layer formed on the substrate; and a high-temperature superconducting layer formed on the buffer layer, wherein the substrate is made of SUS310s or stainless steel containing 0.01-1% of silicon (Si) and 1-5% of molybdenum (Mo) and has an average metal crystal grain size of 12 μm or less, and the high-temperature superconducting layer is made of a ReBCO (ReBa2Cu3O7, Re=Nd, Sm, Eu, Gd, Dy, Ho, Y)-based superconductive material. The high-temperature superconducting tape is advantageous with the result that a high-grade superconducting layer can be deposited on the thin buffer layer and thus the critical current density of the high-temperature superconducting tape can be improved, thereby remarkably improving the characteristics of the high-temperature superconducting tape.

    摘要翻译： 本文公开了一种高温超导带，包括：基板; 形成在所述基板上的缓冲层; 以及形成在缓冲层上的高温超导层，其中所述基板由含有0.01-1％的硅（Si）和1-5％的钼（Mo）的SUS310或不锈钢制成，并且具有平均金属晶粒 尺寸为12μm以下，高温超导层由ReBCO（ReBa2Cu3O7，Re = Nd，Sm，Eu，Gd，Dy，Ho，Y）的超导材料制成。 高温超导带是有利的，结果是可以在薄缓冲层上沉积高级超导层，从而可以提高高温超导带的临界电流密度，从而显着提高了高温超导带的特性 高温超导胶带。

    Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same
    9.
    发明授权
    Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same 有权
    用于在其上形成外延薄膜的带纹理金属基底及其制造方法

    公开(公告)号：US08147984B2

    公开(公告)日：2012-04-03

    申请号：US12101228

    申请日：2008-04-11

    申请人： Naoji Kashima ,  Shigeo Nagaya ,  Kunihiro Shima ,  Hirofumi Hoshino

    发明人： Naoji Kashima ,  Shigeo Nagaya ,  Kunihiro Shima ,  Hirofumi Hoshino

    IPC分类号： B32B15/04 ,  B32B15/18 ,  B32B37/00 ,  C22F1/10 ,  C09J5/02

    CPC分类号： C30B29/02 ,  B32B15/01 ,  B32B15/015 ,  C21D8/1277 ,  C23C26/00 ,  H01F41/32 ,  H01L39/2454 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/31678

    摘要： The present invention provides an oriented substrate for forming an epitaxial thin film thereon, which has a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. A clad textured metal substrate for forming the epitaxial thin film thereon according to the present invention comprises a metallic layer and a nickel layer which is bonded to at least one face of the metallic layer, wherein the nickel layer has a {100} cube texture in which a deviating angle Δφ of crystal axes satisfies Δφ≦7 degrees and has a nickel purity of 99.9% or more. The oriented metal substrate is manufactured by cold-working the nickel sheet having a purity of 99.9% or more, heat-treating it for orientation, and bonding the metal sheet with the oriented nickel sheet by using a surface activated bonding process.

    摘要翻译： 本发明提供了一种用于在其上形成外延薄膜的取向基板，其具有比常规的更高的取向性和高强度的取向基板及其制造方法。 根据本发明的用于在其上形成外延薄膜的复合纹理金属基底包括金属层和镍层，其结合到金属层的至少一个面上，其中镍层具有{100} <001> 倾斜角＆Dgr;＆phgr; 的晶轴满足＆Dgr＆amp;＆nlE; 7度，镍纯度为99.9％以上。 定向金属基板通过对纯度为99.9％以上的镍片进行冷加工，将其热处理以进行取向，并通过表面活性接合法将金属板与取向镍片接合来制造。