METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    1.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20110008931A1

    公开(公告)日:2011-01-13

    申请号:US12832329

    申请日:2010-07-08

    IPC分类号: H01L21/36

    摘要: A highly reliable semiconductor device which includes a thin film transistor having stable electric characteristics, and a manufacturing method thereof. In the manufacturing method of the semiconductor device which includes a thin film transistor where a semiconductor layer including a channel formation region is an oxide semiconductor layer, heat treatment which reduces impurities such as moisture to improve the purity of the oxide semiconductor layer and oxidize the oxide semiconductor layer (heat treatment for dehydration or dehydrogenation) is performed. Not only impurities such as moisture in the oxide semiconductor layer but also those existing in a gate insulating layer are reduced, and impurities such as moisture existing in interfaces between the oxide semiconductor layer and films provided over and under and in contact with the oxide semiconductor layer are reduced.

    摘要翻译: 一种高度可靠的半导体器件及其制造方法,其包括具有稳定电特性的薄膜晶体管。 在包括具有沟道形成区域的半导体层是氧化物半导体层的薄膜晶体管的半导体器件的制造方法中,减少诸如水分的杂质的热处理以提高氧化物半导体层的纯度并氧化氧化物 进行半导体层(脱水或脱氢的热处理)。 氧化物半导体层中的水分等杂质,以及存在于栅极绝缘层中的杂质都会降低,氧化物半导体层和氧化物半导体层之间的界面中存在的杂质如氧化物半导体层和与氧化物半导体层接触的薄膜 减少了

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20110084271A1

    公开(公告)日:2011-04-14

    申请号:US12899962

    申请日:2010-10-07

    IPC分类号: H01L29/12 H01L33/08 B82Y99/00

    摘要: Disclosed is a highly reliable semiconductor device and a manufacturing method thereof, which is achieved by using a transistor with favorable electrical characteristics and high reliability as a switching element. The semiconductor device includes a driver circuit portion and a pixel portion over one substrate, and the pixel portion comprises a light-transmitting bottom-gate transistor. The light-transmitting bottom-gate transistor comprises: a transparent gate electrode layer; an oxide semiconductor layer over the gate electrode layer, a superficial layer of the oxide semiconductor layer including comprising a microcrystal group of nanocrystals; and source and drain electrode layers formed over the oxide semiconductor layer, the source and drain electrode layers comprising a light-transmitting oxide conductive layer.

    摘要翻译: 公开了一种高可靠性的半导体器件及其制造方法,其通过使用具有良好的电特性和高可靠性的晶体管作为开关元件来实现。 半导体器件包括驱动电路部分和一个衬底上的像素部分,并且像素部分包括透光底栅晶体管。 透光底栅晶体管包括:透明栅极电极层; 在所述栅极电极层上的氧化物半导体层,所述氧化物半导体层的表面层包括微晶纳米晶体组; 以及形成在所述氧化物半导体层上的源极和漏极电极层,所述源极和漏极电极层包括透光氧化物导电层。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20110284839A1

    公开(公告)日:2011-11-24

    申请号:US13107283

    申请日:2011-05-13

    IPC分类号: H01L29/04 H01L21/20

    摘要: It is an object to provide a semiconductor device including an oxide semiconductor, which has stable electric characteristics and high reliability. An oxide semiconductor film serving as a channel formation region of a transistor is formed by a sputtering method at a temperature higher than 200° C., so that the number of water molecules eliminated from the oxide semiconductor film can be 0.5/nm3 or less according to thermal desorption spectroscopy. A substance including a hydrogen atom such as hydrogen, water, a hydroxyl group, or hydride which causes variation in the electric characteristics of a transistor including an oxide semiconductor is prevented from entering the oxide semiconductor film, whereby the oxide semiconductor film can be highly purified and made to be an electrically i-type (intrinsic) semiconductor.

    摘要翻译: 本发明的目的是提供一种具有稳定的电特性和高可靠性的氧化物半导体的半导体装置。 通过溅射法在高于200℃的温度下形成用作晶体管的沟道形成区的氧化物半导体膜,从氧化物半导体膜中除去的水分子数可以为0.5nm / nm 3以下 到热解吸光谱。 包含氢原子的物质,例如氢,水,羟基或氢化物,其导致包括氧化物半导体的晶体管的电特性发生变化,从而防止氧化物半导体膜进入氧化物半导体膜,由此氧化物半导体膜可以被高度纯化 并制成电i型(本征)半导体。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20120119212A1

    公开(公告)日:2012-05-17

    申请号:US13289436

    申请日:2011-11-04

    IPC分类号: H01L29/786 H01L21/336

    摘要: A semiconductor device is manufactured using a transistor in which an oxide semiconductor is included in a channel region and variation in electric characteristics due to a short-channel effect is less likely to be caused. The semiconductor device includes an oxide semiconductor film having a pair of oxynitride semiconductor regions including nitrogen and an oxide semiconductor region sandwiched between the pair of oxynitride semiconductor regions, a gate insulating film, and a gate electrode provided over the oxide semiconductor region with the gate insulating film positioned therebetween. Here, the pair of oxynitride semiconductor regions serves as a source region and a drain region of the transistor, and the oxide semiconductor region serves as the channel region of the transistor.

    摘要翻译: 使用其中氧化物半导体包括在沟道区域中的晶体管制造半导体器件,并且不太可能引起由于短沟道效应引起的电特性的变化。 半导体器件包括具有一对氧氮化物半导体区域的氧化物半导体膜,该氧氮化物半导体区域包括氮和夹在一对氧氮化物半导体区域之间的氧化物半导体区域,栅极绝缘膜和设置在氧化物半导体区域上的栅电极,栅极绝缘 胶片位于其间。 这里,一对氧氮化物半导体区域用作晶体管的源极区域和漏极区域,氧化物半导体区域用作晶体管的沟道区域。

    SEMICONDUCTOR DEVICE
    6.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20120193628A1

    公开(公告)日:2012-08-02

    申请号:US13353608

    申请日:2012-01-19

    IPC分类号: H01L29/786

    摘要: A highly reliable semiconductor device is manufactured by giving stable electric characteristics to a transistor in which an oxide semiconductor film is used. A p-type oxide semiconductor material is contained in an n-type oxide semiconductor film, whereby carriers which are generated in the oxide semiconductor film without intention can be reduced. This is because electrons generated in the n-type oxide semiconductor film without intention are recombined with holes generated in the p-type oxide semiconductor material to disappear. Accordingly, it is possible to reduce carriers which are generated in the oxide semiconductor film without intention.

    摘要翻译: 通过对使用氧化物半导体膜的晶体管赋予稳定的电特性来制造高可靠性的半导体器件。 p型氧化物半导体材料包含在n型氧化物半导体膜中,由此可以减少在氧化物半导体膜中产生的载流子。 这是因为在n型氧化物半导体膜中产生的电子没有意图与在p型氧化物半导体材料中产生的空穴重新组合而消失。 因此,可以无意地减少在氧化物半导体膜中产生的载流子。

    SEMICONDUCTOR DEVICE
    7.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号:US20110284847A1

    公开(公告)日:2011-11-24

    申请号:US13110245

    申请日:2011-05-18

    IPC分类号: H01L29/786

    摘要: Disclosed is a semiconductor device with a transistor in which an oxide semiconductor is used. An insulating layer on a back channel side of the oxide semiconductor layer has capacitance of lower than or equal to 1.5×10−10 F/m2. For example, in the case of a top-gate transistor, a base insulating layer has capacitance of lower than or equal to 1.5×10−10 F/m2, whereby the adverse effect of an interface state between the substrate and the base insulating layer can be reduced. Thus, a semiconductor device where fluctuation in electrical characteristics is small and reliability is high can be manufactured.

    摘要翻译: 公开了具有使用氧化物半导体的晶体管的半导体器件。 氧化物半导体层的背面通道侧的绝缘层的电容为小于或等于1.5×10 -10 F / m 2。 例如,在顶栅晶体管的情况下,基极绝缘层具有小于或等于1.5×10 -10 F / m 2的电容,由此衬底和基底绝缘层之间的界面态的不利影响 可以减少 因此,可以制造电特性波动小,可靠性高的半导体装置。

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    8.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
    半导体器件的制造方法

    公开(公告)号:US20120040495A1

    公开(公告)日:2012-02-16

    申请号:US13197825

    申请日:2011-08-04

    IPC分类号: H01L21/385

    摘要: A transistor with superior electric characteristics is manufactured. An oxide insulating film is formed over a substrate, an oxide semiconductor film is formed over the oxide insulating film, heat treatment is then conducted at a temperature at which hydrogen contained in the oxide semiconductor film is desorbed and part of oxygen contained in the oxide insulating film is desorbed, then the heated oxide semiconductor film is etched into a predetermined shape to form an island-shaped oxide semiconductor film, a pair of electrodes is formed over the island-shaped oxide semiconductor film, a gate insulating film is formed over the pair of electrodes and the island-shaped oxide semiconductor film, and a gate electrode is formed over the gate insulating film.

    摘要翻译: 制造出具有优异电特性的晶体管。 在衬底上形成氧化物绝缘膜,在氧化物绝缘膜上形成氧化物半导体膜,然后在氧化物半导体膜中所含的氢被解吸的温度和氧化物绝缘中包含的部分氧进行热处理 膜被解吸,然后将加热的氧化物半导体膜蚀刻成预定形状以形成岛状氧化物半导体膜,在岛状氧化物半导体膜上形成一对电极,在该对上形成栅极绝缘膜 的电极和岛状氧化物半导体膜,并且栅极电极形成在栅极绝缘膜上。

    SEMICONDUCTOR DEVICE
    9.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20110284845A1

    公开(公告)日:2011-11-24

    申请号:US13110240

    申请日:2011-05-18

    摘要: An insulating layer containing a silicon peroxide radical is used as an insulating layer in contact with an oxide semiconductor layer for forming a channel. Oxygen is released from the insulating layer, whereby oxygen deficiency in the oxide semiconductor layer and an interface state between the insulating layer and the oxide semiconductor layer can be reduced. Accordingly, a semiconductor device where reliability is high and variation in electric characteristics is small can be manufactured.

    摘要翻译: 使用含有硅氧化物自由基的绝缘层作为与用于形成沟道的氧化物半导体层接触的绝缘层。 氧从绝缘层释放,由此可以减少氧化物半导体层中的氧缺乏和绝缘层与氧化物半导体层之间的界面状态。 因此,可以制造可靠性高,电特性变化小的半导体装置。

    SEMICONDUCTOR DEVICE
    10.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20110284844A1

    公开(公告)日:2011-11-24

    申请号:US13110236

    申请日:2011-05-18

    IPC分类号: H01L29/786 H01L21/336

    摘要: An object of the present invention is to manufacture a semiconductor device where fluctuation in electrical characteristics is small and reliability is high in a transistor in which an oxide semiconductor is used. An insulating layer from which oxygen is released by heating is used as a base insulating layer of an oxide semiconductor layer which forms a channel. Oxygen is released from the base insulating layer, whereby oxygen deficiency in the oxide semiconductor layer and an interface state between the base insulating layer and the oxide semiconductor layer can be reduced. Thus, a semiconductor device where fluctuation in electrical characteristics is small and reliability is high can be manufactured.

    摘要翻译: 本发明的目的是制造其中使用氧化物半导体的晶体管的电特性波动小并且可靠性高的半导体器件。 使用通过加热而释放氧的绝缘层作为形成沟道的氧化物半导体层的基极绝缘层。 氧从基底绝缘层释放出来,由此可以减少氧化物半导体层的缺氧和基底绝缘层与氧化物半导体层之间的界面状态。 因此,可以制造电特性波动小,可靠性高的半导体装置。