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公开(公告)号:US20100124795A1
公开(公告)日:2010-05-20
申请号:US12619776
申请日:2009-11-17
申请人: Shingo Eguchi , Yoshiaki Oikawa , Masahiro Katayama , Ami Nakamura , Yohei Monma
发明人: Shingo Eguchi , Yoshiaki Oikawa , Masahiro Katayama , Ami Nakamura , Yohei Monma
IPC分类号: H01L21/28 , H01L21/20 , H01L21/306
CPC分类号: H01L27/1266 , H01L21/32134 , H01L27/1214
摘要: It is an object of one embodiment of the preset invention to conduct separation without damaging a semiconductor element when the semiconductor element is made flexible. Further, it is another object of one embodiment of the preset invention to provide a technique for weakening adhesion between a separation layer and a buffer layer. Furthermore, it is another object of one embodiment of the preset invention to provide a technique for preventing generation of the bending stress on a semiconductor element due to separation. A semiconductor element formed over a separation layer with a buffer layer interposed therebetween is separated by dissolving the separation layer by using an etchant. Alternatively, separation is conducted by inserting a film into a region where a separation layer is dissolved by being in contact with an etchant and moving the film in a direction toward a region where the separation layer is not dissolved.
摘要翻译: 本发明的一个实施例的目的是当半导体元件变得柔性时进行分离而不损坏半导体元件。 此外,本发明的一个实施方案的另一个目的是提供一种削弱分离层和缓冲层之间粘附性的技术。 此外,本发明的一个实施例的另一个目的是提供一种用于防止由于分离而在半导体元件上产生弯曲应力的技术。 通过使用蚀刻剂溶解分离层来分离形成在分离层上的缓冲层之间的半导体元件。 或者,通过与蚀刻剂接触并将膜沿朝向分离层不溶解的区域的方向移动而将膜插入到分离层溶解的区域中进行分离。
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公开(公告)号:US08058083B2
公开(公告)日:2011-11-15
申请号:US12619776
申请日:2009-11-17
申请人: Shingo Eguchi , Yoshiaki Oikawa , Masahiro Katayama , Ami Nakamura , Yohei Monma
发明人: Shingo Eguchi , Yoshiaki Oikawa , Masahiro Katayama , Ami Nakamura , Yohei Monma
IPC分类号: H01L21/00
CPC分类号: H01L27/1266 , H01L21/32134 , H01L27/1214
摘要: It is an object of one embodiment of the preset invention to conduct separation without damaging a semiconductor element when the semiconductor element is made flexible. Further, it is another object of one embodiment of the preset invention to provide a technique for weakening adhesion between a separation layer and a buffer layer. Furthermore, it is another object of one embodiment of the preset invention to provide a technique for preventing generation of the bending stress on a semiconductor element due to separation. A semiconductor element formed over a separation layer with a buffer layer interposed therebetween is separated by dissolving the separation layer by using an etchant. Alternatively, separation is conducted by inserting a film into a region where a separation layer is dissolved by being in contact with an etchant and moving the film in a direction toward a region where the separation layer is not dissolved.
摘要翻译: 本发明的一个实施例的目的是当半导体元件变得柔性时进行分离而不损坏半导体元件。 此外,本发明的一个实施方案的另一个目的是提供一种削弱分离层和缓冲层之间粘附性的技术。 此外,本发明的一个实施例的另一个目的是提供一种用于防止由于分离而在半导体元件上产生弯曲应力的技术。 通过使用蚀刻剂溶解分离层来分离形成在分离层上的缓冲层之间的半导体元件。 或者,通过与蚀刻剂接触并将膜沿朝向分离层不溶解的区域的方向移动而将膜插入到分离层溶解的区域中进行分离。
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公开(公告)号:US08766269B2
公开(公告)日:2014-07-01
申请号:US12824795
申请日:2010-06-28
申请人: Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
发明人: Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
IPC分类号: H01L27/14 , H01L29/04 , H01L29/15 , H01L31/036
CPC分类号: H01L51/5246 , H01L27/14609 , H01L27/1463 , H01L27/14689 , H01L27/322 , H01L27/3244 , H01L27/3276 , H01L33/08 , H01L33/48 , H01L51/5243 , H01L51/5253 , H01L51/5278 , H01L2227/323 , H01L2251/5338 , H01L2251/5361 , H05B33/04 , H05B33/10 , H05B33/22
摘要: It is an object to provide a flexible light-emitting device with high reliability in a simple way. Further, it is an object to provide an electronic device or a lighting device each mounted with the light-emitting device. A light-emitting device with high reliability can be obtained with the use of a light-emitting device having the following structure: an element portion including a light-emitting element is interposed between a substrate having flexibility and a light-transmitting property with respect to visible light and a metal substrate; and insulating layers provided over and under the element portion are in contact with each other in the outer periphery of the element portion to seal the element portion. Further, by mounting an electronic device or a lighting device with a light-emitting device having such a structure, an electronic device or a lighting device with high reliability can be obtained.
摘要翻译: 本发明的目的是以简单的方式提供具有高可靠性的柔性发光装置。 此外,其目的是提供一种每个安装有发光装置的电子装置或照明装置。 通过使用具有以下结构的发光装置,可以获得高可靠性的发光装置:包括发光元件的元件部分介于具有柔性的基板和相对于 可见光和金属基板; 并且设置在元件部分之上和之下的绝缘层在元件部分的外周彼此接触以密封元件部分。 此外,通过使用具有这种结构的发光装置安装电子装置或照明装置,可以获得具有高可靠性的电子装置或照明装置。
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公开(公告)号:US08643020B2
公开(公告)日:2014-02-04
申请号:US12824795
申请日:2010-06-28
申请人: Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
发明人: Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
IPC分类号: H01L27/14 , H01L29/04 , H01L29/15 , H01L31/036
摘要: It is an object to provide a flexible light-emitting device with high reliability in a simple way. Further, it is an object to provide an electronic device or a lighting device each mounted with the light-emitting device. A light-emitting device with high reliability can be obtained with the use of a light-emitting device having the following structure: an element portion including a light-emitting element is interposed between a substrate having flexibility and a light-transmitting property with respect to visible light and a metal substrate; and insulating layers provided over and under the element portion are in contact with each other in the outer periphery of the element portion to seal the element portion. Further, by mounting an electronic device or a lighting device with a light-emitting device having such a structure, an electronic device or a lighting device with high reliability can be obtained.
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公开(公告)号:US09929220B2
公开(公告)日:2018-03-27
申请号:US12651734
申请日:2010-01-04
申请人: Shunpei Yamazaki , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura , Satoshi Seo , Kaoru Hatano
发明人: Shunpei Yamazaki , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura , Satoshi Seo , Kaoru Hatano
IPC分类号: H01L27/32 , H05B33/02 , H05B33/04 , H05B33/12 , H01L27/12 , H01L29/786 , H01L51/00 , H01L51/52
CPC分类号: H01L27/3246 , H01L27/1214 , H01L27/1218 , H01L27/1266 , H01L29/7869 , H01L51/003 , H01L51/52 , H01L51/524 , H01L51/5253 , H01L2251/5338 , H05B33/02 , H05B33/04 , H05B33/12
摘要: Thinned and highly reliable light emitting elements are provided. Further, light emitting devices in which light emitting elements are formed over flexible substrates are manufactured with high yield. One light emitting device includes a flexible substrate, a light emitting element formed over the flexible substrate, and a resin film covering the light emitting element, and in the light emitting element, an insulating layer serving as a partition has a convex portion and the convex portion is embedded in the resin film, that is, the resin film covers an entire surface of the insulating layer and an entire surface of the second electrode, whereby the light emitting element can be thinned and highly reliable. In addition, a light emitting device can be manufactured with high yield in a manufacturing process thereof.
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公开(公告)号:US20110001146A1
公开(公告)日:2011-01-06
申请号:US12824795
申请日:2010-06-28
申请人: Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
发明人: Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
IPC分类号: H01L33/00
CPC分类号: H01L51/5246 , H01L27/14609 , H01L27/1463 , H01L27/14689 , H01L27/322 , H01L27/3244 , H01L27/3276 , H01L33/08 , H01L33/48 , H01L51/5243 , H01L51/5253 , H01L51/5278 , H01L2227/323 , H01L2251/5338 , H01L2251/5361 , H05B33/04 , H05B33/10 , H05B33/22
摘要: It is an object to provide a flexible light-emitting device with high reliability in a simple way. Further, it is an object to provide an electronic device or a lighting device each mounted with the light-emitting device. A light-emitting device with high reliability can be obtained with the use of a light-emitting device having the following structure: an element portion including a light-emitting element is interposed between a substrate having flexibility and a light-transmitting property with respect to visible light and a metal substrate; and insulating layers provided over and under the element portion are in contact with each other in the outer periphery of the element portion to seal the element portion. Further, by mounting an electronic device or a lighting device with a light-emitting device having such a structure, an electronic device or a lighting device with high reliability can be obtained.
摘要翻译: 本发明的目的是以简单的方式提供高可靠性的柔性发光装置。 此外,其目的是提供一种每个安装有发光装置的电子装置或照明装置。 通过使用具有以下结构的发光装置,可以获得高可靠性的发光装置:包括发光元件的元件部分介于具有柔性的基板和相对于 可见光和金属基板; 并且设置在元件部分之上和之下的绝缘层在元件部分的外周彼此接触以密封元件部分。 此外,通过使用具有这种结构的发光装置安装电子装置或照明装置,可以获得具有高可靠性的电子装置或照明装置。
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公开(公告)号:US08698172B2
公开(公告)日:2014-04-15
申请号:US12651734
申请日:2010-01-04
申请人: Shunpei Yamazaki , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura , Satoshi Seo , Kaoru Hatano
发明人: Shunpei Yamazaki , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura , Satoshi Seo , Kaoru Hatano
IPC分类号: H01L33/00
摘要: Thinned and highly reliable light emitting elements are provided. Further, light emitting devices in which light emitting elements are formed over flexible substrates are manufactured with high yield. One light emitting device includes a flexible substrate, a light emitting element formed over the flexible substrate, and a resin film covering the light emitting element, and in the light emitting element, an insulating layer serving as a partition has a convex portion and the convex portion is embedded in the resin film, that is, the resin film covers an entire surface of the insulating layer and an entire surface of the second electrode, whereby the light emitting element can be thinned and highly reliable. In addition, a light emitting device can be manufactured with high yield in a manufacturing process thereof.
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公开(公告)号:US20100171138A1
公开(公告)日:2010-07-08
申请号:US12651734
申请日:2010-01-04
申请人: Shunpei Yamazaki , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura , Satoshi Seo , Kaoru Hatano
发明人: Shunpei Yamazaki , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura , Satoshi Seo , Kaoru Hatano
IPC分类号: H01L33/00
CPC分类号: H01L27/3246 , H01L27/1214 , H01L27/1218 , H01L27/1266 , H01L29/7869 , H01L51/003 , H01L51/52 , H01L51/524 , H01L51/5253 , H01L2251/5338 , H05B33/02 , H05B33/04 , H05B33/12
摘要: Thinned and highly reliable light emitting elements are provided. Further, light emitting devices in which light emitting elements are formed over flexible substrates are manufactured with high yield. One light emitting device includes a flexible substrate, a light emitting element formed over the flexible substrate, and a resin film covering the light emitting element, and in the light emitting element, an insulating layer serving as a partition has a convex portion and the convex portion is embedded in the resin film, that is, the resin film covers an entire surface of the insulating layer and an entire surface of the second electrode, whereby the light emitting element can be thinned and highly reliable. In addition, a light emitting device can be manufactured with high yield in a manufacturing process thereof.
摘要翻译: 提供了薄且高度可靠的发光元件。 此外,以高产率制造在柔性基板上形成发光元件的发光器件。 一个发光装置包括柔性基板,形成在柔性基板上的发光元件和覆盖发光元件的树脂膜,在发光元件中,作为隔板的绝缘层具有凸部和凸部 部分被嵌入树脂膜中,即树脂膜覆盖绝缘层的整个表面和第二电极的整个表面,由此可以使发光元件变薄并且高度可靠。 此外,在其制造方法中可以以高产率制造发光器件。
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公开(公告)号:US20090017599A1
公开(公告)日:2009-01-15
申请号:US12232049
申请日:2008-09-10
申请人: Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
发明人: Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
IPC分类号: H01L21/30
CPC分类号: H01L21/67132 , H01L21/02244 , H01L21/02252 , H01L21/67092 , H01L21/707 , H01L27/1266
摘要: An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.
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公开(公告)号:US08137417B2
公开(公告)日:2012-03-20
申请号:US11902514
申请日:2007-09-21
申请人: Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
发明人: Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
IPC分类号: H01L21/304
CPC分类号: H01L27/1266 , B32B43/006 , G02F1/1303 , G02F1/13306 , G06K19/0772 , H01L21/67132 , H01L21/6835 , H01L27/1214 , H01L27/1218 , H01L27/156 , H01L31/1892 , H01L31/206 , H01L33/005 , H01L51/003 , H01L51/0097 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68386 , H01L2221/68395 , H01L2227/326 , H01L2251/5338 , H01L2924/19041 , H01L2924/30105 , Y10T29/41
摘要: An object is to eliminate electric discharge due to static electricity generated by peeling when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element. A substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers. The film is bent along a curved surface of the pressurization roller on a side of the pressurization rollers, where the film is collected, and accordingly, peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid such as pure water is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.
摘要翻译: 目的在于,当从用于制造半导体元件的基板剥离包含半导体元件的元件形成层时,由于剥离产生的静电而消除放电。 形成元件形成层和剥离层的基板,并且使膜通过加压辊之间的间隙。 膜附着在加压辊之间的元件形成层。 该薄膜沿加压辊的弯曲表面在加压辊的一侧弯曲,其中薄膜被收集,因此在元件形成层和剥离层之间产生剥离,并且元件形成层转移到 电影。 液体如纯水通过喷嘴依次供给到通过剥离产生的元件形成层和剥离层之间的间隙,使得在元件形成层和剥离层的表面上产生的电荷被 液体。
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